European 3D Summit – Sponsors

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Three years strong, the European 3D Summit has become one of the most visible 3D Integration events in Europe! Sponsors of the European 3D Summit event stand out as leaders in the 3D microelectronics industry and leave a strong impression of their brand in the minds of attendees coming from the industry. 
> Sponsorship Opportunities

Associate your company’s name with cutting-edge MEMS Technology!
Apply for sponsorship today!


Jérôme Boutant
Europe Sales Manager



Platinum Sponsor

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets. With the acquisition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet solutions for die level printing and UV Laser Drilling for through mold vias. SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific. For more information please visit and


Gold Sponsors

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and SiP solutions to meet growth momentum across a broad range of end markets. While addressing global proliferation of sophisticated electronics geared towards improving lifestyle and efficiency, ASE strengthened its OSAT market leadership position by generating sales revenues of US$4.84 Billion in 2013 and employs over 50,000 people worldwide. For more information on ASE, including our advances in SiP, copper pillar, and, 2.5D, 3D & TSV technologies, please visit


EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at


As one of three advanced-research institutes within the CEA Technological Research Division, CEA-Leti serves as a bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. It is committed to creating innovation and transferring it to industry. Backed by its portfolio of 2,800 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched 54 startups. Its 8,500m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. With a staff of more than 1,800, Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Follow us on and @CEA_Leti.


Silver Sponsors

Applied Materials, Inc. (Nasdaq: AMAT) is the global leader in precision materials engineering solutions for the semiconductor, flat panel display and solar photovoltaic industries. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world. Learn more at

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Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec’s industrial affiliation program on 3D-IC technology explores technology options to define innovative solutions for cost-effective realization of 3D interconnect using through-silicon-vias (TSV), fine pitch microbumps as well as wafer-to-wafer bonding. Imec’s 3D integration processes are completely executed on 300mm. To give our partners maximal information, we integrate and test baseline 3D-processes and flows on functional circuit demonstration vehicles. Imec also explores 3D design to propose methodologies for critical design issues, enabling effective use of 3D interconnection on system level.

With more than 60 years of engineering experience SUSS MicroTec is a leading supplier of process equipment for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range ofproducts and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.

Event Sponosrs

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Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi's ordinary shares are listed on Euronext Amsterdam (symbol: BESI) and OTCQX International (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands.


Mentor Graphics is a world leader in EDA products, consulting services and award-winning support for electronics and semiconductor companies. Mentor offers solutions that meet the demand for short design cycle time, improved productivity, and high yield, including tools for electronics system level design and simulation, embedded hardware and software co-development, system and IC verification, IC physical design and verification, yield enhancement and testing. The Calibre® 3DSTACK™ and Tessent® TestKompress® products address the unique physical verification and testing requirements of 3D-IC designs.


Siconnex is a global leading equipment manufacturer for the semiconductor and related industries.Siconnex provides surface preparation equipment and processes, including WET BATCHSPRAY (Etch, Clean, Resist Strip) systems for the III-V semiconductor, MEMS, wireless, power, energy harvesting, WLP, data storage and logic industries.
The Siconnex BATCHSPRAY® technology helps to make innovations such as smartphones, solar panels and power electronics more affordable and accessible to consumers and businesses around the world.
Siconnex systems are leading when an extremely small footprint, safety, full automation, high throughput and economical resource consumption is important.


Trymax Semiconductor BV and Trymax Semiconductor Equipment BV are privately held companies.  Trymax has been on operation since 2003 and has its registered headquarters in Nijmegen, the Netherlands. We are ISO-9001 accredited and operate on a global basis, supporting our customers who operate across Europe, Asia and America.Our core business is to support semiconductor manufacturers throughout the world with innovative solutions for plasma based, photo resist removal and surface cleaning equipment, as well as isotropic etch systems that are used in the fabrication of integrated circuits and other semiconductor devices.Trymax has expanded its activities and industrial collaborations, and is now able to combine its innovative technical leadership with its expertise in systems and process design to  provide the semiconductor, telecommunications, MEMS, data storage and related industries with a wide range of plasma etching and resist removal solutions.


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