SEMI Members Only: European 3D TSV Summit 2015 Presentations for Download

SEMI Member Only: European 3D TSV Summit 2015      

This event was held January 19-21, 2015 at the  MINATEC innovation campus in Grenoble, France.

Presentations available for download are for SEMI Members. SEMI Membership is required to access these SEMI Member Only documents. If your company is a SEMI member, but you do not have a profile create one now. Be sure to use your company e-mail when you create or update your profile. SEMI recognizes your membership status using your company email address.

 Download available presentations from the European 3D TSV Summit 2015.

			The Future of Packaging and Test: Convergence or Coexistence? Barnett Silver, SVP & Principal ATREG
			High Performance Interposer for Networking Processors Georg Kimmich, Director Silicon Packaging R&D STMicroelectronics
			Hybrid Electronic-Photonic Integration: Results and Opportunities Marco Fiorentino, Resercher HP Labs