ISS Europe 2012 - Abstracts and Biographies

ISS Europe 2012 - Abstracts and Biographies

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Keynote: Key Enabling Technologies for a Competitive Europe: Challenges and Solutions

Gabriel M. Crean, VP for Technology

Professor Gabriel Crean is Scientific Director of the Division of Technological Research of the Atomic Energy Commission of France. This division includes three world class research institutes in Micro-NanoTechnologies (LETI), New Technologies for Energy (LITEN) and Information Technology (LIST) in Paris and Grenoble. He is an Advisor to the Administrator General (President) of the Institut National Polytechnique de Grenoble (INPG) on research politics as well as a visiting Professor. He is an invited Research Professor at the Materials Research Institute, Northwestern University, USA. He is a Fellow of the Institute of Engineers of Ireland and a Fellow of the Institute of Physics of the U.K. 
Prior to his current responsibilities, Professor Crean was Vice President for Research and Innovation at Athlone Institute of Technology and an Adjunct Professor at Dublin City University within the Faculty of Science and Health. He is the Director of the Irish Research Council for Science, Engineering and Technology funded “International Centre for Graduate Studies in Micro- and Nano-Engineering”, which is an initiative amongst twelve academic partners in Europe, Asia and the US. He was the Director of the Irish National Microelectronic Research Centre (Tyndall Institute) for six years and Director of the Enterprise Ireland Optoelectronics Research Centre, both at University College Cork, Cork, Ireland and Professor of Microelectronic Engineering in the Department of Microelectronic Engineering at University College Cork. He has been awarded Scholarships from both the French Government and the Centre National des Telecommunications (CNET), France. 
At an international level, Professor Crean is the immediate Past President of the International Union of Materials Research Societies ( He is President Emeritus of the European Materials Research Society (E-MRS). He was the Irish Representative to the European Science Foundation (ESF) Standing Committee for Physical and Engineering Sciences from 2000-2007 and remains on this committee as an invited observer of the European Materials Forum. He has acted as a consultant for European Governments and the European Union (EU) Research Directorate. Most recently, he was a member of two international panels reviewing the Spanish and Finnish Government programmes in ICT related science, technology and innovation. Professor Crean is a co-founder of three hightechnology start-up companies, FireComms Ltd., Optical Metrology Innovations Ltd and Biosensia Ltd. 
Professor Crean was a Member of the High Level Advisory Team working with the Private Office of European Commission President Jose Barroso, on a prefiguration of the European Institute of Technology (EIT) during 2006-2007. He was a coordinator of the EU Directorate General Education and Culture funded pilot project ComplexEIT, to define innovative governance and organisation models for future European initiatives, such as the European Institute of Innovation and Technology. 
Professor Crean has been Chairman of several international conferences and symposia.
Most recently, he was co-chair of the first IUMRS World Materials Summit held in Lisbon, Portugal under the auspices of the Portuguese Presidency of the European Union.

Semiconductor Manufacturing in Europe – a Sustainable Investment

Michael Hummel, Managing Director
Texas Instruments

Dr. Michael Hummel currently is the Texas Instruments Fab Manager in Freising, Germany. He studied Chemistry at the universities of Tubingen, Germany and Rome, Italy and received his Ph.D. degree in Organic & Physical Chemistry from the University of Tubingen in 1991. In the same year he joined the IBM Microelectronics Division in Germany and started his professional career as a Process Engineer in the IBM 200mm-Wafer-Fab in Böblingen. In the subsequent years he held several managerial positions in Engineering, Planning & Logistics, Manufacturing. With the foundation of Philips/IBM Joint Venture in 1996 he became Director of Marketing & Supply Chain Management. In 2001 he was appointed Vice President of the Philips Business Line Mobile Display Drivers headquartered in Zürich, Switzerland and in 2003 he assumed responsibility for the entire Display Driver Business and moved his headquarter to Taipei, Taiwan. In 2005 he returned to Germany as VP & General Manager of Philips Semiconductors Germany and head of the Wafer Fab Operation in Böblingen. In that same year he also got nominated as a member of the SEMI European Advisory Board.
In 2007 he joined Texas Instruments in Dallas, Texas, where he served as the Operations Manager of TI’s largest 200mm Fab. In 2009 he moved to Freising, Germany where he currently holds the Fab Manager position of TI’s Manufacturing & Test Operation

Semiconductor Manufacturing has a long tradition in Europe and many important European milestones are tied to the success of that industry. Nevertheless the trend is clear: most new investments in wafer fab capacity have shifted away from Europe towards Asia. A broad variety of reasons have supported and accelerated that shift towards the East over the past 3 decades - ranging from inflexible labor laws, high labor costs, high infrastructure costs and rigid environmental regulations all the way to attractive government support packages that many Asian locations offer.
One of the important elements of Texas Instruments’ Analog strategy is the strong commitment towards internal manufacturing – with 14 Wafer Fabs and 6 Assembly & Test sites we are producing well over 60% of our products internally. Our manufacturing footprint also is the base for our internal process technology development, which ensures close alignment of our technology roadmaps with the product requirements and needs of our customers.
At TI we are following a strategy of being close to our key customers and markets and at the same time trying to maximize the robustness of our supply chain. As a result, our manufacturing organization is a truly global one with a strong presence in all relevant parts of our planet.
In line with that strategy, 2 of our 14 Wafer Fabs are located in Europe and we have made substantial investments in these sites over 40 years, proving that European manufacturing locations remain competitive.
Over last 20 years many of the economic and legal factors in Europe that largely determine the competitiveness and the flexibility of an investment-intense activity such a Wafer Fabs, have significantly improved. In addition our highly educated and very experienced employees with all their creativity and motivation have significantly contributed to achieving our today’s competitive position.
There are still critical success factors to be addressed to further strengthen the position of semiconductor manufacturing in Europe. Therefore close alignment on our side on straight forward and realistic policies and strategies is required in order to get the political support that is required to ensure Europe will be the location for sustainable investments, now and in the future.

Power Semiconductors – The Key to Energy Efficiency

Reinhard Ploss, Member of the Management Board and Operations, R&D and Labor Director

Reinhard Ploss joined Siemens/Infineon in 1986 as a process engineer for ion implantation in wafer manufacture at Munich, focusing on process development, yield and quality improvement. After about 1 year he assumed responsibility for ion implantation process technology and later also for epitaxy. In 1992 he moved to Villach, where he was initially responsible for the transfer of the epitaxy process and later for the coordination of the product transfer. In 1996 he went back to Munich and took charge of the Power Semiconductor Business Unit with a focus on development and manufacturing. Additionally, he was appointed as President of eupec GmbH Co. KG in 1999. Since 2000 he headed the Automotive & Industrial Business Group, which then encompassed power semiconductors, electric drives, automotive applications and the Microcontroller Business Unit. In 2005 Reinhard Ploss assumed responsibility for manufacture, development and operational management in the Automotive, Industrial & Multimarket Business Group. June 2007, Dr. Reinhard Ploss became a member of the management board of Infineon Technologies AG.

Power Semiconductors had become a focus for the semiconductor industry as it is not only key to improve the energy efficiency of more or less all equipments and systems using electrical energy but also important to increase the ratio of renewable energy and its transport in the grid.
The base of this success is a constant increase in cost-performance of power devices, driving frontend and backend technology roadmaps. Power devices are basically a More-Than-Moore technology but it is also possible to formulate the Moore’s Law of Power, which means a constant increase in power density basically measured in Ampere/cm^2. In order to enable these power densities modern power devices do not use the finest pitch but 3-D integration, new substrates like SiC or GaN, and power copper as interconnect technology. In recent times also packaging has become a focus of development to manage high currents and temperatures, requiring new manufacturing technologies and the development of new materials.
Manufacturing technology and special processes are key differentiators for advanced power technologies. As a consequence most of today’s suppliers of power semiconductors rely on in-house manufacturing to protect their know-how. Parallel to the development of specific manufacturing capabilities rising demand and constant price pressure require increasing the wafer diameter. For a long time 300mm seemed to be impossible for power, but also this hurdle has been taken recently.
We will give an overview on the major development of frontend and backend technologies and the role of manufacturing for Power Devices.

Foundry Manufacturing in Europe

Rutger Wijburg, Vice-President and General Manager

Rutger Wijburg is currently VP & General Manager of GLOBALFOUNDRIES Fab1 in Dresden. Before that he was SVP Operations Manager Front End at NXP Semiconductors. In thisposition he was responsible for the NXP wafer fabs including strategic options such asoutsourcing and building partnerships. He was also responsible for Real Estate andFacilities within NXP. Prior to this position in NXP, he has been managing fab operations in theNetherlands, Switzerland and the USA that manufactured Bi/CMOS and MEMSdevices. Rutger Wijburg holds a Ph.D. in Electrical Engineering from the University ofTwente, the Netherlands.

Semiconductor technology is at the heart of today’s technology revolution. Mobile device makers, to state an example, are increasingly turning to advanced process technology to push their products into higher performance and greater power-efficiency. This trend is being driven by the fabless IC-industry, which relies on close collaboration with foundry partners to drive continued innovation. In his talk, Rutger Wijburg will highlight this transformation of our industry with GLOBALFOUNDRIES European manufacturing site as a proof point.


Venture Capital – a Potential Accelerator for Innovative Industries

Claus Schmidt, Managing Director
Robert Bosch Venture Capital

Claus, one of the two founders of Robert Bosch Venture Capital GmbH (RBVC), joined RBVC in January 2008. RBVC is the corporate venture capital unit of the Robert Bosch GmbH and invests in innovative start-up companies world-wide. The main investment focus is on technologies and services in the field of automation and control (including semiconductors, sensors, actuators and all corresponding electronics), cleantech, enabling technologies (such as networks, communication technologies, software, system engineering) and new materials (for more details see
Claus spent about 24 years in the industry in various positions after finishing his studies and Ph.D. in physics. He worked for IBM and Digital Equipment Corporation (DEC) before he joined Robert Bosch GmbH in 1992.
In Bosch Claus held management positions in the central research lab and in operational units mainly in the field of automotive electronics and systems engineering. He also founded a startup company out of Bosch working on liquid crystal displays. The last 5 years before joining RBVC Claus headed the semiconductor engineering and design organisation of the Robert Bosch GmbH.

A prospering and successful high-tech industry needs, apart from all the technical progress, a creative and entrepreneurial environment fostering the transfer of ideas and patents into successful products as well as enough capital to finance the corresponding activities. Venture Capital (VC) is an asset class belonging to Private Equity (PE) and dedicated to provide equity for so-called start-up companies (private companies with a very high potential of growth) for a limited timeframe (3 - 10 years). This will support the start-ups from the proof-of concept state through the development and expansion phase towards an exit either via IPO or a trade sale. Simultaneously most of the VC companies provide additional support to the start-ups by utilising their large networks (e.g. to find customers, partners, employees).
The presentation gives an overview on the value add of VC in general as well as insights into the status if the VC industry and especially some details on high-tech markets as semiconductors. In summary the VC investments are decreasing with respect to the money invested per start-up and in total. This is especially true for capital heavy start-ups. We will then discuss the main foundations for a successful VC industry and their status in EU and Germany which is not favourable compared to some of our main competitors. Nevertheless although EU does have many challenges in providing VC to support young start-up companies there are possibilities to improve the situation by efforts to be lead by politics as well as by society. 

Opportunities and Challenges of Plastic Electronics

Ed van den Kieboom, President
Plastic Electronics Foundation

Ed van den Kieboom has over 25 years of hands-on management experience in launching, developing and leading both public and private technology companies. In his professional career he worked from 1986 through 1992 as a marketing and investment director for the Dutch government in attracting technology based companies from the US and the Far East.  After establishing his own management consulting firm in 1992 he assisted as an outside consultant, major companies such as Philips Electronics, and Mitsubishi Chemicals. Furthermore he established and/or assisted in establishing, over a period of 12 years, 7 companies in Europe in the areas of optical storage media, micro-electronics, information and communication technology. From 2002 to 2004 he assisted as an outside consultant to internationalize the scope of the Dutch Polymer Institute, a top technology institute in the Netherlands. In 2005 he founded and managed the Plastic Electronics Foundation, a worldwide technology platform for printable organic electronics, with stakeholders from both the academia, research institutes and industry.

Plastic Electronics, also known as printed electronics, polymer electronics and organic electronics, has been under development for over 15 years. It has hold the promise ever since to change complete industries such as of consumer electronics, solid state lighting, energy, consumer goods, etc. The OLEDs for displays and lighting are amongst the most promising and fastest moving areas of commercialization, with 55” AMOLED panels recently presented by LG and Samsung at the CES in Las Vegas. What will be the role of European stakeholders to play in this high value and high volume game?


IC Industry Outlook in an Uncertain Economy

Bill McClean, President
IC Insights

Mr. McClean began his market research career in the integrated circuit industry in 1980 and founded IC Insights in 1997. During his 32 years of tracking the IC industry, Mr. McClean has specialized in market and technology trend forecasting and was responsible for developing the IC industry cycle model. At IC Insights, he serves as managing editor of the company’s market research studies and reports. In addition, he instructs for IC Insights’ seminars and has been a guest speaker at many important annual conferences held worldwide (e.g., SEMI’s ISS and Electronic Materials Conferences, The China Electronics Conference, and The European Microelectronics Summit). Mr. McClean received his Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois.

Many long-term indicators and correlations for IC market growth did not hold in 2011 and the industry has entered uncharted territory for which there is little or no precedent. Although high uncertainty looms over the global economy, sales of smartphones and tablet PCs are still soaring. IC Insights will present its forecast for the IC market in the context of the IC industry cycle model. In order to make sense out of the current turmoil, a top-down analysis of the IC market will be given and include trends in worldwide GDP growth, electronic system sales, and semiconductor industry capital spending and capacity.


Time For Cool Heads & Vision?

Malcolm Penn, CEO
Future Horizons

Malcolm Penn is the Chairman, CEO, and founder of Future Horizons, Europe's leading semiconductor industry analyst. He is also the President of Future Horizons' Moscow-based subsidiary firm, East-West Electronics, the world’s top market research consultant on the Russian and East European electronics industry.
Established in April 1989, Future Horizons provides business support services for use in opportunity analysis, business planning and new market development in the semiconductor and related industries. Its areas of activity include market research reports, custom consulting, industry forums and seminars, IC and system design evaluation services, and industry training.
Mr. Penn has over 45 years experience in the electronics industry and for most of that time has worked extensively throughout Europe as well as in the United States, the former USSR, Japan and Korea. Future Horizons was also a member of the 1994 European Commission sponsored Cornu Panel of senior industry executives responsible for publishing the “Report of the European Microelectronics Panel” used to help formulate the strategy for EC microelectronics support in Europe.
Prior to establishing Future Horizons, Mr Penn was Vice President of Dataquest and Director of Dataquest's European Operations, responsible for establishing all Dataquest's European-based research operations. Previously he was Manager of Component Engineering for ITT Europe (now Alcatel) and prior to that held various operations and marketing management positions with the worldwide ITT Semiconductor group.

Future Horizons will examine the four basic industry drivers – The Economy, IC Unit Demand, Wafer Fab Capacity and IC ASPs – in a top down/bottoms up view of the underlying market trends looked at both in a laser-sharp analytical way (the reality) and how the industry feels (the perception). 2011 saw 2010’s boom turn to dust, yet the year romped home with renewed strength and vigour; despite all of the overall economic uncertainty. Caught in a turmoil of conflicting and contradictory data, most firms ended the year with a strategy based on holding back both investments and expenditures. Yet the underlying IC demand remains firm, with low levels of inventory and negligible overcapacity. The 12:12chip market growth rate may have seemed to have slowed in 2011, but how much of this reflected underlying demand and how much just the deception of numbers? What is the underlying health of the industry? What will be the real market opportunities for 2012? Are the supply-side dynamics good bad or indifferent, and who will be the main beneficiaries in 2012?

Innovation in Israel and Beyond, a Regional Perspective

Ari Komeran, TME EMEA Manager, Director Israel Open Innovation Center

As Intel TME EMEA Manager and Director of the Israel Open Innovation Center, Ari is responsible for leading manufacturing capital equipment development with suppliers based in Israel and Europe and for leading Intel Israel's business initiatives through working with the Israeli government and academic institutions. During his 16 years at Intel, he held numerous engineering and engineering management positions. He was responsible for introducing and implementing APC infrastructure across Intel's manufacturing. Ari was later responsible for factory productivity where he established the foundations for Predictive Maintenance capability and co-developed with ISM the first industry guidelines. Recently, he led the creation of Intel's Academic Research Institute for Computational Intelligence. He earned double B.Sc. degrees in Physics and in Materials Science from the Ben Gurion University of the Negev in 1994 and proceeded with MBA studies at the Ben Gurion University of the Negev.


Israel has the largest startup concentration in the world, with more venture capital per capita coming to Israel each year than any other place. More Israeli companies are traded on Nasdaq than all of Europe combined. Is Israel really an innovation economy? We are not to discuss the mid-east peace, rather the economic miracle of Israel.
Israel is perceived as a “Start-up nation”. Is it the source components and the interaction between People, Culture and Government that created a unique model for innovation? With the current global economic turmoil, we will try to assess whether this paradigm can sustain another recession as well as try to assess one key ingredient that Israel needs in order to keep up with its Innovation capacity.
From 5 employees in 1974 Intel today employs over 7800 people. With over $9B of investment, Intel is presently is the largest private exporter in the Israeli industry, influencing over 2% of Israel's GDP. Intel Israel Design Center is one of the two most strategic Design Centers. 
Europe plays a vital role for Intel's manufacturing and Intel has a significant influence on the European Industry. We will discuss both these important elements as a key for success. Specifically the impact of Intel on the European Industry, mutual opportunities between Europe and Intel including R&D investments, supplier capital spending, and collaborations as a key for innovation and business growth.

The Semiconductor and Manufacturing Industry Overall Challenges in Russia – Prospects for Growth and Market Opportunities for Local and Foreign Companies

Beatrice Shepherd, Vice President, CEE, Russia & CIS
Frost & Sullivan

Over 12 years of management consulting experience Specialising in the CEE, Russia and CIS region. Operational responsibility for Frost & Sullivan offices in Warsaw and Moscow; reporting to the Board of Frost & Sullivan. Based in Moscow. Particular expertise and close association with global major companies in:
- Positioning strategy and corporate development plans
- Diversification and new market entry
- Business & market strategy
- Benchmarking & positioning
Beatrice has particular interest in new technologies including Biotech and worked with major global companies as well as Russian enterprises on developing ways to grow business through innovation.

According to Frost & Sullivan forecast Russian semiconductor market is to triple by 2015. Present data showed that in 2010 the Russian semiconductor market was valued at US $1.2 billion. In the optimistic scenario of market development, Frost & Sullivan forecasts that by 2015 the market could reach US $9.9 billion. The scenario envisages positive effects from manufacturing localisation by the foreign investors and large-scale investment projects (LED lighting, smart grid, smart cards, etc.).
However, numerous strategic and operational challenges need to be addressed for the semiconductor industry in Russia such as:
• the right timing of market entry
• deciding which business model to follow
• creating an attractive holistic ecosystem
• attracting the right partner
One on the most important question for the manufacturing industry in Russia is: what new technologies and applications are worth to focus on in Russia going forward while new investments will be taking place supported by the government programmes and funds as well as growing collaboration between local and foreign investors.


Revival of the Russian Microelectronic Industry. Challenges and Solutions (based on the Angstrem-T project)

Nikolay Lisay, Strategy & Business Development
Angstrem Group

Nikolay Lisay joined Angstrem group of companies in 2008. Since that time he worked at several executive positions – Business Development Director, Board member, Chairman, General Director. His main responsibilities in the company were focusing on corporate strategy, general management, relations with the governmental agencies and international relations.
Prior to Angstrem group Nikolay served 4 years as General Manager Government Relations AMD Russia and was initiator of the deal between AMD and Angstrem company regarding technology and tool line transfer. At AMD he was responsible for GR, region strategy development, special projects execution and coordination with strategic partners.
Before joining AMD Nikolay managed major Russian software house Lieks for 5 years where he was one of cofounders. At the beginning of 90-ties Nikolay worked on senior management positions in large multinational and Russian companies Unysis, SD-Scicon, TWN, IBS.
Nikolay has more than 26 years of experience in management, business development, sales and marketing for hi-tech industry.
Nikolay holds Ph.D. in the field of artificial intelligence, for several years served as Deputy Chairman of the IT Expert Council by Council of Russian Federation.

One billion US dollars investments in a new Fab establishment in Zelenograd (Moscow region) is only a first step towards revival of Russian microelectronic industry. About 3 years ago a decision was made by group of private investors to invest in a new microelectronic Fab as a response to the Russian market demand and understanding of transition to innovative economy necessity. This project was initiated by the group of enthusiasts who gained a lot of experience devoting their lives to Russian microelectronic industry. It is necessary to mention that in the “best soviet time” soviet microelectronic industry occupied the third position in the world after US and Japan (in terms of production capacity). The project got the name “Angstrem-T” (Technology) as it is based on the team of JSC “Angstrem” – the leading scientific and industrial amalgamation in Soviet microelectronic industry.
The main idea of Angstrem-T project is to build a kind of microelectronic “boutique” providing wide range of scientific, engineering and production services to the customers who are looking for fast, reliable and nonstandard solutions, starting from schematic development and up to hot lot prototyping and production. If there is a need a new technological processes development will be proposed as well. As a basic technology Angstrem-T purchased technological license and tool line from AMD. This basic technology will be amplified by set of several options, like RF, LP, HV, embedded flash, processors cores etc. At the first phase future Angstrem-T Fab will be able to produce 15K 200 mm wafers per month with topology 110nm. For the next phase there is a plan to implement 45-28 nm tool line.

Future Transistors… Options and Challenges…

Paolo Gargini, Director of Technology

Dr. Paolo Gargini is the Director of Technology Strategy for Intel Corporation in Santa Clara, California. Dr. Gargini is also responsible for world-wide research activities conducted outside Intel for the Technology and Manufacturing Group by consortia, institutes and universities.
Dr. Gargini was born in Florence, Italy and received a doctorate in Electrical Engineering in 1970 and a doctorate in Physics in 1975 from the Universita di Bologna, Italy, both with full honor and marks.
He has done research at LAMEL in Bologna, Stanford Electronics Laboratory, and Fairchild Camera and Instrument Research and Development in Palo Alto from 1970 to 1977. Since joining Intel in 1978, Dr. Gargini has conducted studies on Process Reliability; he was responsible for developing the building blocks of HMOS III and CHMOS III technologies used in the 1980’s for the 80286 and the 80386 processors. In 1985 he headed the first submicron process development team at Intel.
Dr. Gargini has been the Chairman of the Executive Steering Council (ESC) of I300I and, subsequently, of International Sematech from 1996 to 2000. He is now a member of the Sematech Board. Since 1998, Dr. Gargini has been the Chairman of the International Technology Roadmap for Semiconductors (ITRS).
He is a member of various technical committees and technical advisory boards for organizations such as the Silicon Research Corporation (SRC), and the Technology Strategic Council (TSC) of the SIA in the US, IMEC in Europe, ASET and MIRAI in Japan.
He also heads the International EUV Initiative (IEUVI), formed in 2001, that fosters cooperation and coordination among the largest EUV consortia in the world.
Dr. Gargini is the facilitator of the International Consortia Cooperation Initiative (ICCI). This initiative, started in 2000, fosters exchange of information among a selected group of leading consortia and institutes in the world.
In September 2003, Dr. Gargini was included by EE Times in a very selected group of Influencers of the semiconductor industry with the following motivation: “EE Times has chosen 13 people who are influencing the course of semiconductor development technology and taking it into realms that exceed the bounds set by the inventors of the transistor more than 50 years ago. With more than 25 years in the industry, Gargini is helping to navigate tough process and manufacturing waters.”
Dr. Gargini initiated and became the first Chairman of the Governing Council of the Nano Electronics Research Initiative (NERC) funded in June 2005 by SIA. This Initiative is aimed at supporting and focusing research in universities towards subsequent commercialization of Nanoelectronics. NERC actively cooperates in this effort with USG organizations such as NNI, NSF, DARPA, and NIST.

Geometrical Scaling has powered the semiconductor industry for more than 30 years in the past century. Smaller, faster and cheaper transistors have enabled more complex devices that have created brand new industries and reinvigorated old ones.
In the past 10 years the industry has transitioned to the Equivalent Scaling methods in order to reduce horizontal physical dimensions while utilizing completely different physical phenomena and new materials to continuously improve performance. Strain silicon and high-k/metal gate have successfully been introduced into production.
Completely new transistors utilizing the vertical dimension (tri-gate) are now in production enabling new more attractive products.
Despite these accomplishments the cost/cm2 of silicon wafers has been increasing and now the transition to 450mm wafers in diameter is looming in the not too distant future as a way of reducing product cost.
The main trends of this new industry will be discussed.

MEMS: A New Leadership from European Semiconductor Industry!

Benedetto Vigna, Corporate Vice President, General Manager of the Analog, MEMS and Sensors Product Group

Benedetto Vigna is Corporate Vice President, General Manager of the Analog, MEMS and Sensors Product Group, and has held this position since September 2011.
Vigna joined STMicroelectronics’ R&D Lab in Castelletto, Italy, in 1995. Six years later, he was appointed Director of the MEMS Business Unit, responsible for design, manufacturing and marketing of ST’s MEMS accelerometers and gyroscopes. These have been successfully adopted by large consumer equipment manufacturers for motion-activated user interfaces in many popular devices, including the Nintendo Wii game console and a wide range of smartphones and tablets. In 2007, Vigna’s organization was transformed into a Product Division and his scope was subsequently enlarged to include management of Sensors, RF, High-Performance Analog and Mixed Signal, as well as Interface, Audio for Portable, and General-Purpose Analog products.
Vigna has filed more than 150 patents on micromachining to date, authored numerous publications in this field, and delivered many invited speeches at international conferences. He also served as industrial consultant for the President of the Italian Scientific Research Center. He was also nominated for 2010 Best Patent Award by European Patent Office.
Benedetto Vigna was born in Potenza, Italy, in 1969, and graduated with a degree in Subnuclear Physics from the University of Pisa, Italy.

European Hi-Tech Leadership is not anymore an oxymoron. Genius, innovation, lateral thinking, insight, agility, strong customer partnership have been key elements for the fast growth of a European Semiconductor Company, like STMicroelectronics. STMicroelectronics is the undisputed leader in the field of MEMS, both as a joint technology development partner or as an integrated device manufacturer. Today STMicroelectronics is the company with longest and most diversified high volume manufacturing expertise in both micro-machined Sensors and Actuators.
Almost twenty years ago STMicroelectronics started the high volume production of the 6” micro-machined wafers for thermal inkjets, five years ago it triggered the dawn of the “MEMS Consumerization Era” with a compact low power 3-axis accelerometer.
Before 2006, MEMS sensors were used in a few applications such as airbag systems, but they were too bulky, too power-hungry and too expensive to be used in consumer applications. ST developed and patented innovative MEMS structures that were smaller, more robust and required less electrical power to operate, while still delivering very high performances. Moreover the Company took the bold step to invest and set up the world’s most advanced MEMS manufacturing infrastructure from 8” wafer Front-End line in Italy to fully automated Back-End line in Malta. The 200mm wafer processing facility in Milan was inaugurated in November 2006 and it is fully dedicated to producing MEMS devices such as accelerometers, gyroscopes and pressure sensors.
Since July 2006, STMicroelectronics has been producing 8” micro-machined THELMATM wafers and almost 2 Billion pcs of Land Grid Array Packaged Motion Sensors. STMicroelectronics has been able to sustain relentlessly the growth of high volume consumer applications in Mobile Phones, Tablets, Digital Still Cameras, Gaming Controllers and Laptops and it’s now doing a bold step in the Automotive market, bringing to this traditional market the advantage of economy of scale of the consumer market.
Over its long MEMS history, STMicroelectronics has been able to start the high volume production of many different MEMS products:
• Thermal inkjets
• Multiple axis Accelerometers, Gyroscopes and Compasses
• Microphones
• Altimeters
• iNEMOTM, i.e. combinations of different sensors with the ability to process the data.
• Biological sensors
In this talk I will describe the path to the leadership, highlighting the key success factors, and the new market trends we foresee.

Complex Digital Product Design for Next Generation Technologies

Tudor Brown, President

Tudor Brown was one of the founders of ARM. Before joining the Company, he was at Acorn Computers where he worked on the ARM R&D program. He joined the Board in 2001 and became President in 2008 with responsibility for developing high-level relationships with industry partners and governmental agencies and for regional development. His previous roles include Engineering Director and Chief Technology Officer, EVP Global Development and Chief Operating Officer. He is a Fellow of the Institution of Engineering and Technology and is a non-executive director of ANT plc. He currently sits on the UK Government Asia Task Force.

We are all familiar with the explosion in the numbers of digital products. Whilst these are often easy-to-use consumer products, the increasing complexity required to bring them to market is a challenge and opportunity for the entire industry.
In this talk Tudor Brown discusses the requirements to enable these very high volume products. He will take us through the system design challenges and the changing requirements on the supply chain.

European 450mm Equipment & Materials Initiative White Paper

Bas van Nooten, Director European Cooperative Programs

Sebastiaan (Bas) van Nooten graduated from the Technical University Delft in 1971. After his military service he was involved in processing and design of integrated circuits till 1981 at Telefunken, Germany. He moved back to Holland, where he joined an IC design house as group leader. In 1985 he moved to the semiconductor equipment industry in several positions, mainly as European product specialist for several equipment types. He joined ASM in 1989, first heading the German office in Munich, later as Sales Manager Europe in the Dutch head office. In 2007 he was appointed as Director of European Cooperative Programs, where he is engaged in several European cluster programs, like the Steering Group Technology of Catrene and currently also as project coordinator for an ENIAC project. He is the current spokesman of the Steering Committee of the 450mm Equipment & Materials Initative EEMI450. He has several patents on his name.

In 2009 the European Equipment and Materials industry has decided to found a 450mm dedicated initiative, called EEMI450, to bring the interested parties together, to promote common 450mm efforts and to induce common 450mm projects.
In the EEMI450 Whitepaper, which will be presented, the reasoning behind the 450mm transition is explained, the importance of the 450mmm wafer transition for the European semiconductor related E&M industry is highlighted and the goals of the EEMI450 initiative are defined.

Key Enabling Technologies in the Digital Agenda and other EU policies

Carl-Christian Buhr, Member of the Cabinet of Commissioner Neelie Kroes
European Commission

An economist and computer scientist, Dr. Buhr is a member of the cabinet of Digital Agenda Commissioner and EU Commission Vice-President Neelie Kroes. Among others, he advises her on ICT research policy, including in the field of micro-/nano-electronics, standardisation, data protection, interoperability policies as well as the European Cloud Computing strategy. He previously dealt with antitrust and merger control investigations by the Commission, such as the Microsoft antitrust case and the Oracle/Sun Microsystems merger.

The talk will set out European Commission Vice-President Kroes's thinking on the current and future support to R&D&I in the field of micro-/nano-electronics.

Presentation of the EC Report of Benefits and Measures to Set Up 450mm Semiconductor Prototyping and to Keep Semiconductor Manufacturing in Europe

Willy Van Puymbroeck, Head of Unit Nanoelectronics, DG Information Society and Media
European Commission

Willy holds a Ph.D in Physics from the Universitaire lnstelling Antwerpen. He has joined the European Commission in the late 80's and throughout his twenty-five year career he has been responsible for research initiatives under different European Framework Programmes and author of several articles in the domain of physics, information technology and integrated manufacturing. Only recently appointed Head of Unit in DG INFSO Nanoelectronics and in charge of the follow-up of the ENIAC Joint Undertaking, will be responsible to:
- Promote the transfer of R&D results into a digital single European market, while supporting innovation in advanced ICT products and systems of a high societal and economic relevance;
- Promote nanoelectronics as a key enabling technology (KET) and enhance the competitiveness of the European landscape globally while maintaining and attracting new investments in nanoelectronics on the European territory;
- Advocate the implementation of the Digital Agenda and of Horizon 2020, the new Research and Innovation EU Framework Programme.

The presentation will touch on two main topics.
At first a short overview will be given of on-going projects related to 450 mm that are financed by the European Union through the seventh Framework Programme.
Second the results from a study entitled 'Benefits and Measures to Set Up 450mm Semiconductor Prototyping and to Keep Semiconductor Manufacturing in Europe: The role of Public Authorities and Programmes' commissioned by the EC will be presented.
Essentially the study puts forward three scenarios for Europe's involvement in 450 mm semiconductor manufacturing.
The study could trigger a broader discussion on the future, opportunities and priorities, of the semiconductor value chain in Europe. Such a discussion must involve all stakeholders in Europe.

Leading-Edge Technology Vital for Future Competitiveness

Luc Van den hove, CEO

Luc Van den hove is President and Chief Executive Officer (CEO) of imec since July 1, 2009. Before holding this position he was Executive Vice President and Chief Operating Officer. He joined imec in 1984, starting his research career in the field of silicide and interconnect technologies. In 1988, he became manager of imec’s micro-patterning group (lithography, dry etching); in 1996, Department Director of Unit Process Step R&D; and in 1998, Vice-President of the Silicon Process and Device Technology Division. In January 2007, he was appointed as imec's EVP & COO. Luc Van den hove received his Ph.D. in Electrical Engineering from the University of Leuven, Belgium. He has authored or co-authored more than 100 publications and conference contributions.

Nanoelectronics is playing a game-changing role in our professional, private and social life. The last 20 years have been marked by a (r)evolution in ICT, healthcare, transportation, energy generation and consumption, all thanks to the amazing evolution in nanoelectronics and related technologies.
This (r)evolution has also changed the success of business. Diverse technologies and expertise need to be combined at an accelerated speed to stay at the forefront of the products of the future.
Open innovation is more than ever indispensable. A business model combining critical mass, bringing the best brains and technologies together, leveraging on a full industry value chain integration, will make the success of every company, country and continent. There’s no doubt, more than ever, innovation will occur at the boundaries of disciplines, at the boundaries of countries and continents.

Progress and Challenges for Industrialization of New Lithography Technologies

Peter Jenkins, VP Marketing

Peter Jenkins joined ASML in 1991 where he has held various product and commercial management positions including international assignments to South Korea in 1996 and Hong Kong in 1999. Mr. Jenkins returned to The Netherlands as Vice President of Marketing in 2005. Prior to joining ASML, Mr. Jenkins gained extensive experience in Lithography and Semiconductor processing at LSI Logic and Plessey Research in the United Kingdom. Peter studied BSc Economics at Bath University, England.

As an industry we have kept Moore's law alive, albeit at the cost of complexity and shrinking tolerances. Often the path to the solution that best fits a chip manufacturer's needs is not immediately obvious. As an industry leader in lithography equipment, ASML provides crucial support for the semiconductor shrink roadmap.
ASML continues to develop immersion lithography scanners to support cost-effective double patterning and even quadruple patterning, supported by an expanding portfolio of Holistic Lithography products that can predict and adjust for shrinking tolerances. 
At the same time, EUV lithography has become a reality with five second-generation EUV systems already exposing wafers at customer manufacturing sites. Offering single exposure shrink and many other advantages over more complex technologies, EUV is in the process of becoming a stable, high-productivity lithography platform for the next decade of shrink, offering several more benefits for the early adopters. 
This presentation connects the crossroads faced by today's pluriform chip manufacturing industry and ASML's commitment to help the industry continue Moore's law.


EUV Sources Enabling Volume Production

Marc Corthout, President
XTREME Technologies

Marc Corthout is President of the XTREME technologies company, a 100% daughter of the USHIO Group of Japan. XTREME has produced all EUV light sources for the Alpha phase of EUV Lithography (both for ASML as well as Nikon) and has last year installed its first Beta-source as part of the ASML NXE 3100 at Imec.
Marc has a 32+ year career in the Electronics Industry mostly on first-of-a-kind product development. He joined Philips EUV GmbH over 5 years ago and has grown the team and merged it with the original XTREME team over the last years, creating a 200+ people team that designs, delivers, and supports highly-complex EUV light sources currently in the field for wafer exposures.
Marc has a BSc degree in Physics and a MSc degree in Electrical Engineering from Leuven University, Belgium, and a PhD in Applied Mathematics from Leiden University, The Netherlands.

EUV Lithography brings the wavelength of the light to exposure wafers with from the current 193nm down to 13.5nm, enabling the continuation of Moore’s Law for quite some semiconductors process nodes to come. EUV light however can only be generated and used in vacuum and is attenuated substantially at each reflection surface in the scanner that acts as a lens for the light. Therefore producing enough EUV photons with the EUV light source has become the most critical success factor for EUV Lithography to generate sufficient wafer throughput in production.
Given the short wavelength that the production of this light requires, very high energies are needed to heat up the light-emitting gas instantaneously to more than 200 000 degrees. In our Laser-assisted Discharge Plasma (LDP) sources tin is used as the fuel and the heating energy comes from electrical energy stored on a capacitor bank.
In this presentation we will describe the extreme technologies that are required to repeat this discharging process several ten thousand times a second in the 24/7 regime of a fab environment, with high availability and low cost of ownership.
The further light source power scaling required for High Volume Manufacturing is explained and the speed at which these are realized will largely define the introduction moment of EUV Lithography and most probably the future of Moore’s Law.