European 3D TSV Summit - Sponsor
Leti is an institute of CEA, the French research-and-technology organization with activities in energy, IT, healthcare, defense and security. Leti is focused on creating value and innovation through technology transfer to its industrial partners. It specializes in nanotechnologies and their applications, from wireless devices and systems, to biology, healthcare and photonics. Heterogeneous technologies and 3D integration are at the core of its activities. In addition to Leti’s 1,700 employees, there are more than 250 students involved in research activities, which makes Leti a mainspring of innovation expertise. Leti’s portfolio of 1,880 families of patents helps strengthen the competitiveness of its industrial partners.
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries. The Company develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, computer, automotive, industrial, RFID, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi’s ordinary shares are listed on NYSE Euronext Amsterdam (symbol: BESI) and OTCQX International (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands. For more information, please visit our website at www.besi.com.
Imec performs world - leading research in nanotechnology.In our collaborative program on 3D Integration, we explore technology options and solutions for the cost - effective realization of 3D systems. The main focus of the program are 3D - SIC (stacked - IC) and 3D - SoC (system - on - chip). The 3D interconnections are via - middle TSVs (trough - silicon - via) at the global level.
We verify all chosen options through realistic demonstrator chips with functional test circuits. Our latest functional DRAM - on - logic IC chip proves the potential of 3D integration for next - generation low - power mobile applications. The 3D stack consists of imec’s proprietary logic CMOS IC stacked on top of a commercial DRAM using TSVs and micro - bumps.
ST is a global leader in the semiconductor market serving customers across the spectrum of sense and power technologies and multimedia convergence applications. From energy management and savings to trust and data security, from healthcare and wellness to smart consumer devices, in the home, car and office, at work and at play, ST is found everywhere microelectronics make a positive and innovative contribution to people's life. By getting more from technology to get more from life, ST stands for life.augmented. In 2011, the Company’s net revenues were $9.73 billion. Further information on ST can be found at www.st.com.
With over 3,500 employees and €1,286 million in revenue in 2011, Air Liquide Group’s Electronics World Business Line offers a large range of high added-value products (carrier and specialty gases, advanced precursors, chemicals) and services used in the manufacture of the state-of-the-art technologies that we see all around us: flat panel displays, computers, mobile phones, digital cameras, etc. The Group also offers its electronics expertise to the booming photovoltaic industry. The Group has developed the new ALOHA range of “advanced precursors”, which are designed on demand to match the exact process requirements of its semiconductor customers. Air Liquide also provides customers with an extended offer, which includes chemical equipment and piping installation for the distribution of ultra high purity fluids.
Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing innovative equipment, services and software to enable the manufacture of advanced semiconductor, flat panel display and solar photovoltaic products. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world. At Applied Materials, we turn today’s innovations into the industries of tomorrow. Learn more at www.appliedmaterials.com.
The Fraunhofer-Gesellschaft (FhG) focuses on contract research on behalf of industry, service sector and government. With more than 230 employees, the Fraunhofer Institute for Reliability and Microintegration FHG-IZM is one of the leading institutes in the field of microelectronics and microsystem packaging worldwide. Having it’s headquarter in Berlin, the institute covers all the competencies needed for advanced packaging concepts. Since 2010, IZM operates the center „All Silicon System Integration Dresden” (ASSID) which is integral part of Fraunhofer IZM’s wafer level system packaging and system integration activities.
SPTS Technologies designs, manufactures, sells, and supports advanced etch, PVD, CVD and thermal capital equipment and process technologies for the global semiconductor and micro-device industries, with focus on the advanced packaging/3D-IC, MEMS, LED , high speed RF device and power management markets. The solutions offered by SPTS include market-leading silicon etch, dielectric etch, dry-release etch, PVD, PECVD, APCVD and large batch vertical furnaces, available with a range of wafer-handling options applicable to R&D, pilot production, or volume production environments. For additional product or company information, contact:
Rudolph Technologies is a worldwide leader in the design and manufacture of defect inspection, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling device manufacturers to drive down the costs and time to market of their products. The company’s yield management solutions are used in both the wafer processing and final manufacturing of ICs, as well as in emerging markets such as LED and Solar. More information can be found on the company’s web site at www.rudolphtech.com.
Oerlikon Systems offers cost-efficient and flexible thin film deposition systems and processes to the semiconductor, and advanced nanotechnology markets. Applications for the semiconductor market include advanced packaging, power devices, read/write heads for hard disks, LEDs and Micro-Electro-Mechanical Systems (MEMS). Solutions in the advanced nanotechnology sector comprise photovoltaics, touch panels and thermoelectrics.
Beginning in 1998 with Yole Développement, we have grown to become a group of companies providing market research, technology analysis, strategy consulting, media in addition to finance services. With a solid focus on emerging applications using silicon and/or micro manufacturing Yole Développement group has expanded to include more than 40 associates worldwide covering MEMS, MedTech, Advanced Packaging, Compound Semiconductors, Power Electronics, LED, and Photovoltaics. The group supports companies, investors and R&D organizations worldwide to help them understand markets and follow technology trends to develop their business.
Trymax Semiconductor is a privately held global semiconductor company having it’s registered headquarters in Nijmegen, The Netherlands. Our core business is to support semiconductor manufacturers throughout the world with innovative solutions for plasma based, photo resist removal and surface cleaning equipment as well as isotropic etch systems used in the fabrication of integrated circuits. The company continues its tradition of combining innovative technical leadership with expertise in systems and process design to provide the semiconductor, telecommunications, MEMS, data storage, and related industries with a wide range of plasma etching solutions.
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