SEMI European 3D TSV Summit 2015
2015 European 3D TSV Summit
Enabling Smarter Systems
January 19-21, 2015
Conference, Exhibition & Networking
SEMI Europe is proud to announce the 3rd edition of the European 3D TSV Summit. The event will be held on January 19-21, 2015 in Grenoble (France).
Building on the success of its first two editions, each attracting more than 320 people from over 20 countries, the European 3D TSV Summit will be back in 2015 with a new theme: “Enabling Smarter Systems”. As in the past editions, the event will present attendees with both the business and technological aspects of 2.5 / 3D Integration.
Executives and experts from global companies will gather at the European 3D TSV Summit to talk about the latest product developments, achievements and industry issues, including cost, business models, supply chain, manufacturability and other technological aspects.
The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies presenting an array of products and manufacturing techniques.
European 3D TSV Summit 2015 will feature :
3D TSV Webinar
Featuring: Rozalia Beica, Yole Développement, Jean Michailos, STMicroelectronics and Martin Schrems, ams AG
Summit Steering Committee:
Grenoble: Major European Microelectronic cluster and Capital of the French Alps - Courtesy of AEPI
- Market Info
- Events & Tradeshows