Understanding Eurozone Crisis with Lessons from Japan
Richard Koo, Chief Economist, Nomura Research
The seemingly intractable economic problems in the Eurozone are actually easy to understand once the Japanese experience of the last two decades are properly understood. But unlike the US policy makers who realized the importance of the Japanese lesson and managed to produce economic recovery, European policy makers ignored those lessons and ended up repeating the Japanese mistake. Because the type of recession US, Japan and Europe are going through, where the private sector is no longer maximizing profits but are actually minimizing debt following the bursting of the bubble, has never been discussed in traditional economics, experts as well as ordinary people at all levels are rightfully confused. But once the key driver of this recession is understood, it should become clear that two relatively minor changes to the structure of Euro should make the currency fully functional in par with other major currencies without the kind of problems it encountered during the last five years.
Richard C. Koo is the Chief Economist of Nomura Research Institute with responsibilities to provide independent economic and market analysis to Nomura Securities, the leading securities house in Japan, and its clients. Consistently voted as one of the most reliable economists by Japanese capital and financial market participants for over a decade, he has also advised successive prime ministers on how best to deal with Japan's economic and banking problems. He was also the only non-Japanese member of the Defense Strategy Study Conference of the Japan Ministry of Defense for 2000-2010. Currently he is serving as a Senior Advisor to Center for Strategic and International Studies (Washington D.C.). He is also an Advisory Board Member of Institute for New Economic Thinking (N.Y.C.), and a regular contributor to Economics by Invitation, The Economist (http://www.economist.com/economics).
Prior to joining Nomura, he was an economist with the Federal Reserve Bank of New York, and was a Doctoral Fellow of the Board of Governors of the Federal Reserve System. Author of many books and a former visiting professor of Waseda University for over 10 years, he was awarded the Abramson Award by the National Association of Business Economics (Washington D.C.) for 2001. His latest book “The Holy Grail of Macroeconomics - Lessons from Japan’s Great Recession” (John Wiley & Sons, 2008) has been translated into and sold in four different languages.
Semiconductor and Semiconductor equipment market from the investment banking and capital markets perspective
Matthew Gehl, Director Technology Banking, Deutsche Bank
Matt leads DB’s coverage of the Technology space across the EMEA region and is based in London nHe has a total of 15 years experience in investment banking, 13 within the technology sector.
Matt joined Deutsche Bank from Arma Partners, a leading TMT M&A boutique where he headed the firm's semiconductor/SPE, communications equipment, mobile and internet infrastructure groups. Before Arma Matt spent 7 years at Goldman Sachs where he was most recently their lead semiconductor and semiconductor equipment analyst in London. Matt also worked in the firm’s Frankfurt and New York offices. Matt's coverage universe as an analyst included Aixtron, ARM, ASMI, ASML, CSR, Dialog, Infineon, Philips, STMicroelectronics and Wolfson among others. During his time as a research analyst and banker Matt has worked on financing and M&A transactions for a range of Europe's leading technology companies including Infineon, NXP, STMicroelectronics, Alcatel-Lucent, Ericsson, Nokia, Amadeus, SAP, CSR, and Pace among others. Matt holds a dual MBA from Columbia Business School and London Business School and a BBA from the University of Wisconsin.
Secure Connections for a Smarter World – Driving change in Automotive Innovation
Kurt Sievers, Executive Vice President and General Manager Automotive Business, NXP
Progress in semiconductors is – and continues to be – driven by sharp customer and application focus, by relentless innovation, and by fierce competition. These three characteristics have helped to increase the use of semiconductors in a fast growing range of applications, which is set to continue in the years to come. Semiconductors are helping to solve grand global challenges such as resource conservation, security, mobility, the internet of things, smart cities and health care, thus enabling entirely new economic growth areas.
Likewise, the European semiconductor industry is key to solving several of Europe’s societal challenges; its products and innovation are essential in all market segments where Europe is a recognized global leader, with the rapidly evolving automotive industry being a prime example. The modern car at its core is already an incredibly complex interconnected system. The adoption of new technologies is transforming the car from a simple mode of transport to a personalized mobile information hub.
In his keynote speech, Kurt Sievers, Executive Vice President and General Manager of Automotive at NXP, will outline his vision of the connected car – when secure interfaces connect vehicles to each other and the outside world, and allow us to personalize our driving experience; providing customized entertainment services; helping relieve traffic congestion, and making the overall driving experience more pleasurable and safer. Mr. Sievers will also elaborate on Europe, and the need for a further industrial drive for wealth creation and global competitiveness, prioritizing research, innovation and design, to spur high-quality employment.
Kurt Sievers is executive vice president and general manager of the Automotive business unit at NXP Semiconductors. He is a member of NXP’s Executive Management Team reporting to President and CEO Rick Clemmer.
Mr. Sievers is active in a number of national and international industry associations. He is currently chairman of the “Electronic Components and Systems” division at the German national electrical and electronics industry association, ZVEI. He also serves as a board member of AENEAS and CATRENE, the clusters for application and technology research in Europe on nano-electronics.
During his career with Philips (from 1995) and NXP (from 2006), Mr. Sievers
gained a proven track record in the development, marketing, sales and general management of semiconductor solutions, with experience across a number of market segments. He was appointed the GM of NXP’s Automotive BU in 2009.
Mr. Sievers holds a master degree in physics and information technology.
10/100/20 – how to make Europe’s industry more competitive?
Public policy is an important element of the strategic context in which the industry is operating: public policies, regulations and mechanisms in different parts of the world have a profound and pervasive impact, both positive and negative, on our industry. Industry advocacy is a key member service for SEMI, and we work with our members across the world to raise awareness among decision makers about the industry, influence government decisions and policies and help create a positive regulatory environment. In Europe, SEMI started advocating over 5 years ago for a strategic and coordinated EU approach that will help reinforce the global competitiveness of Europe’s semiconductor manufacturing supply chain. Today, the EU electronics strategy and governments’ support for large-scale investment in semiconductor manufacturing in Europe are testimony to the added value that coordinated industry advocacy can have for SEMI members.
Ourania Georgoutsakou, Director Public Policy, SEMI Europe
Ourania Georgoutsakou joined SEMI as
Director of Public Policy for Europe in October 2012, with the role of
liaising between SEMI members and European, national and regional
decision-makers to reinforce cooperation between industry and public
authorities in the interest of a globally competitive Europe
semiconductor value chain. She has 10 years of experience in European
policy-making processes and advocacy, gained as Senior Policy
Coordinator for the Assembly of European Regions (AER), the largest
independent network of regional politicians in Europe. She has worked on
such diverse policy areas as the EU institutional set-up and the Lisbon
Treaty, and EU health, social, innovation, competition and cohesion
policy. Ourania holds postgraduate degrees in EU Law and in EU
policy-making and lives with her family in Brussels.
Jonathan Davis,Global Vice President of Advocacy, SEMI
Jonathan Davis is a member of the Global Executive Team of SEMI. In his role as Global Vice President of Advocacy, he works to ensure SEMI member interests are represented on all global fronts. Since August 2010, Jonathan Davis has served as president of the Semiconductor IC Business Unit with global profit and loss responsibility for the business unit, including all SEMICON expositions, market research and statistics programs, SEMI International Standards, and Environmental Health and Safety (EHS). Prior to his current position, Davis served as president of the Semiconductor IC Business Unit and previously as as President of SEMI North America and Executive VP of Global Expositions, Communications, Marketing and EHS. Davis had responsibility for the association's global exposition operations, corporate marketing, creative services, communications and public relations, research and information products, and EHS.
Before joining SEMI, Davis worked for nine years at HNTB, a national architecture and engineering firm. He earned a 5-year architecture degree from the Kansas State University College of Architecture and Design and studied at the University of Missouri at Columbia School of Journalism. Davis is a member of the American Society of Association Executives and the Public Relations Society of America.
PANEL: Will Europe win with the EU10/100/20 Strategy?
Malcolm Penn, CEO, Future Horizons
Malcolm Penn is the Chairman, CEO, and founder of Future Horizons, Europe's leading semiconductor industry analyst. He is also the President of Future Horizons' Moscow-based subsidiary firm, East-West Electronics, the world’s top market research consultant on the Russian and East European electronics industry.
Established in April 1989, Future Horizons provides business support services for use in opportunity analysis, business planning and new market development in the semiconductor and related industries. Its areas of activity include market research reports, custom consulting, industry forums and seminars, IC and system design evaluation services, and industry training.
Mr. Penn has over 45 years experience in the electronics industry and for most of that time has worked extensively throughout Europe as well as in the United States, the former USSR, Japan and Korea. Future Horizons was also a member of the 1994 European Commission sponsored Cornu Panel of senior industry executives responsible for publishing the “Report of the European Microelectronics Panel” used to help formulate the strategy for EC microelectronics support in Europe.
Prior to establishing Future Horizons, Mr. Penn was Vice President of Dataquest and Director of Dataquest's European Operations, responsible for establishing all Dataquest's European-based research operations. Previously he was Manager of Component Engineering for ITT Europe (now Alcatel) and prior to that held various operations and marketing management positions with the worldwide ITT Semiconductor group.
Marcel Annegarn, Director General, AENEAS
Annegarn started his career at Philips in 1977 and spent around 25
years fostering Philips’ technological leadership in television as
scientist and later as head of the Television Development Department. In
2003 he joined Philips Semiconductors (now NXP), where until 2008 he
held several management functions.
In his capacity as General
Director of AENEAS, Marcel Annegarn manages and coordinates since 2008
activities for Europe’s Nanoelectronics Research and Development actors
as well as representing them in the ENIAC Joint Undertaking, a Public
Private Partnership contributing to the implementation of the European
Commission’s Seventh Framework program.
Joël Hartmann, Executive Vice-President, Manufacturing and Process R&D, Embedded Processing Solutions, STMicroelectronics
Joël Hartmann is Executive Vice President of STMicroelectronics,
Front-End Manufacturing and Technology R&D, Embedded Processing
Solutions (EPS). He has managed these responsibilities for ST’s digital
products since February 2012. Hartmann is also in charge of the
Company’s manufacturing operations in Crolles, France.
From 1979 to
2000, Hartmann worked at CEA-Leti, an applied-research center for
microelectronics, information and healthcare technologies in Grenoble,
France. In 2000, he joined STMicroelectronics as Director of the
Crolles2 Alliance, the large-scale semiconductor manufacturing R&D
initiative of STMicroelectronics, NXP and Freescale Semiconductor. In
2008, Hartmann was promoted to Group Vice President and Director of
Advanced CMOS Logic & Derivative Technologies. In 2010, he gained
additional responsibilities as a co-leader of the Semiconductor Research
and Development Center in Fishkill, NY, within the IBM ISDA Technology
Alliance for the development of advanced CMOS process.
on the Board of the SOI Industry Consortium Initiative and is a Member
of the IEEE Electron Device Society. He has filed 15 patents on
semiconductor technology and devices and authored 10 publications in
this field to date.
Joël Hartmann was born in Toulon, France, in
1955. He graduated from the Ecole Nationale Supérieure de Physique de
Grenoble (ENSPG) with a degree in Physics.
Bob Hollands, Director of Corporate Marketing, ASM
Bob Hollands is Director of
Technical Marketing for the Thermal Products Business Unit supporting the ALD,
Epitaxy and CVD Diffusion product lines.
He also serves as Director of Corporate Marketing, responsible for
strategic market analysis and marketing communications for the Front End
Operations of ASM International. Mr.
Hollands joined ASM in 2004 focusing on product marketing for the launch of ALD
technology for high-k metal gates. Prior
to joining ASM, he has held various senior marketing and product management
positions in the semiconductor equipment industry since 1990 at Novellus,
Speedfam-IPEC, Mattson, Steag AST and MRC. Mr. Hollands holds a BS in Electrical
Engineering from Cornell University and an MBA from NYU.
Richard Nikolaus Kuehnel, Head of Representation of the European Commission in Austria
Since September 2008
Head of Representation of the European Commission in Austria
Representing the Commission vis-à-vis the Austrian government, other state institutions and stakeholders, at national, regional and local levels; Member of the diplomatic corps and participating in EU HoM meetings; Providing political reports to headquarters and contributing to the European semester exercise; Supporting and accompanying visits of the President and Members of the Commission; Cooperating with EU related networks, MEPs and the EP Information Office and other EU bodies present in Vienna like the EU Delegation to UN and OSCE, the Fundamental Rights Agency and EIB; Communicating on all aspects of EU policies and organizing relevant events; Engaging in direct dialogue with citizens and delivering public speeches;Participating in political and academic debates und publishing articles on EU matters; Active media work, including giving regular TV, radio and press interviews; Social media activities like writing a blog and ensuring presence on facebook and twitter;Developing a country strategy for Austria and monitoring its implementation;Financial and human resources management and general coordination of Representation; Authorizing Officer by Sub-Delegation;Leading a team of some 25 staff in 4 sections (political, communication, press, administration).
European Commission, Wipplingerstrasse 35, A-1010 Vienna
November 2004 – August 2008
Member of Cabinet of the EU Commissioner for External Relations and European Neighbourhood Policy, Benita Ferrero-Waldner
Covering the following portfolio issues: Multilateral relations (UN, OSCE, Council of Europe) and G8; Human rights, democracy promotion and election observation;Public diplomacy, outreach and EU visibility.Non-portfolio issues: Lisbon treaty and related institutional issues. Education, culture, sport.Inter-institutional relations, particularly with the European Parliament, the Economic and Social Committee and the Committee of the Regions. Member of the cabinet-level Group for Inter-institutional relations (GRI).
European Commission, Rue de la Loi, 1049 Brussels
May - October 2004
Member of Cabinet of the Austrian Minister for Foreign Affairs, Ms Benita Ferrero-Waldner
Cabinet responsibility for Austrian ODA, Member of Board of the "Austrian Development Agency" (ADA)Coordination of Ministry positions within Federal Government and preparation of Council of Ministers. Relations with Austrian Parliament.
Austrian Federal Ministry for Foreign Affairs, Minoritenplatz 8, 1014 Wien
November 2003 - April 2004
Advisor to Director-General for Development Cooperation at Austrian Ministry for Foreign Affairs
General coordination and liaison to Cabinet; Coordination of Annual report on Austrian ODA;Member of Board of the "Austrian Development Agency" (ADA)
August 2000 - November 2003
Counsellor at Austrian Mission to the United Nations, New York Head of sector for human rights and human security; Austrian delegate to the Third Committee of the UNGA, the Human Rights Commission in Geneva, the World Conference against Racism in Durban; the UNGA Special Session on Children etc; Media relations (spokesperson of the Mission) and public diplomacy;New York Coordinator of the Human Security Network during Austrian chairmanship 2002 – 2003Permanent Mission of Austria to the United Nations, 823 UN Plaza, New York
April 1997 - August 2000
First Secretary at Austrian Embassy to Japan, TokyoHead of sector for macro-economic and financial market issues; During Austrian Presidency 1998: chairman of the EU Financial Counsellors Group Political reporting on Japanese political, diplomatic and economic developments as well as on relevant developments in the broader Asian context (financial crisis, ASEM, ASEAN, ARF, APEC etc); Team leader for the organisation of the State Visit of the Austrian Federal President to Japan.
Austrian Embassy in Japan, 1-1-20 Moto Azabu, Minato-ku, Tokyo
April 1996 - February 1997
Desk officer at Office of the Legal Advisor within Austrian Ministry for Foreign AffairsUnit for international law
September 1995 – March 1996 Attaché at Austrian Embassy to Croatia, ZagrebPolitical and humanitarian affairs
March 1995 – September 1995 Desk officer at Western Balkans desk within Austrian Ministry for Foreign Affairs(under Ambassador Albert Rohan)
September 1994 – February 1995
Office of the spokesman of the Austrian Minister for Foreign Affairs, Alois Mock
October 1993 – February 1994
European Parliament, BrusselsInternship at General Secretariat, Brussels, unit for Central and Eastern Europe
October 1987 – September 1988, and on a regular basis until 1995
Austrian Military, Officer training, and then Officer at militia forcesCommander of engineer platoon, military command Styria (last rank held: First Lieutenant)
Reinhard Ploss, CEO, Infineon
Reinhard Ploss joined Siemens/Infineon in 1986, working in Munich as a process engineer with focus on chip manufacturing.
1992 he moved on to Villach, Austria, where he started in chip
manufacturing and took over the position as Head of Technology in 1993.
He returned to Munich in 1996 and took charge of the Power Semiconductor
Business Unit, focusing on development and manufacturing. In 1999,
Reinhard Ploss was appointed Head of the Industrial Power Business Unit
as well as President of eupec GmbH Co. KG, a subsidiary of Infineon.
2000, Reinhard Ploss took over as President of the Automotive &
Industrial Business Group of Infineon. From 2005 on, he held
responsibility for manufacturing, development and operational management
in the Automotive, Industrial & Multimarket Business Group.
June 2007, Reinhard Ploss was appointed to the Management Board of
Infineon, with responsibilities for manufacturing activities. In
addition, he became Labor Director and Head of Research &
Development. He remains responsible for these three areas to the present
Since October 1, 2012, Dr. Reinhard Ploss is Chief Executive Officer of Infineon Technologies AG.
Rutger Wijburg, Senior VP and General Manager Fab Management, GLOBALFOUNDRIES
Dr. Rutger Wijburg is Senior Vice President and General Manager of GLOBALFOUNDRIES Fab 1 in Dresden, Germany, and Senior Vice President of Fab 8 in Malta, New York, USA.
He is responsible for GLOBALFOUNDRIES’ high-end 300mm manufacturing operations.
Prior to joining GLOBALFOUNDRIES in 2011, Rutger Wijburg was Senior Vice President and Operations Manager Front End at NXP Semiconductors (formerly Philips Semiconductors) in the Netherlands. In this role, he was responsible for the company’s seven wafer fabs, led outsourcing and building strategic partnerships, and was in charge of real estate and facilities management.
Rutger Wijburg has also held leadership positions with Mesa Research Institute in the Netherlands and CSEM SA in Switzerland.
He holds both a Master of Science degree and Ph.D. in Electrical Engineering from the University of Twente, the Netherlands.
Design Thinking – A Powerful Driver (not only) of IT-Innovations
Christoph Meinel, CEO and President, Hasso Plattner Institute
At the HPI d-schools in Stanford and Potsdam we teach a methodology for innovation that combines creative and analytical approaches, and requires collaboration across different disciplines. This process—which has been called design thinking – draws on methods from engineering and design, and combines them with ideas from the arts, tools from the social sciences, and insights from the business world. While in science and technology mostly technical feasibility is in the center, user needs, desirability, and viability are in the center of design thinking processes.
In the talk design thinking is introduced in more detail. Then at hand of the in-memory technology it is shown how design thinking can lead to new innovations in IT.
Christoph Meinel is full professor for computer science at HPI and the University of Potsdam, holding a chair in "Internet Technologies and -Systems".
His research focuses on Future Internet Technologies, in particular Internet and Information Security, Web 3.0, Semantic-, Social- and Service-Web, as well as on innovative Internet applications, especially in the domains of e-Learning and Telemedicine. Besides this, he is scientifically active in the field of Innovation Research and Design Thinking.
Christoph Meinel teaches Bachelor and Master courses in IT-Systems Engineering and at the HPI School of Design Thinking. He is a visiting professor at the Departments of Computer Sciences at Beijing University of Technology and at Shanghai University in China and is a senior research fellow at the Interdisciplinary Centre for Security, Reliability and Trust (SnT) at the University of Luxembourg.
Bridging the Digital Agenda
Aart de Geus, Chairman and co-Chief Executive Officer, Synopsys
The semiconductor industry is on the bridge to a new age of complexity. This “Age of Exponentials” is empowered by smaller dimensions, enormous IP reuse, and a focus on the great potential of electronic systems. It’s a technology-intense world where the design metrics of power, performance and area take on ever-increasing importance. On the economic front, our customers are facing uncertain markets where merely making a better version of their last product will not be sufficient. To survive and thrive in new and unknown markets, designers are accelerating both their innovation and their collaboration with their key partners in manufacturing, EDA, and IP. In that context, what “techonomic” trends will Europe need to consider as it moves forward with the “Digital Agenda” of owning 20% of global semi manufacturing by 2020?
Since co-founding Synopsys in 1986, Dr. Aart de Geus has expanded Synopsys from a start-up synthesis enterprise to the world leader in electronic design automation. Dr. de Geus has long been considered one of the world's leading experts on logic synthesis and simulation, and frequently keynotes major conferences in Electronics and Design Automation. He has been honored for his industry achievements with the 2001 IEEE Circuits and Systems Society Industrial Pioneer Award, the 2007 IEEE Robert N. Noyce Medal, the 2008 EDAC/CEDA Kaufman award, the 2009 GSA Morris Chang Exemplary Leadership Award, and the 2013 Silicon Valley Engineering Council Hall of Fame Award.
Dr. de Geus is active in the business community, serving on the Boards of the Silicon Valley Leadership Group (SVLG), Applied Materials, the Global Semiconductor Alliance (GSA), and the Electronic Design Automation Consortium (EDAC). He is the recipient of numerous business honors, including 2002 Electronic Business Magazine’s “CEO of the Year” and 2005 “Top 10 Most Influential Executives.” His community leadership was also formally recognized in 2007 when the Silicon Valley Leadership Group (SVLG) awarded him with their “Spirit of the Valley" Lifetime Achievement Award, and then again most recently with the 2011 David Packard Award, Joint Venture Silicon Valley’s highest honor for civic and community service.
He is also heavily involved in education for the next generation, having created the Synopsys Outreach Foundation in 1999, which promotes project-based science and math learning throughout Silicon Valley. The success of this long-term venture can be gauged by the realization that as of 2012, the Foundation has engaged more than one million students and teachers.
The Internet of Things is creating “New-Gold” for cities and citizens
Eric-Mark Huitema,Global Smarter Transportation Leader, IBM
if you don't leave your home, your life is still influenced by the
transportation industry: virtually every tangible good – food, clothing,
medicine, vehicles and computers – has been transported into your world from
train or car to work. A bike to school. A plane for a business trip. And even
if you don't leave your home, your life is still influenced by the
transportation industry: virtually every tangible good—food, clothing,
medicine, vehicles, computers—has been transported into your world from
movement of people and goods from point A to point B—is the life force of our
economy. Cities could not exist if we didn't have transportation systems to
move people and goods in, out and around them. It has been a leading driver
behind globalization: shrinking distances, seeding the emergence of entire new
economies and improving the quality of life for millions of people.
many of our transportation systems are inadequate to serve the needs of the
21st century. By integrating technology and intelligence into the physical
transportation infrastructure, we can improve capacity, enhance the traveler
experience and make our transportation systems more efficient, safe, and
IBM has a long history in
transportation and works with some of the most advanced operators of
transportation networks around the world, from municipal governments to railway
operators to airlines.
Eric-Mark is responsible for Smarter Transportation Solutions in IBM Globally. He is also the chairman of the IBM Global Intelligent Transportation Solutions (ITS) board, member of the ITS America Board and the ERTICO (ITS Europe) supervisory board.
As a manager and a specialist in Intelligent Transportation Solutions he has experience in helping cities, regions, governments and the private sector to manage all transportation modes safely and efficiently- on the ground, on water and in the air. This is achieved by implementing city command centres and traffic management centres, systems for asset management, multi-modal transport and road or congestion charging.
Before, he was Partner in IBM’s Business Process Outsourcing division, where he led the sales organisation in Europe. Previously he led IBM’s Strategic Outsourcing practice in the Netherlands for several sectors.
He has experience in managing teams in Public sector, Travel and Transportation, Automotive, Insurance and the Banking. He brings with him strong technology and management skills, developed in local and global operating companies
Eric-Mark joined IBM in 2001 from internet provider Chello of Liberty Global, where he was co-Founder and Global Vice President. Before he worked at EDS International and started his career at Philips Electronics.
Eric-Mark studied technical chemistry at the Technical University of Delft and at INSEAD in Fontainebleau where he finalised his Master degree. He is fluent in Dutch, German and English.
Eric-Mark is married and has 4 children, plays hockey and practices kite surfing.
He also is a member of the Lions Club Bollenstreek and the Private business club; Littéraire Sociëteit De Witte.
Relevance of power semiconductors innovations to current and future railway traction applications
Matthias Hofstetter, Director Development, Siemens AG
Power electronics has been the pace maker technology in the history of modern railway traction applications. Regarding the trends of urbanization and mobility there is a need of optimization the electric railway equipment life-cycle-costs. Therefore power semiconductors innovations in current and future traction applications have to enable the increase of power density, efficiency and reliability.
Matthias Hofstetter is head of development at SIEMENS AG Traction Drives in the Industry Sector, headquartered in Germany. He holds a doctorate degree in Electrical Engineering from KIT, Karlsruhe, Germany. Since graduation, Matthias has been working on the development of electric railway traction equipment covering power electronics, controls, motors and energy storages. In 2010 he accepted a lectureship “Electrical Traction and Vehicle Drives” at Leibniz University, Hannover, Germany.
Human Capital: Best Brains as decisive Success Factors in the Knowledge-based Economy
Sabine Herlitschka, CTO, Infineon Austria
So called "Human Capital", rather the Best Brains are the drivers as well as success factors for any knowledge intensive organization. Infineon Technologies as a leading semiconductor company has built its strategy around a pro-active Human Capital Management. Infineon Technologies Austria, has developed leading edge "People Excellence" Approaches that will be presented together with experiences based on its specifics.
Sabine Herlitschka is Member of the Management Board of Infineon Technologies Austria, as of 2012 in charge of technology and innovation, and has recently been designated CEO of Infineon Technologies Austria as of April 2014.
Her professional career includes industrial research, international research & technology cooperation and financing, Internships in the USA, Fulbright Scholar at Johns Hopkins University/U.S. and George Washington University/U.S., founding Vice-Rector for Research Management and international cooperation at the Medical University of Graz/Austria.
Before joining Infineon, Herlitschka was Director of the Division European and International Programmes in the Austrian Research Promotion Agency with responsibility for implementation of European & international Research and Technology Programmes, particularly the 7th EU Framework Programme in Austria.
For almost 15 years she has been frequently involved in European Research as advisor, project coordinator & proposal evaluator, as well as participant and chairperson in various European & international expert groups.
Herlitschka holds a Ph.D. in Food- and Biotechnology with Postdoc specialization in molecular biology and genetic engineering and an MBA in General Management.
Major Trends Shaping the Future Integrated Circuit Industry
Bill McClean, CEO, IC Insight
Although high uncertainty still looms over the global economy, smartphone, tablet PC, and automotive ICs continue to be in high demand. IC Insights will present its forecast for the IC market in the context of the IC industry cycle model. In order to make sense out of the current turmoil, a top-down analysis of the IC market will be given and include trends in worldwide GDP growth, electronic system sales, and semiconductor industry capital spending and capacity.IC Insights believes that the IC industry has emerged from a difficult 5-year period of minimal growth. From 2007-2012, the IC market grew at an average annual rate of 2%. In IC Insights’ opinion, the “bottom” of the current cycle in the worldwide economy and IC industry was reached in 2012 and 2013 marked the beginning of the next cyclical upturn—one in which the IC market average annual growth rate will more than triple to 7% in the 2012-2017 timeperiod.
Mr. McClean began his market research career in the integrated circuit industry in 1980 and founded IC Insights in 1997. During his 32 years of tracking the IC industry, Mr. McClean has specialized in market and technology trend forecasting and was responsible for developing the IC industry cycle model. At IC Insights, he serves as managing editor of the company’s market research studies and reports. In addition, he instructs for IC Insights’ seminars and has been a guest speaker at many important annual conferences held worldwide (e.g., SEMI’s ISS and Electronic Materials Conferences, The China Electronics Conference, and The European Microelectronics Summit). Mr. McClean received his Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois.
More than Moore applications and business trends: What could be the converging roadmap?
Jean-Christophe Eloy, President and CEO, Yole Développement
More than Moore technologies and the related applications (MEMS devices, LED, Power modules, integration of multiple non IC functions on chop, in package or in modules…) are growing in a significant rate every year. But the applications, technology developments… are quite different. Nevertheless, there is more and more convergence in term of roadmap, based on 3 major waves:
- First, the re-use of semiconductor process to make non IC devices is creating totally new opportunities and generating strong business growth.
- Second, module manufacturing is becoming the future of device makers, with strong added value in term of functions and revenue.
- Third, we see an incredible supply chain evolution to maximize the added value and provide complete services to customers
The presentation will detailed the impact of such waves and what does it means for the More than Moore markets and the convergence of this new industry.
JC Eloy has created YOLE Développement in 1998 and is the President and CEO of Yole Développement in charge of the international development and strategic orientations of the company. He is directly involved in the Mems fields as advisor of YOLE customers and for M&A activities.
JC Eloy and the 30 analysts of YOLE Développement are working directly with the key players of the industry from equipment and materials suppliers to device manufacturers and system integrators in Mems, power electronics, LED, photovoltaic and compound semiconductor business.
Jean-Christophe Eloy has been 6 years manager of the marketing department of CEA/LETI (France), applied R&D organization involved in the semiconductor, Mems and instrumentation fields (1500 researchers). He then created the semiconductor practice at Ernst & Young in Europe and worked as senior manager in charge of the development of European activities.
JC Eloy is also today board member of several companies in Europe and North America. Jean-Christophe Eloy is involved since 1991 in the Mems and semiconductor areas.
JC Eloy is Engineer from INPG/ENSERG (semiconductor and telecommunications) and has a MBA from EM Lyon.
Delivering Moore’s Law: an Interconnects perspective from Copper wires to Graphene
James Clarke, Manager Dielectrics and Metals, Components Research, Intel
Transistors continue to scale in both density and performance via novel architectures and novel materials. However, the extension of these devices to useful circuits requires world class interconnect systems. The RC delay and power restrictions imposed by the interconnect system can contribute to poor circuit performance in an increasingly severe manner as dimensions shrink. At some point, the overall circuit density will be defined by the interconnects and not the device. Stated more bluntly, the impact of novel transistors on end products may not be realized.
This talk will focus on the challenges of interconnect scaling, which are comprised of 1) density scaling, 2) resistance scaling, 3) capacitance scaling, and 4) reliability. The industry has enjoyed a rather straightforward implementation of dual damascene metallization using conventional copper schemes for the past decade. However, as research begins into dimensions below 10nm, these conventional methods run out of steam. Resistance is increasing faster than the scale factor of the technology and causes a bottleneck in both local and global information transfer on a chip.
Conductance is no longer determined by the bulk resistance of the copper wire. Instead, electron scattering at wire sidewalls and at metal grains dominate resistivity. Engineering below the nanometer length scale is required. There is substantial research into novel materials like carbon nanotubes and graphene that could eliminate scattering mechanisms, but presents additional challenges to implementation. At the same time, capacitance scaling continues to be important and the insulators surrounding the copper wires require new materials development.
Jim Clarke is the manager of the metal and dielectrics group within Intel’s Components Research Organization, where his group's primary focus is on interconnect scaling. He has been at Intel since 2001. Prior to his current position, Jim worked in Logic Technology Development and Capital Equipment development in the photolithography and metrology areas. Jim completed his B.S. in honors chemistry at Indiana University and his Ph.D. in physical chemistry at Harvard University. He also completed a post-doctoral fellowship in physical organic chemistry at Eidgenössische Technische Hochschule, Zürich. Jim has received an Intel Achievement Award for interconnect development. He has co-authored more than 40 papers and has several patents.
The biggest threat to Semiconductor Growth: Technology Limitations or Economic Realities?
Subramani Kengeri, Vice President, GLOBALFOUNDRIES
Advanced Technology innovations continue to drive Power, Performance and Density improvements, but translating those process capabilities to SoC level value is becoming increasingly difficult. Advanced Manufacturing Fabs, Process development and Chip design costs are going up astronomically, while the product life is getting shorter, posing significant challenges to Return-on-Investment. This Keynote will review the technical and business aspects of advanced semiconductor manufacturing to assess the major threats to semiconductor growth.
Subramani is responsible for defining competitive process architecture on advanced nodes in support of “first time right” technology development. He is responsible for determining the technology feasibility, competitiveness and manufacturability of all elements of technology platform and to establish the advanced technology roadmap for GLOBALFOUNDRIES.
Subramani joined GLOBALFOUNDRIES in 2009 as the Vice President of Design Solutions. He implemented strategic Design enablement initiatives and established a strong foundation for collaboration with Design eco-system, before moving to focus on R&D. He started his Semiconductor career at Texas Instruments and prior to joining GLOBALFOUNDRIES, he was the Senior Director of Design and Technology Platform at TSMC.
Subramani holds a master’s degree in electrical engineering from Indian Institute of Technology (IIT, Delhi) and has been granted 30+ U.S. patents.
ST Vision on Advanced CMOS Roadmap Evolution
Joël Hartmann, Executive Vice-President, Manufacturing and Process R&D, Embedded Processing Solutions, STMicroelectronics
STMicroelectronics is one of the few microelectronics companies still engaged in the advanced CMOS race. The talk provides an overview about their digital CMOS roadmap as well as the roadblocks on the path, which are not only technical but also economical, proposing an innovative and compelling solution: the planar FD-SOI technology, available from the 28nm node and scalable down to 10nm Together with the main CMOS track, differentiating solutions are also proposed like imaging, BiCMOS, silicon photonics, and 2.5/3D integration.
Joël Hartmann is Executive Vice President of STMicroelectronics, Front-End Manufacturing and Technology R&D, Embedded Processing Solutions (EPS). He has managed these responsibilities for ST’s digital products since February 2012. Hartmann is also in charge of the Company’s manufacturing operations in Crolles, France.
From 1979 to 2000, Hartmann worked at CEA-Leti, an applied-research center for microelectronics, information and healthcare technologies in Grenoble, France. In 2000, he joined STMicroelectronics as Director of the Crolles2 Alliance, the large-scale semiconductor manufacturing R&D initiative of STMicroelectronics, NXP and Freescale Semiconductor. In 2008, Hartmann was promoted to Group Vice President and Director of Advanced CMOS Logic & Derivative Technologies. In 2010, he gained additional responsibilities as a co-leader of the Semiconductor Research and Development Center in Fishkill, NY, within the IBM ISDA Technology Alliance for the development of advanced CMOS process.
Hartmann sits on the Board of the SOI Industry Consortium Initiative and is a Member of the IEEE Electron Device Society. He has filed 15 patents on semiconductor technology and devices and authored 10 publications in this field to date.
Joël Hartmann was born in Toulon, France, in 1955. He graduated from the Ecole Nationale Supérieure de Physique de Grenoble (ENSPG) with a degree in Physics.
Status and progress of EUV lithography industrialisation
Boudewijn Sluijk, Senior Director of Advanced Lithography Solutions, ASML
Moore’s Law requires cost-efficient scaling to continue. This can be realized by a combination of further advancements in immersion lithography and the gradual implementation of Extreme Ultraviolet (EUV) lithography which offers a trajectory towards sub-10 nm half pitch resolution. As the semiconductor industry follows the progress in the industrialization of EUV scanners, it is starting to plan for the insertion of EUV manufacturing into their product roadmaps. Frits van Hout will lay out the latest achievements and requirements that will establish EUV as the enabler of Moore’s Law for the next decade and beyond.
Boudewijn Sluijk received his physics degree at Leiden University. He has served the semiconductor equipment industry in various roles in research, development and marketing. He joined ASML in 1998, where he was closely involved in the introduction of the TWINSCAN dual stage scanner for 300 mm wafers. He has set up ASML’s market analysis department, and most recently has been active as Senior Director of Advanced Lithography Solutions, focusing on “N+2”, the node after next.
Enabling the technology roadmap to drive a sustainable information society
Luc Van den hove, President and CEO, imec
Our expanding information infrastructure is growing to form super networks of data centers, smart mobile devices, and sensor networks. This growth will demand a variety of energy-efficient electronic systems that can satisfy a myriad of performance, form-factor, and cost needs. Thus giving rise to new drivers for performance and density scaling of logic and memory contents of the chips.
Since the early part of this decade, the industry has transitioned from a mostly lithographically-reliant transistor shrink to a “Post-Dennard” era that also relies on new material for performance scaling. The pace of new material and device structure innovations has not slowed since. This process-complexity trend has been common to both logic and memory devices. Logic devices have evolved from poly-SiON gate to high-k metal gates, moving to multi-gate devices beyond FinFETs, beyond-Si channel devices, and other emerging devices for the sub-10nm node. While new memory devices like RRAM and STT-MRAM are emerging as embedded storage solutions, potentially complementing/replacing the future SRAM and DRAM contents on the chip.
The scaling for the next decade may evolve through another inflexion, where functionality and performance are dramatically stepped up through reliance of multi-level heterogeneous integration, that starts from transistors and continues to logic, memory, system-on-chip levels. To build the superchips of tomorrow, novel interconnects, 3-D, and 2-D co-integration will be needed. By examining the technology drivers and challenges, we will discuss how the logic and memory device roadmaps are being shaped to support the new super-chip vision for the sub-10nm node.
Luc Van den hove is President and Chief Executive Officer (CEO) of imec since July 1, 2009. Before holding this position he was Executive Vice President and Chief Operating Officer. He joined imec in 1984, starting his research career in the field of silicide and interconnect technologies. In 1988, he became manager of imec’s micro-patterning group (lithography, dry etching); in 1996, Department Director of Unit Process Step R&D; and in 1998, Vice-President of the Silicon Process and Device Technology Division. In January 2007, he was appointed as imec's Executive Vice President & Chief Operating Officer (COO).
Under his guidance imec has grown to an organization with a staff of around 2000 people, operating with an annual budget of 320M€ (2012) and with offices in Belgium, the Netherlands, US, Japan, Taiwan, China and India.
Currently, Luc Van den hove is also professor of Electrical Engineering at the University of Leuven. He is also a member of the Technology Strategy Committee of ASML.
He has authored or co-authored more than 150 publications and conference contributions. He is a frequently solicited speaker on technology trends and applications for nano-electronics at major top conferences. He has presented more than 30 key note presentations.
Luc Van den hove received his Ph.D. in Electrical Engineering from the University of Leuven, Belgium.
Electronics: key technologies for automotive innovations
Patrick Bastard, VP, Energy Systems Engineering, Renault
The automotive industry has to face three main revolutions:
connectivity, autonomous driving and powertrain electrification.
Each of these three big trends generate most of the innovations now
available or under development. This is a big challenge for car manufacturers
because most of technologies supporting these innovations are not conventional
automotive core competencies. It means that automotive engineering has to adapt
to new technologies, but it means also that new links have to be developed
between electronics industry and automotive industry.
A specific focus on electric vehicle can emphasize electronics
challenges that automotive industry has to face to build the mobility of the
Patrick BASTARD was born in 1966. In 1988, he graduated as engineer from Supélec, a leading French engineering School in Electrical Engineering and Electronics. He has also a PhD in electrical engineering (University of Paris XI, 1992).He began his career as a R&D engineer with Schneider Electric (Grenoble) in the field of protection relays for distribution networks. Then he joined Supélec as professor in electrical engineering, electrical machines and power electronics. He has been head of the Power Systems department of Supélec, promoting education and research activities, but also many industrial partnerships in order to boost innovation in the field of electrical systems, including technical and economics stakes. In 2005 he joined Renault (Electrical & Electronics Engineering Division) in order to contribute to the development of embedded electronics. In 2009 he was appointed as Director of the Advanced Electronics and New technologies Division of Renault. The main mission of this division was the development of automotive innovations, especially in the field of electric vehicles, connected cars and driver assistance systems (ADAS), including technology development, human factors (ergonomics, HMI, …) and new mobility concepts (new services and business models, …). Since June 2013, he is VP in charge of the Energy Systems Engineering division for the Renault Group, worldwide, from ICE to Electric vehicles, from research to development and serial life.Patrick Bastard is also chairman of Renault 3EA Network (3EA = Electrical Engineering, Electronics, Automatic control).