European 3D TSV Summit 2015 - Sponsors
The European 3D TSV Summit is a unique
event launched by SEMI Europe to highlight 3D TSV technologies and to allow
professionals to discuss manufacturing challenges and to present business-related
SPTS Technologies, an Orbotech
(NASDAQ:ORBK) company, designs, manufactures, sells, and supports advanced
etch, PVD, CVD and thermal wafer processing equipment and solutions for the
global semiconductor and micro-device industries, with focus on the Advanced
Packaging, MEMS, high speed RF device, power management and LED markets.
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.
|By creating innovation and transferring it to industry, CEA-Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and start-ups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 start-ups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo. Visit www.leti.fr for more information|
The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and SiP solutions to meet growth momentum across a broad range of end markets. While addressing global proliferation of sophisticated electronics geared towards improving lifestyle and efficiency, ASE strengthened its OSAT market leadership position by generating sales revenues of US$4.84 Billion in 2013 and employs over 50,000 people worldwide. For more information on ASE, including our advances in SiP, copper pillar, and, 2.5D, 3D & TSV technologies, please visit www.aseglobal.com
develops and manufactures high performance analog semiconductors that solve its
customers’ most challenging problems with innovative solutions. ams’ products
are aimed at applications which require ex-treme precision, accuracy, dynamic
range, sensitivity, and ultra-low power consumption. ams’ product range
includes sensors, sensor interfaces, power management ICs and wireless ICs for
customers in the consum-er, industrial, medical, mobile communications and
headquarters in Austria and 9 design centers world wide ams employs over 1,500
people globally and serves more than 7,800 customers around the globe. ams is
listed on the SIX Swiss stock exchange (ticker symbol: AMS). More information
about ams can be found at www.ams.com.|
|SUSS MicroTec is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components. In close cooperation with research institutes and industry partners SUSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and Nanoimprint Lithography as well as key processes for WLP, MEMS and LED manufacturing. With its global infrastructure for applications and service SUSS MicroTec supports more than 8,000 installed systems worldwide.|
|Applied Materials, Inc. (Nasdaq: AMAT) is the global leader in precision materials engineering solutions for the semiconductor, flat panel display and solar photovoltaic industries. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world. Learn more at www.appliedmaterials.com.|
Imec performs world - leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec’s industrial affiliation program on 3D - IC technology explores technology options to define innovative solutions for cost - effective realization of 3D interconnect with through - silicon - vias (TSV). Imec’s 3D integration processes are completely executed on 300mm. To give our partners maximal information, we integrate and test baseline 3D - processes and flows on functional circuit demonstration vehicles. Imec also explores 3D design to propose methodologies for critical design issues, enabling effective use of 3D interconnection on system level.
BE Semiconductor Industries N.V. (Besi)
develops leading edge assembly processes and equipment for leadframe, substrate
and wafer level packaging applications in a wide range of end-user markets
including electronics, computer, automotive, industrial, RFID, LED and solar
|JX Nippon Mining & Metals offers a wide variety of sputtering targets for demanding thin film applications including semiconductor, data storage, and optical films. Our InP and CdTe wafers are widely used for compound semiconductor and IR sensor applications. JX Nippon Mining & Metals is well-known for delivering high quality electronic materials that meet and exceed the expectations of our customers and is consistently acknowledged as a top supplier.|
|X-FAB MEMS Foundry is a leading contract manufacturer of MEMS
and micro-structured devices and draws on over 20 years of manufacturing
experience to offer process installation, development and high-volume
manufacturing services. Operating from five fabs for MEMS and CMOS processes,
X-FAB supports both, customer specific process transfers and its own range of
qualified, in-production, open-platform processes for key MEMS types. As part
of the X-FAB Group, X-FAB MEMS Foundry offers a wide range of manufacturing
capabilities and materials along with extensive experience in the integration
of MEMS devices with X-FAB’s leading analog/mixed-signal CMOS technologies.
X-FAB MEMS Foundry has developed a TSV module for use with its CMOS ASIC,
sensor and MEMS technologies, which is being offered to early access customers
and will become generally available in the course of 2015.http://www.xfab.com/mems.|
|Mentor Graphics is a world leader in EDA products, consulting
services and award-winning support for electronics and semiconductor companies.
Mentor offers solutions that meet the demand for short design cycle time,
improved productivity, and high yield, including tools for electronics system
level design and simulation, embedded hardware and software co-development,
system and IC verification, IC physical design and verification, yield
enhancement and testing. The Calibre® 3DSTACK™ and Tessent® TestKompress®
products address the unique physical verification and testing requirements of
|Cascade Microtech, Inc. is a leading supplier of solutions that enable precision measurements of integrated circuits at the wafer level. Cascade Microtech delivers access to electrical data from wafers, ICs, IC packages, circuit boards and modules, MEMS, 3D TSV, LED devices and more. Cascade Microtech’s leading-edge stations, probes, probe cards, advanced thermal subsystems and integrated systems deliver precision accuracy and superior performance both in the lab and during production manufacturing of high-speed and high-density semiconductor chips. For more information visit www.cascademicrotech.com.|
|AEPI is the economic development agency for
Grenoble-Isere/France. The Grenoble area, smart valley in southeastern France,
is Europe’s top center in micro-nanotechnologies and derived applications, and
home to all Semiconductors'major players. Working closely with the Minatec
innovation campus and its anchor lab CEA-Leti, as well as the industrial
cluster Minalogic, AEPI provides complimentary information and services to
companies exploring business opportunities. AEPI is also an active member of
the Silicon Europe transnational cluster, uniting Europe's 5 top clusters in
Micro/Nanoelectronics. It has developed as well collaborations outside
Europe, with strong connections to Japan's region of Tsukuba, Daejeon in Korea,
Zelenograd in Russia, as well as US Albany nanotech cluster.|
|Oerlikon Systems focuses on production systems
for semiconductor and advanced nanotechnology applications. The core competence
of Oerlikon Systems in the thin - film coating technology enables solutions in
the area of semiconductors for advanced packaging, power devices, read/write
heads for hard disks, LEDs and Micro - Electro - Mechanical Systems (MEMS).
These solutions facilitate the production of chips, devices and components used
in consumer electronics and various industrial sectors, including the information
technology, telecommunications and automotive industries. Applications for the
advanced nanotechnology market include touch panels, photovoltaics,
thermoelectric generators and energy storage, saving, conversion and
|Siconnex is a
global leading equipment manufacturer for the semiconductor and related
Siconnex provides surface preparation equipment and processes, including WET BATCHSPRAY systems for the III-V semiconductor, MEMS, wireless, power, energy harvesting, WLP, data storage and logic industries.
Our technologies help to make innovations like smartphones, solar panels and power electronics more affordable and accessible to consumers and businesses around the world.
Siconnex systems are leading when an extremely small footprint, safety, full automation, high throughput and economical resource consumption is important.
For more information, please visit www.siconnex.com
Materials (FFEM) is a leading supplier to the semiconductor IC market. Our
product portfolio consists of the broadest line worldwide of photoresists,
polyimides, CMP, thin film systems and high purity chemicals to the
technologically demanding semiconductor manufacturers.|
Some eye catchers for 3D integration:
>Our low cure polyimides, a protective / dielectric layer for redistribution applications as well as buffer coat before packaging.
>New concept of temporary bonding materials in which protective layer and anti-sticking layer function are combined in one layer, single coat.
>A range of specialty etchants, cleaners, removers dedicated to 3D integration.
|Trymax semiconductor Group is a privately held global semiconductor company based in the Netherlands. We are your partner for innovative plasma based solutions, photo resist removal and surface cleaning equipment, as well as isotropic etch systems used in the fabrication of integrated circuits.|
|Rudolph Technologies, Inc. is a leader in the
design, development, manufacture and support of defect inspection, advanced
packaging lithography, process control metrology, and data analysis systems and
software used by semiconductor device manufacturers worldwide. Rudolph provides
a full-fab solution through its families of proprietary products that provide
critical yield-enhancing information, enabling microelectronic device
manufacturers to drive down the costs and time to market of their products. The
Company’s expanding portfolio of equipment and software solutions is used in
both the wafer processing and final manufacturing of ICs, and in adjacent
markets such as FPD, LED and Solar. Headquartered in Flanders, New Jersey,
Rudolph supports its customers with a worldwide sales and service organization.
Additional information can be found on the Company’s website at www.rudolphtech.com|
|With a comprehensive portfolio of products, services, software and expertise, KLA-Tencor helps nanoelectronics manufacturers manage yield throughout their fabrication process—from research and development to final volume production. KLA-Tencor’s CIRCL™ platform, tailored for Advanced Wafer Level Packaging, is capable of all wafer surface defect inspection, metrology and review at high throughput for efficient process control offering users the best cost of ownership solution. KLA-Tencor has dedicated customer operations and service centers around the world. www.kla-tencor.com|
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