European 3D TSV Summit 2015 - Exhibition


The European 3D TSV Summit is the place to see leading companies, technologies, and people driving the future of 3D TSV design and manufacturing. The European 3D TSV Summit exhibitors are the suppliers to and the partners of leading microelectronics companies. From silicon to system and everything in between, European 3D TSV Summit showcases the most prominent names in 3D TSV microelectronics manufacturing. 

In 2013 & 2014, the exhibition area of the European 3D TSV Summit was sold out.

Book now: Only 1 booth left!


Book your space today:

PriceBefore Oct 31stAfter Oct 31st
SEMI Members
2250 EUR
2500 EUR
Non Members
2600 EUR
2850 EUR
*VAT to be added to the price mentionned above
2015 Exhibitor list:
- Akrion Systems LLC
- AMICRA Microtechnologies
- ASE Group
- Entegris
- Euris
- EV Group (EVG)
- Fogale Nanotech
- Fraunhofer-IZM
- Frontier Semiconductor
- imec
- JTA/Takatori
- JX Nippon Mining & Metal Europe GmbH
- Microcontrol Electronic
- Nordson Dage
- Oerlikon Systems
- S3 Alliance GmbH
- Solid State Equipment LLC
- Towa