European 3D TSV Summit

 
     
 
EUROPEAN 3D TSV SUMMIT
 
2nd edition of the European 3D TSV Summit will be on Jan 21-22, 2014 in Grenoble (France)

2013 CONFERENCE PROCEEDINGS
 
 
 
SEMI Europe is proud to announce the European 3D TSV Summit (Grenoble - Jan 22-23, 2013).
   
The theme of the first-ever Summit is “On the Road towards TSV Manufacturing,” a critical issue as device designers and manufacturers increasingly cross into the third dimension due to the industry’s continuing pursuit of building more functionality into ever-shrinking silicon “real estate.”
   
The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies participating, showing a range from initial prototypes to high-volume production. Business-related aspects of 3D TSV will be adressed.
 
 European 3D TSV Summit will feature :
  • More than 25 presentations of executives and experts
  • One to one business meeting service
  • 500 m² of exhibiting area
  • A 1.5 hour market briefing powered by Yole Développement
  • CEA-LETI 300mm TSV line tour
  • Numerous Networking opportunities
  • Cocktail and Gala dinner
 Courtesy of Fraunhofer-IZM
Hotel booking:
We blocked some rooms in 3 hotels for the Summit attendees.
Book before Dec 21st to benefit from the discounts ( > Link to hotel booking )
 
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Summit Steering Committee:
  • Margarete Zoberbier, Business Development Manager 3D, SUSS  Microtec
  • Eric Beyne, director of Advanced Packaging, IMEC
  • Kevin Crofton, EVP and COO, SPTS
  • Albert Koller, VP and head of Semiconductor, Oerlikon Systems
  • Hannes Kostner, director of R&D Datacon, BESI
  • Thorsten Matthias, director of Business Development, EV Group
  • Jean Michailos, R&D Technology program manager for 3D, STMicroelectronics
  • James Quinn, VP of Marketing and Sales, Multitest
  • Martin Schrems, director of R&D, austriamicrosystems
  • Nicolas Sillon, head of 3D Integration, CEA-Leti
  • Juergen Wolf, department head of HDI WLP/ ASSID, Fraunhofer-IZM
 
 
 Grenoble: Major European Microelectronic cluster and Captial of the French Alps - Courtesy of AEPI