SEMI European 3D TSV Summit 2014 - Homepage

 

NEXT EUROPEAN 3D TSV SUMMIT IS PLANNED ON
JAN 19-21, 2015 IN GRENOBLE

More information to be announced - Save the date and stay tuned 
 
Pictures of 2014 are online: Access the GALLERY

Purchase the proceedings of 2014: PROCEEDINGS
  
 
EUROPEAN 3D TSV SUMMIT 2014:


SEMI Europe is proud to announce the 2nd edition of the European 3D TSV Summit. The event will be held on Jan 20-22, 2014 in Grenoble (France).
  
Building on the success of the 1st edition that attracted almost 320 people from 20 countries, the theme of this year’s event is “Application Ready,” addressing 3D TSV from both a Business and Technology perspective.
 
The latest TSV product developments and achievements — including cost, business models, supply chain, manufacturability and technology aspects — will be addressed by executives and experts from global companies. 
   
The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies participating, showing a range from initial prototypes to high-volume production.
 
European 3D TSV Summit 2014 will feature :
  • More than 25 presentations of executives and experts
  • Panel discussions with audience
  • Pre-summit symposium on MEMS & TSV on Jan 20th
  • One on one business meeting service
  • 500 m² of exhibiting area
  • Specific market session
  • CEA-LETI 300mm TSV line tour
  • Unique CATRENE 3D Session
  • Cocktail and Networking dinner 
 
 
Twitter: @EUTSVSummit
Promotion flyer => Link
Leaflet => Link
2013 Post Show report => Link
 
Sponsors:

 



 

 

 

 

 

 

 

 

 

Media Partners:

 


  

 

 

Partner association:


 

 
Summit Steering Committee:
  • Eric Beyne, Director of Advanced Packaging, IMEC
  • Kevin Crofton, EVP and COO, SPTS
  • Albert Koller, VP and head of Semiconductor, Oerlikon Systems
  • Hugo Pristauz, VP Product Line TCB and Die Sorting, BESI
  • Thomas Uhrmann, Head of Business Development, EV Group
  • Jean Michailos, R&D Technology program manager for 3D, STMicroelectronics
  • James Quinn, CEO, Scint-X
  • Patrick Leduc, Program Manager 3D IC, CEA-LETI
  • Martin Schrems, VP Process Development and Implementation, ams AG
  • M. Juergen Wolf, Head of dept. WLSI, Mgmt. ASSID, Fraunhofer IZM
  • Margarete Zoberbier, International Product Manager Bonder, SUSS Microtec
 
Grenoble: Major European Microelectronic cluster and Capital of the French Alps - Courtesy of AEPI