European 3D TSV Summit - Sponsor
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Sponsors | ||
Leti
is an institute of CEA, the French research-and-technology organization
with activities in energy, IT, healthcare, defense and security. Leti
is focused on creating value and innovation through technology transfer
to its industrial partners. It specializes in nanotechnologies and their
applications, from wireless devices and systems, to biology, healthcare
and photonics. Heterogeneous technologies and 3D integration are at the
core of its activities. In addition to Leti’s 1,700 employees, there
are more than 250 students involved in research activities, which makes
Leti a mainspring of innovation expertise. Leti’s portfolio of 1,880
families of patents helps strengthen the competitiveness of its
industrial partners. Besi
is a leading supplier of semiconductor assembly equipment for the
global semiconductor and electronics industries. The Company develops
leading edge assembly processes and equipment for leadframe, substrate
and wafer level packaging applications in a wide range of end-user
markets including electronics, computer, automotive, industrial, RFID,
LED and solar energy. Customers are primarily leading semiconductor
manufacturers, assembly subcontractors and electronics and industrial
companies. Besi’s ordinary shares are listed on NYSE Euronext Amsterdam
(symbol: BESI) and OTCQX International (symbol: BESIY) and its
headquarters are located in Duiven, the Netherlands. For more
information, please visit our website at www.besi.com. ![]() Imec
performs world - leading research in nanotechnology.In our
collaborative program on 3D Integration, we explore technology options
and solutions for the cost - effective realization of 3D systems. The
main focus of the program are 3D - SIC (stacked - IC) and 3D - SoC
(system - on - chip). The 3D interconnections are via - middle TSVs
(trough - silicon - via) at the global level. We verify all chosen options through realistic demonstrator chips with functional test circuits. Our latest functional DRAM - on - logic IC chip proves the potential of 3D integration for next - generation low - power mobile applications. The 3D stack consists of imec’s proprietary logic CMOS IC stacked on top of a commercial DRAM using TSVs and micro - bumps. ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power technologies and multimedia convergence applications. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life.augmented. In 2011, the Company’s net revenues were $9.73 billion. Further information on ST can be found at www.st.com. With
over 3,500 employees and €1,286 million in revenue in 2011, Air Liquide
Group’s Electronics World Business Line offers a large range of high
added-value products (carrier and specialty gases, advanced precursors,
chemicals) and services used in the manufacture of the state-of-the-art
technologies that we see all around us: flat panel displays, computers,
mobile phones, digital cameras, etc. The Group also offers its
electronics expertise to the booming photovoltaic industry. The Group
has developed the new ALOHA range of “advanced precursors”, which are
designed on demand to match the exact process requirements of its
semiconductor customers. Air Liquide also provides customers with an
extended offer, which includes chemical equipment and piping
installation for the distribution of ultra high purity fluids. Applied
Materials, Inc. (Nasdaq:AMAT) is the global leader in providing
innovative equipment, services and software to enable the manufacture of
advanced semiconductor, flat panel display and solar photovoltaic
products. Our technologies help make innovations like smartphones, flat
screen TVs and solar panels more affordable and accessible to consumers
and businesses around the world. At Applied Materials, we turn today’s
innovations into the industries of tomorrow. Learn more at www.appliedmaterials.com. The
Fraunhofer-Gesellschaft (FhG) focuses on contract research on behalf of
industry, service sector and government. With more than 230 employees,
the Fraunhofer Institute for Reliability and Microintegration FHG-IZM is
one of the leading institutes in the field of microelectronics and
microsystem packaging worldwide. Having it’s headquarter in Berlin, the
institute covers all the competencies needed for advanced packaging
concepts. Since 2010, IZM operates the center „All Silicon System
Integration Dresden” (ASSID) which is integral part of Fraunhofer IZM’s
wafer level system packaging and system integration activities. SPTS
Technologies designs, manufactures, sells, and supports advanced etch,
PVD, CVD and thermal capital equipment and process technologies for the
global semiconductor and micro-device industries, with focus on the
advanced packaging/3D-IC, MEMS, LED , high speed RF device and power
management markets. The solutions offered by SPTS include market-leading
silicon etch, dielectric etch, dry-release etch, PVD, PECVD, APCVD and
large batch vertical furnaces, available with a range of wafer-handling
options applicable to R&D, pilot production, or volume production
environments. For additional product or company information, contact:
Rudolph
Technologies is a worldwide leader in the design and manufacture of
defect inspection, process control metrology, and data analysis systems
and software used by semiconductor device manufacturers worldwide.
Rudolph provides a full-fab solution through its families of proprietary
products that provide critical yield-enhancing information, enabling
device manufacturers to drive down the costs and time to market of their
products. The company’s yield management solutions are used in both the
wafer processing and final manufacturing of ICs, as well as in emerging
markets such as LED and Solar. More information can be found on the
company’s web site at www.rudolphtech.com. ![]() Oerlikon
Systems offers cost-efficient and flexible thin film deposition systems
and processes to the semiconductor, and advanced nanotechnology
markets. Applications for the semiconductor market include advanced
packaging, power devices, read/write heads for hard disks, LEDs and
Micro-Electro-Mechanical Systems (MEMS). Solutions in the advanced
nanotechnology sector comprise photovoltaics, touch panels and
thermoelectrics. ![]() Beginning in 1998 with Yole Développement, we have grown to become a group of companies providing market research, technology analysis, strategy consulting, media in addition to finance services. With a solid focus on emerging applications using silicon and/or micro manufacturing Yole Développement group has expanded to include more than 40 associates worldwide covering MEMS, MedTech, Advanced Packaging, Compound Semiconductors, Power Electronics, LED, and Photovoltaics. The group supports companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business. Trymax Semiconductor is a privately held global semiconductor company having it’s registered headquarters in Nijmegen, The Netherlands. Our core business is to support semiconductor manufacturers throughout the world with innovative solutions for plasma based, photo resist removal and surface cleaning equipment as well as isotropic etch systems used in the fabrication of integrated circuits. The company continues its tradition of combining innovative technical leadership with expertise in systems and process design to provide the semiconductor, telecommunications, MEMS, data storage, and related industries with a wide range of plasma etching solutions. | ||






