European 3D TSV Summit 2015 - Exhibition

EXHIBITION
 

The European 3D TSV Summit is the place to see leading companies, technologies, and people driving the future of 3D TSV design and manufacturing. The European 3D TSV Summit exhibitors are the suppliers to and the partners of leading microelectronics companies. From silicon to system and everything in between, European 3D TSV Summit showcases the most prominent names in 3D TSV microelectronics manufacturing. 

In 2013 & 2014, the exhibition area of the European 3D TSV Summit was sold out.

 

 

Book your space today:

SOLD OUT
 
 
 
PriceBefore Oct 31stAfter Oct 31st
SEMI Members
2250 EUR
2500 EUR
Non Members
2600 EUR
2850 EUR
*VAT to be added to the price mentionned above
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ATTENTION 2015 Exhibitors:
To consult the 2015 Exhibitor Guide CLICK HERE
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2015 Exhibitor list:
 
- Akrion Systems LLC
- AMICRA Microtechnologies
- ASE Group
- CEA-LETI
- DISCO
- Entegris
- Euris
- EV Group (EVG)
- Fogale Nanotech
- Fraunhofer-IZM
- Frontier Semiconductor
FRT GmbH
HSEB
- imec
- JTA/Takatori
- JX Nippon Mining & Metal Europe GmbH
- Microcontrol Electronic
- Nordson Dage
- Oerlikon Systems
- S3 Alliance GmbH
- SEMSYSCO
- SET
- Silex Microsystems
- Solid State Equipment LLC
- SPTS
- Towa