Agenda - Beyond 300mm workshop

Workshop Agenda		Host: Sponsors: Media partner:
Tuesday, 24 April
13:00	Registration openning
13:30	Welcome Anne-Marie Dutron, Director, SEMI Europe Grenoble Office Jean-Marc Yannou, President, IMAPS France

PANEL SCALE PACKAGING SESSION
	Chairman: Andy Longford, senior consultant, PandA Europe

13:40	An overview of recent panel-scale packaging developments throughout the industry Jean-Marc Yannou, Senior Advanced Packaging analyst, YOLE Developpement
14:05	Challenges and Solutions for Cost Effective Next Generation Advanced Packaging Heinz-Peter Wirtz, Business Development Executive, STATS ChipPAC
14:30	A Manufacturing Technology Perspective of Embedded Die in Substrate and Panel Based Fan-Out Packages Bernd Appelt, VP Business Development, ASE
14:55	3D Laminate Component Packaging Mark Beesley, COO, AT&S
15:20	COFFEE BREAK Sponsored by AEPI and STMicroelectronics

450MM/PACKAGING SESSION:
	Chairman: Guy Dubois, Founder and GM, GDCL Management

15:50	G450C program scope at CNSE Michael Liehr, VP for Research, CNSE Albany
16:15	450mm SOI wafer technology Daniel Delprat, Advanced R&D Manager, SOITEC
16:40	Major considerations in 450mm Wafer Handling Systems Bill Shaner, VP and GM Microenvironments Division, Entegris
17:05	Panel Discussion: "450mm packaging challenges and opportunities for equipment and materials suppliers" Moderator: Yann Guillou, SEMI Panelist: - Andre Rouzaud, Deputy VP Microsystem, CEA-LETI - Bill Shaner, VP and GM Microenvironments Division, Entegris - Markus Wimplinger, Corporate Technology Development and IP Director, EVG - Guilhem Delpu, Product marketing & collaborative programs manager, RECIF Technologies - Guy Dubois, Founder and GM, GDCL Management
17:55	Closing remarks
18:00	NETWORKING COCKTAIL Sponsored by ASE Group and STATS ChipPAC With the participation of MiNaPAD exhibitors

Wednesday 25th - Thursday 26th April

MINAPAD CONFERENCE: Program (link)