Agenda - Beyond 300mm workshop

Workshop Agenda
 
Host:
 


Sponsors:
 
 



  
Media partner:














Tuesday, 24 April
 
13:00
Registration openning

 
13:30Welcome

Anne-Marie Dutron, Director, SEMI Europe Grenoble Office

Jean-Marc Yannou, President, IMAPS France
 
 
  
PANEL SCALE PACKAGING SESSION 
  Chairman: Andy Longford, senior consultant, PandA Europe 
   
13:40
An overview of recent panel-scale packaging developments throughout the industry

Jean-Marc Yannou, Senior Advanced Packaging analyst, YOLE Developpement
 
 
14:05
Challenges and Solutions for Cost Effective Next Generation Advanced Packaging

Heinz-Peter Wirtz, Business Development Executive, STATS ChipPAC
 
 
 
14:30
A Manufacturing Technology Perspective of Embedded Die in Substrate and Panel Based Fan-Out Packages

Bernd Appelt, VP Business Development, ASE
 
14:55
3D Laminate Component Packaging

Mark Beesley, COO, AT&S
 
15:20
COFFEE BREAK

Sponsored by AEPI and STMicroelectronics
 
 
 
 
 
450MM/PACKAGING SESSION:  
 
 
Chairman: Guy Dubois, Founder and GM, GDCL Management
 
 
 
 
15:50
G450C program scope at CNSE

Michael Liehr, VP for Research, CNSE Albany
 
 
16:15
450mm SOI wafer technology

Daniel Delprat, Advanced R&D Manager, SOITEC
 
16:40
Major considerations in 450mm Wafer Handling Systems

Bill Shaner, VP and GM Microenvironments Division, Entegris
 
 
17:05
Panel Discussion: "450mm packaging challenges and opportunities for equipment and materials suppliers"
 
Moderator: Yann Guillou, SEMI
 
Panelist:
 
- Andre Rouzaud, Deputy VP Microsystem, CEA-LETI
- Bill Shaner, VP and GM Microenvironments Division, Entegris
- Markus Wimplinger, Corporate Technology Development and IP Director, EVG
- Guilhem Delpu, Product marketing & collaborative programs manager, RECIF Technologies
- Guy Dubois, Founder and GM, GDCL Management
 
17:55
Closing remarks
 
18:00
NETWORKING COCKTAIL
  
Sponsored by ASE Group and STATS ChipPAC
  
With the participation of MiNaPAD exhibitors
 
 
 
 
 
Wednesday 25th - Thursday 26th April 
  
MINAPAD CONFERENCE: Program (link)