European 3D TSV Summit 2015 - Exhibition

EXHIBITION
 

The European 3D TSV Summit is the place to see leading companies, technologies, and people driving the future of 3D TSV design and manufacturing. The European 3D TSV Summit exhibitors are the suppliers to and the partners of leading microelectronics companies. From silicon to system and everything in between, European 3D TSV Summit showcases the most prominent names in 3D TSV microelectronics manufacturing. 

In 2013 & 2014, the exhibition area of the European 3D TSV Summit was sold out.

Book early to choose your booth spot and to benefit from early bird prices!

 

Book your space today:

 
 
 
PriceBefore Oct 31stAfter Oct 31st
SEMI Members
2250 EUR
2500 EUR
Non Members
2600 EUR
2850 EUR
*VAT to be added to the price mentionned above
2014 Exhibitor list
 
- AMKOR
- AML
- ASE Group
- CEA-LETI
- DISCO
- Entegris
- EURIS Sarl
- EV Group (EVG)
- Fraunhofer-IZM
- FRONTIER SEMICONDUCTOR
- FRT GmbH
- imec
- JTA/Takatori
- JX Nippon Mining & Metals Europe
- Microcontrol Electronic
- Nordson Dage
- Oerlikon Systems
- Plan Optik AG
- S3 Alliance
- SET
- SILEX
- Solid State Equipment
- SPTS
- Tronics
- Fogale Nanotech
- MKS Instruments Deutschland