European 3D TSV Summit 2014 - Exhibition

EXHIBITION
 
The European 3D TSV Summit is the place to see the leading companies, technologies, and people driving the future of 3D TSV design and manufacturing. The European 3D TSV Summit exhibitors are the suppliers to and partners of the Europe’s leading microelectronics companies.From silicon to system - and everything in between and beyond - European 3D TSV Summit showcases the brightest names in 3D TSV microelectronics manufacturing.

Exhibition area of the European 3D TSV Summit 2013 was sold out. Book early to spot your booth and benefit form early bird prices.
 
 
Book today your space:
 SOLD OUT
 
 
 
PriceBefore Oct 31stAfter Oct 31st
SEMI Members
2250 EUR
2500 EUR
Non Members
2500 EUR
2775 EUR
VAT to be added to the price mentionned above
Exhibitor list
 
- AMKOR
- AML
- ASE Group
- CEA-LETI
- DISCO
- Entegris
- EURIS Sarl
- EV Group (EVG)
- Fraunhofer-IZM
- FRONTIER SEMICONDUCTOR
- FRT GmbH
- imec
- JTA/Takatori
- JX Nippon Mining & Metals Europe
- Microcontrol Electronic
- Nordson Dage
- Oerlikon Systems
- Plan Optik AG
- S3 Alliance
- SET
- SILEX
- Solid State Equipment
- SPTS
- Tronics
- Fogale Nanotech
- MKS Instruments Deutschland