SEMI European 3D TSV Summit 2015

2015 European 3D TSV Summit
Enabling Smarter Systems
January 19-21, 2015
Grenoble (France)


Thank you to all of our speakers and partners.
The European 3D TSV Summit 2015 was a true success!

Conference, Exhibition & Networking
SEMI Europe is proud to announce the 3rd edition of the European 3D TSV Summit. The event will be held on January 19-21, 2015 in Grenoble (France).
Building on the success of its first two editions, each attracting more than 320 people from over 20 countries, the European 3D TSV Summit will be back in 2015 with a new theme: “Enabling Smarter Systems”. As in the past editions, the event will present attendees with both the business and technological aspects of 2.5 / 3D Integration.
Executives and experts from global companies will gather at the European 3D TSV Summit to talk about the latest product developments, achievements and industry issues, including cost, business models, supply chain, manufacturability and other technological aspects.
The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies presenting an array of products and manufacturing techniques.
European 3D TSV Summit 2015 will feature :
  • More than 20 presentations by invited executives and experts
  • Stimulating panel discussions with audience
  • Pre-Summit Market Symposium
  • One-on-one business meeting service
  • 500 m² of exhibiting area
  • CEA-LETI 300mm TSV line tour
  • Cocktails and Networking dinner 
Twitter: @EUTSVSummit
Promotion flyer => CLICK HERE
2014 Post Show report => CLICK HERE


Media Partners:
Summit Steering Committee:
  • Eric Beyne, Director of Advanced Packaging, IMEC
  • Kevin Crofton, President, SPTS  &  Corporate VP, Orbotech 
  • Albert Koller, VP and head of Semiconductor, Oerlikon Systems
  • Hugo Pristauz, VP Product Line TCB and Die Sorting, BESI
  • Thomas Uhrmann, Head of Business Development, EV Group
  • Jean Michailos, R&D Technology program manager for 3D, STMicroelectronics
  • James Quinn, CEO, Scint-X
  • Patrick Leduc, Program Manager 3D IC, CEA-LETI
  • Martin Schrems, VP Process Development and Implementation, ams AG
  • M. Juergen Wolf, Head of dept. WLSI, Mgmt. ASSID, Fraunhofer IZM
  • Margarete Zoberbier, International Product Manager Bonder, SUSS MicroTec
Grenoble: Major European Microelectronic cluster and Capital of the French Alps - Courtesy of AEPI