European 3D TSV Summit
EUROPEAN 3D TSV SUMMIT
2nd edition of the European 3D TSV Summit will be on Jan 21-22, 2014 in Grenoble (France)
2013 CONFERENCE PROCEEDINGS
SEMI Europe is proud to announce the European 3D TSV Summit (Grenoble - Jan 22-23, 2013).
The theme of the first-ever Summit is “On the Road towards TSV Manufacturing,” a critical issue as device designers and manufacturers increasingly cross into the third dimension due to the industry’s continuing pursuit of building more functionality into ever-shrinking silicon “real estate.”
The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies participating, showing a range from initial prototypes to high-volume production. Business-related aspects of 3D TSV will be adressed.
European 3D TSV Summit will feature :
Courtesy of Fraunhofer-IZM
We blocked some rooms in 3 hotels for the Summit attendees.
Book before Dec 21st to benefit from the discounts ( > Link to hotel booking )
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Program, hotels, venue, access, shopping area...
Summit Steering Committee:
Grenoble: Major European Microelectronic cluster and Captial of the French Alps - Courtesy of AEPI
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