European 3D TSV Summit 2014 - Sponsors


The European 3D TSV Summit is a unique event launched by SEMI Europe to highlight 3D TSV technologies and to allow professionals to discuss manufacturing challenges and to present business-related themes. 
This global event will offer plenary sessions, roundtables, an exhibition, a gala dinner and a one-on-one business meeting service. The European 3D TSV Summit provides a platform for networking that will open possibilities for business collaborations.
Sponsoring the European 3D TSV Summit event will make your company stand out as a leader in the TSV microelectronics industry and will leave a strong impression of your brand in people’s minds.

Apply today!


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