European 3D TSV Summit 2015 - Sponsors


The European 3D TSV Summit is a unique event launched by SEMI Europe to highlight 3D TSV technologies and to allow professionals to discuss manufacturing challenges and to present business-related themes. 
This global event will offer plenary sessions, roundtables, an exhibition, a gala dinner and a one-on-one business meeting service. The European 3D TSV Summit provides a platform for networking that will open possibilities for business collaborations.
Sponsoring the European 3D TSV Summit event will make your company stand out as a leader in the TSV microelectronics industry and will leave a strong impression of your brand in people’s minds.

Apply today!

Platinum sponsor:  


SPTS Technologies, an Orbotech (NASDAQ:ORBK) company, designs, manufactures, sells, and supports advanced etch, PVD, CVD and thermal wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets.
With the acquisition of SPTS, Orbotech is now able to offer a broader range of Advanced Packaging solutions which includes Orbotech’s UV Laser Drilling, Laser Direct Imaging and Precision Inkjet Printing solutions.
 SPTS operates three manufacturing facilities in the UK and US, and operates across 19 countries in Europe, North America and Asia-Pacific.

Gold Sponsors:

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at

By creating innovation and transferring it to industry, CEA-Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and start-ups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 start-ups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Visit for more information

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and SiP solutions to meet growth momentum across a broad range of end markets. While addressing global proliferation of sophisticated electronics geared towards improving lifestyle and efficiency, ASE strengthened its OSAT market leadership position by generating sales revenues of US$4.84 Billion in 2013 and employs over 50,000 people worldwide. For more information on ASE, including our advances in SiP, copper pillar, and, 2.5D, 3D & TSV technologies, please visit

Silver Sponsors:


ams develops and manufactures high performance analog semiconductors that solve its customers’ most challenging problems with innovative solutions. ams’ products are aimed at applications which require ex-treme precision, accuracy, dynamic range, sensitivity, and ultra-low power consumption. ams’ product range includes sensors, sensor interfaces, power management ICs and wireless ICs for customers in the consum-er, industrial, medical, mobile communications and automotive markets. With headquarters in Austria and 9 design centers world wide ams employs over 1,500 people globally and serves more than 7,800 customers around the globe. ams is listed on the SIX Swiss stock exchange (ticker symbol: AMS). More information about ams can be found at
SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and Nanoimprint Lithography as well as key processes for WLP, MEMS and LED manufacturing. With its global infrastructure for applications and service SUSS MicroTec supports more than 8,000 installed systems worldwide.

Applied Materials, Inc. (Nasdaq: AMAT) is the global leader in precision materials engineering solutions for the semiconductor, flat panel display and solar photovoltaic industries. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world. Learn more at

Imec performs world - leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec’s industrial affiliation program on 3D - IC technology explores technology options to define innovative solutions for cost - effective realization of 3D interconnect with through - silicon - vias (TSV). Imec’s 3D integration processes are completely executed on 300mm. To give our partners maximal information, we integrate and test baseline 3D - processes and flows on functional circuit demonstration vehicles. Imec also explores 3D design to propose methodologies for critical design issues, enabling effective use of 3D interconnection on system level. 

Other Sponsors:

BE Semiconductor Industries N.V. (Besi) develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, RFID, LED and solar energy. 
Besi is engaged in one line of business, the development, manufacturing, marketing, sales and service of semiconductor assembly equipment for the global semiconductor and electronics industries. 

JX Nippon Mining & Metals offers a wide variety of sputtering targets for demanding thin film applications including semiconductor, data storage, and optical films. Our InP and CdTe wafers are widely used for compound semiconductor and IR sensor applications. JX Nippon Mining & Metals is well-known for delivering high quality electronic materials that meet and exceed the expectations of our customers and is consistently acknowledged as a top supplier.

X-FAB MEMS Foundry is a leading contract manufacturer of MEMS and micro-structured devices and draws on over 20 years of manufacturing experience to offer process installation, development and high-volume manufacturing services. Operating from five fabs for MEMS and CMOS processes, X-FAB supports both, customer specific process transfers and its own range of qualified, in-production, open-platform processes for key MEMS types. As part of the X-FAB Group, X-FAB MEMS Foundry offers a wide range of manufacturing capabilities and materials along with extensive experience in the integration of MEMS devices with X-FAB’s leading analog/mixed-signal CMOS technologies. X-FAB MEMS Foundry has developed a TSV module for use with its CMOS ASIC, sensor and MEMS technologies, which is being offered to early access customers and will become generally available in the course of 2015.
Mentor Graphics is a world leader in EDA products, consulting services and award-winning support for electronics and semiconductor companies. Mentor offers solutions that meet the demand for short design cycle time, improved productivity, and high yield, including tools for electronics system level design and simulation, embedded hardware and software co-development, system and IC verification, IC physical design and verification, yield enhancement and testing. The Calibre® 3DSTACK™ and Tessent® TestKompress® products address the unique physical verification and testing requirements of 3D-IC designs.

Cascade Microtech, Inc. is a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level. Cascade Microtech delivers access to electrical data from wafers, ICs, IC packages, circuit boards and modules, MEMS, 3D TSV, LED devices and more. Cascade Microtech’s leading-edge stations, probes, probe cards, advanced thermal subsystems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing of high-speed and high-density semiconductor chips. For more information visit

AEPI is the economic development agency for Grenoble-Isere/France. The Grenoble area, smart valley in southeastern France, is Europe’s top center in micro-nanotechnologies and derived applications, and home to all Semiconductors'major players. Working closely with the Minatec innovation campus and its anchor lab CEA-Leti, as well as the industrial cluster Minalogic, AEPI provides complimentary information and services to companies exploring business opportunities. AEPI is also an active member of the Silicon Europe transnational cluster, uniting Europe's 5 top clusters in Micro/Nanoelectronics.  It has developed as well collaborations outside Europe, with strong connections to Japan's region of Tsukuba, Daejeon in Korea, Zelenograd in Russia, as well as US Albany nanotech cluster.
Oerlikon Systems focuses on production systems for semiconductor and advanced nanotechnology applications. The core competence of Oerlikon Systems in the thin - film coating technology enables solutions in the area of semiconductors for advanced packaging, power devices, read/write heads for hard disks, LEDs and Micro - Electro - Mechanical Systems (MEMS). These solutions facilitate the production of chips, devices and components used in consumer electronics and various industrial sectors, including the information technology, telecommunications and automotive industries. Applications for the advanced nanotechnology market include touch panels, photovoltaics, thermoelectric generators and energy storage, saving, conversion and transmission.

Siconnex is a global leading equipment manufacturer for the semiconductor and related industries.
Siconnex provides surface preparation equipment and processes, including WET BATCHSPRAY systems for the III-V semiconductor, MEMS, wireless, power, energy harvesting, WLP, data storage and logic industries.

Our technologies help to make innovations like smartphones, solar panels and power electronics more affordable and accessible to consumers and businesses around the world.
Siconnex systems are leading when an extremely small footprint, safety, full automation, high throughput and economical resource consumption is important.
For more information, please visit

FUJIFILM Electronic Materials (FFEM) is a leading supplier to the semiconductor IC market. Our product portfolio consists of the broadest line worldwide of photoresists, polyimides, CMP, thin film systems and high purity chemicals to the technologically demanding semiconductor manufacturers.
Some eye catchers for 3D integration:
>Our low cure polyimides, a protective / dielectric layer for redistribution applications as well as buffer coat before packaging.
>New concept of temporary bonding materials in which protective layer and anti-sticking layer function are combined in one layer, single coat.
>A range of specialty etchants, cleaners, removers dedicated to 3D integration.

Trymax semiconductor Group is a privately held global semiconductor company based in the Netherlands. We are your partner for innovative plasma based solutions, photo resist removal and surface cleaning equipment, as well as isotropic etch systems used in the fabrication of integrated circuits.
Rudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, advanced packaging lithography, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down the costs and time to market of their products. The Company’s expanding portfolio of equipment and software solutions is used in both the wafer processing and final manufacturing of ICs, and in adjacent markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at

With a comprehensive portfolio of products, services, software and expertise, KLA-Tencor helps nanoelectronics manufacturers manage yield throughout their fabrication process—from research and development to final volume production. KLA-Tencor’s CIRCL™ platform, tailored for Advanced Wafer Level Packaging, is capable of all wafer surface defect inspection, metrology and review at high throughput for efficient process control offering users the best cost of ownership solution. KLA-Tencor has dedicated customer operations and service centers around the world.
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