SEMI European 3D TSV Summit 2014 - Homepage
EUROPEAN 3D TSV SUMMIT (Jan 20-22, 2014 - Grenoble)
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SEMI Europe is proud to announce the 2nd edition of the European 3D TSV Summit. The event will be held on Jan 20-22, 2014 in Grenoble (France).
Building on the success of the 1st edition that attracted almost 320 people from 20 countries, the theme of this year’s event is “Application Ready,” addressing 3D TSV from both a Business and Technology perspective.
The latest TSV product developments and achievements — including cost, business models, supply chain, manufacturability and technology aspects — will be addressed by executives and experts from global companies.
The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies participating, showing a range from initial prototypes to high-volume production.
European 3D TSV Summit 2014 will feature :
Summit Steering Committee:
Grenoble: Major European Microelectronic cluster and Capital of the French Alps - Courtesy of AEPI
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