MEMS and Sensors 2018 – Abstracts and Biographies
Sensors, Cars and the Road Ahead
Lars Reger, Senior Vice President and Automotive Chief Technology Officer, NXP Semiconductors
Lars Reger is Senior Vice President and Chief Technology Officer of NXP’s Automotive business unit. NXP is the world’s largest supplier of automotive semiconductors. NXP’s complete solutions portfolio covers all the domains of securely connected, self-driving cars – including connectivity, driver replacement, powertrain & vehicle dynamics, body & comfort, in-vehicle experience, as well as secure gateways and networking. As CTO, Lars is responsible for managing R&D and new business activities for NXP Automotive.
Prior to joining NXP in 2008, Lars gained deep insight into the microelectronics industry – with a strong focus on the automotive sector – in various functions with Siemens, Infineon, Siemens VDO and Continental. Before joining NXP, Lars was Director of Business Development and Product Management within the Connectivity business unit at Continental. His past roles at Infineon included Head of the Process and Product Engineering departments, Project Manager for Mobile System Chips, and Director of IP Management. He began his career with Siemens Semiconductors as Product Engineer in 1997. Lars holds a university degree in physics from the Rheinische-Friedrich-Wilhelms University of Bonn and an executive MBA from London Business School.
As cars become increasingly autonomous the attention of tech enthusiasts has often turned to the centralized computing systems that crunch the data provided by a car’s sensors. We’re putting the focus back where it belongs, on the sensors and the powerful decentralized ways that cars will become more like humans in the decision-making realm. With all the technology present in today’s society, cars represent one of the most complexes yet commonplace examples of a product with electronic measurement and control systems, with sensors, data conversion, controllers, software, secure communication, and actuation. Join us for a lively discussion on the roles that sensors play in the evolving automotive ecosystem. We’ll explore the high-level automotive landscape and the automotive systems that require both MEMS and non-MEMS sensors as well as other electronic measurement and control systems in the automotive context, for the car of today, and the autonomous vehicle of tomorrow.
This keynote address will discuss these sensor/MEMS-enabled systems in automotive, their history and their future trends in areas such as engine management, airbag and passive safety, braking and active safety, tire pressure monitoring and the steps toward autonomous driving that are on everyone’s minds. How will these topics influence the market in the context of the diverging requirements of more distractions in vehicles, like infotainment, Wi-Fi, Bluetooth connectivity, etc. vs. improving safety with ever-increasing functional safety standards and ISO26262? How will the robustness of these IoT trends influencing the automotive industry also change the way we address IoT in a rapidly converging world of technology in industrial, medical, infrastructure, and consumer markets, and vice versa? NXP lies at the forefront of these interconnected systems in automotive and other IoT markets. This keynote will discuss the trends toward securing connections for a smarter world.
Sensors: Key Enabler of Autonomous Driving
Luc Bourgeois, Expert Leader ADAS and ADS Systems, Renault
Working for SFENA, Sextant and Thales : 15 years in Avionics systems for civil Aircraft; Working for Renault : 18 years in embedded systems for Automotive industry
Next car generation is facing a lot of main change inductors. What are the forecasted impacts on existing car electronics design and how Electrification, Autonomous Driving and Connectivity lead engineering to deliver electronics breakthrough.
Sensors Technologies: from data acquisition to embedded information
Emmanuel Sabonnadiere, CEO of the LETI, CEA Tech
Since November 20th, 2017, Mr Sabonnadiere is appointed CEO of the LETI of CEA Tech. Before, he was in charge of the Industrial Partners of CEA Tech. Previously, Mr Sabonnadiere was CEO of the Business Group Professional of Philips Lighting based in Amsterdam (NL). From 2008 till 2014, he was CEO & Chairman of General Cable Europe based in Barcelona (Spain). Mr Sabonnadiere was CEO of NKM Noell at Wurzburg (Germany) from 2005 till 2008. He was vice-president of the Distribution Transformers division of Alstom T&D for 5 years. He began his career in 1992 with Schneider Electric holding various positions including that of Managing Director of development for equipment units. Mr Sabonnadiere has a strong technological background combined with a successful business track record over decades. With 25+ years of executive leadership of large operations, he had produced successful operating Result and great Team building. He had gained a sound experience of change management in large multi-cultural matrix organizations in order to adapt to the new markets conditions and a strong knowledge of European and International environments. He designed and set-up Strategic Plans including innovation process. Mr Sabonnadiere believes in operational excellence, innovations in technology, talents management and enthusiasm in leadership. Mr Sabonnadiere obtained a PhD in physics (France), and an engineering degree in Information Technology (France). He holds an MBA (France). Mr Sabonnadière is a fully qualified instructor at the ski school in Les Ménuires, and member of the Advisory board of IAC.
Today, sensors are the key drivers for IoT solution. Image sensors are paving the way to other arrays and matrix sensors for enhanced data and senses, like ultrasonic detection, fingerprint scanners, electronic noses… Moreover the new sensors require embedded local information processing in order to provide low latency, security and multi-modality. The resulting massive data processing motivates complex heterogeneous integration of functions at the sensor level. This presentation will review the evolution of sensors and will emphasis the technological challenges addressed by Leti from material to system and integrated software.
Introduction of Sensor Ecosystem in China
Gao Teng, PhD/EMBA, President of FIOT-LAB
Dr. Gao worked in the well-known Microelectronics R&D center IMEC for nearly 20 years, serving as manager of IMEC Asia in 2000, and in 2010 was appointed general manager of IMEC china. Dr. Gao has devoted himeslf in the domestic microelectronics business for fifteen years, contributed to the successful cooperation between IMEC and Wuxi Huajing (project 908), Shanghai Huahong (project 909), SMIC, Shanghai Huali Microelectronics, China Electronic Technology Group, Hisilicon, ZTE, Chinese Academy of Sciences and many other well-known companies and institutions, and introduced large amount of advanced and urgently needed IC technologies to China. Dr. Gao understands the domestic industry demand; he has published several articles about the industrial development in domestic media, and has been invited to give presentations in several academic and industry conferences. He had presented a report with topic of smart manufacture of IoT industry in“Semicon China 2017”with insights of the future development of international microelectronics and IoT. In 2004, he had reported to the Prime Minister Wen Jiabao and in 2012 to the State Councilor Liu Yandong.
This presentation will introduce sensor industry development history and present situation in China, as well as the exploration of a few sensor application in IoT industry in China.
From cloud to the edge: the smart city and personal data
Claus Habfast, Vice-Chair, Grenoble-Alps Metropolitan Council
Claus Habfast, a native German, arrived in France in 1984 to start a Ph.D. thesis following degrees in physics and mathematics. His 30 years of professional experience gained in France, Germany and the Netherlands cover basic research, space exploration and international science facilities. Whilst at university, he was active in German student movements, and he kept a keen interest in politics throughout his career. Upon arriving in Grenoble, he joined a citizen participation board and later the municipal council. As Vice-Chair of the Grenoble-Alps Metropolitan Council since 2014, his responsibilities cover university, research, innovation and international relations. The main focus of his work is twofold: ensuring a seamless interplay between universities and local authorities and coordinating Grenoble's smart city initiative. Representing the City of Grenoble, he also chairs Alpexpo, Grenoble's convention center and exhibition hall, where he put into place a recovery plan that saw a return to profits after a decade of losses and failures.
Today, smart city open data is mostly used by geeks, except in map and traffic services. Grenoble-Alpes Metropolitan Council is leading a public-private partnership to change this, and increase usage of this valuable resource. Our novel approach will move data storage and processing from the cloud (data servers) to the edge (citizens' mobile devices) where a wealth of personal data is potentially accessible: geo-localization, smart meters and watches etc. to be blended with real time open data on the city infrastructure. The Grenoble-Alpes initiative will blend smart city open data and personal data inside mobile devices. To provide security, ensure trust and involve citizens in the design, apps will be developed under public service supervision and certification. The system will be designed in an open architecture, ready for duplication elsewhere. It will be particularly suited for integration into 5G IoT networks.
Megatrends Impacts on the MEMS Business
Eric Mounier, Senior Analyst - Photonics, Sensing & Displays Division, Yole Développement
With more than 20 years of experience in MEMS and Sensors applications, markets, and technology analyses, Eric provides deep industry insight into MEMS and Sensors’ current and future trends. He is a daily contributor to the development of MEMS activities at Yole, with a large collection of market and technology reports as well as multiple custom consulting projects: business strategy, identification of investments or acquisition targets, due diligences (buy/sell side), market and technology analysis, cost modelling, technology scouting, etc. He has contributed to more than 250 marketing/technological analyses and 100 reports, helping move the MEMS and Sensors industry forward.
Thanks to his deep knowledge of the MEMS, Sensors and Photonics-related industries, Eric is often invited to speak at industry conferences worldwide. He has been interviewed and quoted by leading media throughout the world.
Previously, Eric held R&D and Marketing positions at CEA Leti in France. Eric has a Semiconductor Engineering Degree and a Ph.-D in Optoelectronics from the National Polytechnic Institute of Grenoble.
We have entered into a more and more sensitive world and sensors will be increasingly used in the future in our everyday life. Actually, there is a shift from physical parameters sensing to more “waves” sensing (such as radio-frequency waves, visible light, infra-red and hyperspectral spectrum …). Historically, MEMS and sensors have first been developed and used for physical sensing such as shock, pressure, then acceleration and rotation. Over time, as a more significant effort was put in R&D, MEMS have shifted from physical sensors to light management (e.g. micromirrors), then to infra-red sensing (microbolometers).
It thus opened the way to the first sensor that can sense beyond human senses. From physical/light, MEMS development has then been driven by sound with microphones. And nowadays, MEMS and sensors developments are aiming to go far beyond human capabilities with sensing capabilities in ultra-sonic, hyperspectral, radio-frequency …
All these developments are driven by the current world megatrends: smart transportation, mobiles, 5G, hyperscale data centers, AR/VR, artificial intelligence, voice processing, health care, and industry 4.0.
In my talk, I will review the future trends for MEMS and sensors that are driven by these current world megatrends. Forecasts in units and value will be discussed as well as future trends in terms of technologies and challenges.
Disruption in the authentication sensor market
Manuel Tagliavini, Principal Analyst, MEMS & Sensors, IHS Markit
Manuel joined IHS Markit in 2017. His key areas of focus are MEMS and sensors for mobile and consumer technologies and are responsible for the tracking of sensors in handsets, tablets, laptops, and sports and fitness products. Prior to IHS Markit, he spent over 10 years with STMicroelectronics working in various roles including product engineering, program manager and marketing and business development in the company's MEMS division. Manuel earned an Executive Master of Business Administration at SDA Bocconi School of Management, and his Master's of Science in Electronic Engineering from the University of Parma, both in Italy.
There is a disruption in the authentication market with new players from Taiwan that are badly hurting the established suppliers. A technology disruption with emerging optical sensors, ultrasonic fingerprint solutions and in-display sensors are challenging the capacitive fingerprint sensors. Then the latest disruption by Apple: a mass market for fingerprint sensors was created with the iPhone 5s. Is Apple now killing this market with the introduction of the FaceID in the iPhone X?
Future trends and drivers for sensors markets - The sensor users' perspective
Michael Alexander, Partner, Roland Berger
Dr. Michael Alexander joined Roland Berger in 2014 as a Partner in the Competence Center for Industrial Goods and Services. He is an industry expert in the electronics and semiconductor business and leads Roland Berger's global B2B Electronics business. His recent consulting work has centered on strategy, business development and R&D management, with a special focus on sensors and power electronics. He has carried out successful projects for international electronics, semiconductor, renewables and machinery groups in Europe, Japan, Southeast Asia and the US. Michael brings more than 15 years of management experience in Europe and Asia to Roland Berger and has worked for companies like Daimler, Siemens and Infineon Technologies. He holds several Advisory Board seats in the B2B industry and science community. He also spent five years with a large international consultancy. Prior to his work in industry and consulting, he pursued an academic career at the Max-Planck-Institute of Solid State Research and as a Post-Doc at the Industrial Research Institute (IRI) in Yokohama, Japan. In 1991, he received the "Young Scientist Award" from the Werner-von-Siemens-Ring Foundation.
Michael holds a Master’s degree from the University of Munich (LMU) and a PhD from the University of Stuttgart in Semiconductor Physics. He has also received vocational training in banking.
The sensor and MEMS markets remain interesting, especially in terms of size, growth, and new application areas. We will have a look at the different mega-trends which drive different application segments such as Consumer, Industry, and Automotive. We will deep-dive e.g. into Automotive where the MADE drivers (New Mobility, Autonomous Driving, Digitization, and Electrification) dominate.
However, sensor and MEMS market players have to break these mega-trends down to needs per application field and even further to specific use-cases to understand the upcoming requirements of their customers, who are going to use the sensors in their future applications.
We have been doing intensive global market research into such applications and use-cases to understand which sensors might be used where on the mid- to long-term horizon. Furthermore, we have asked the users about the future capabilities they expect from their sensor and MEMS suppliers. We have done such using the Roland Berger Strategic Sensor Framework we have been presentingin the 2016 European MEMS Summit.
During the talk, we will present results from this study and discuss the implications these findings will have on sensor and MEMS companies. A focus in the discussion will lay on the necessary extensions of the sensor and MEMS companies' capabilities and how to best achieve this. Necessary changes in business models and possible partnerships will be discussed.
The next opportunity for MEMS: from the consumer market to high volume automotive and industrial markets
Benedetto Vigna, President, Analog, MEMS & Sensors Group, STMicroelectronics
Benedetto Vigna is STMicroelectronics’ President, Analog, MEMS and Sensors Group, and has held this position since January 2016. He is a member of ST’s Executive Team.
Vigna joined STMicroelectronics in 1995 and launched the Company’s efforts in MEMS. Under his guidance, ST’s MEMS sensors established the Company’s leadership with large OEMs in motion-activated user interfaces. Vigna has piloted ST’s successful moves into microphones, e-compasses, and touch-screen controllers, as well as environmental sensors, micro-actuators, industrial and automotive sensors, and low-power radios for IoT. Vigna’s mandate was further expanded with analog ICs and RF products (2011) and smart-power devices for OEMs and mass market (2016). ST’s Imaging division moved under his management in the fourth quarter of 2017.
Vigna has more than 170 patents on micromachining, authored numerous publications, and sits on the board of several EU-funded programs. Vigna’s contributions to the industry have been recognized with the MEMS Industry Group’s Executive of the Year Award (2013), the European SEMI Award (2013), the IEEE Frederik Philips Award (2015), and Manager of the Year 2017 by German magazine Markt & Technik.
Benedetto Vigna was born in Potenza, Italy, in 1969, and graduated with a degree in Subnuclear Physics from the University of Pisa, Italy.
In 2005 ST was at the forefront of the "MEMS Consumerization Wave" opening the doors of the high volume consumer market to a technology that was originally intended for the automotive and Industrial markets.
Today the Internet of Things and Smart Driving trends are creating opportunities to make existing and new devices and applications smarter through the use of intelligent connected sensing technologies. This applies to factories and workplaces, cities, homes, vehicles and all the devices that can be found there.
The latest generations of MEMS products and technologies are developed to meet the needs of consumer applications while also targeting automotive and industrial applications.
This talk will address this new industrial development pattern shift and it will detail what STMicroelectronics is doing to lead the emerging wave of new MEMS products, applications and technologies across the different market segments."
MEMS-Based techniques for alignment of single/mode hybrid optics
Bardia Pezeshki, CEO, Kaiam
Dr. Bardia Pezeshki is the founder and CEO of Kaiam, a ten-year-old California head-quartered company with operations in the UK developing and manufacturing high performance multi-wavelength optical transceivers for datacentre applications. The factory in the UK supplies optical modules to most large tier-1 datacenters in the world, using proprietary internal MEMS and optical waveguide technology to achieve high density and integration. Prior to Kaiam, Bardia started and managed the technology at Santur Corporation (2000-2008) which used MEMS to form an array-based tunable laser. This architecture dominated the transition of long-haul and metro networks from fixed-wavelength lasers to tunable. He obtained his Ph.D. from Stanford University, partially working on a MEMS-based tunable laser that received significant attention in the early 2000’s, with multiple companies pursuing the technology. Bardia has approximately 30 patents and 100 peer-reviewed publications and presentations.
Silicon micromechanics is precise, low cost, and has been instrumental in a variety of applications. The high submicron precision of motion provides great value in optics, where it can be used to tune laser cavities, align optical beams dynamically, or used in a set-and-forget architecture. We will describe these three uses of MEMS in optics, all of which have had a tremendous impact in the industry. The most recent and exciting application is in providing a platform for alignment of complex single-mode hybrid assemblies. In this case, MEMS springs, levers, and microheaters are used to align assemblies for low-cost transceivers. Such assemblies of different materials and devices are fabricated using standard low-precision tools but are then fine-aligned using MEMS. We show how 4 channel and 8 channel transceivers can be constructed at 40Gb/s, 100Gb/s, and 400Gb/s and compare them to standard solutions.
Advanced substrates for MEMS and photonic applications
Vesa-Pekka Lempinen, Senior Manager, Customer Support, Okmetic Oy
Mr. Lempinen received his M.Sc. in Materials Physics from Helsinki University of Technology in 1999. Mr. Lempinen has over 15 years of experience in Silicon-based material engineering. He has worked for Okmetic since 2000 and held various positions related to R&D, process engineering and applications support.
Currently, he is working as Senior Manager, Customer Support responsible for the company’s global technical customer support organization.
Prior to his time at Okmetic, Lempinen was involved in photovoltaic research in Electron Physics laboratory of Helsinki University of Technology, Finland and Microelectronics Research Center of Iowa State University, U.S.A.
The worldwide expansion of MEMS and photonic device utilization in Consumer, Automotive and IoT application areas are driving new requirements to the supply chain. Requirements for lower cost and higher volumes are driving towards sensor miniaturization. Requirements for reliability and performance improvements on the other hand drive for improvements in precision of BSOI materials, and use of hermetically sealed structures enabled by Cavity SOI (C-SOI) wafers or wafer level packaging. Advanced substrates, in addition to innovative design solutions, are needed to meet these requirements. Following examples of advanced substrate-based solutions to MEMS and photonic applications are shown and discussed:
- Use of thick SOI or C-SOI for manufacturing released MEMS structures. Comparison of different SOI substrates from process integration and manufacturing complexity point of view. Benefits of SOI and C-SOI based approach for flatness and dimensional precision of the released structures.
- Combination of C-SOI based MEMS and wafer level packaging by patterned capping wafers with poly-Si TSVs. Properties of advanced C-SOI and TSV substrates.
- C-SOI based approach for high-performance inertial sensors, with benefits in process integration, reliability and performance optimization.
- Thick SOI-based optical waveguides using E-SOI substrates for maximum efficiency.
Okmetic’s new turnkey solution of providing full C-SOI process flow, from silicon crystal growth to cavity patterning and SOI wafer manufacturing, from one source is introduced. Fully in-house C-SOI processing allows an industrial-scale solution to
C-SOI manufacturing, and enables the sensor manufacturers to focus on their core competencies in the directly sensing-related parts of the manufacturing process. Integrating the reliability-critical fusion bonding part of the MEMS process as a part of starting wafer manufacturing enables also streamlining of the manufacturing process flow, simplified process integration, and improved long-term reliability of the MEMS devices. In-house crystal growth and substrate wafer manufacturing enable full customization of material properties, such as Si layer resistivity and orientation, of each layer of the C-SOI structure.
Smart Cut technology applied to MEMS: illustration in the field of ultrasonic transducers
Bruno Ghyselen, Senior Expert R&D Corporate, SOITEC
Bruno GHYSELEN holds aPhD in Materials science obtained in 1992 from University Paris 7. During his thesis, he focused on the realization and characterization of Josephson junctions. This work was realized within THOMSON-CSF/ Laboratoire Central de Recherches /Orsay France (now within THALES). He pursued this collaborative work by joining as a research associate the University of Cambridge (UK/ Materials Science Department). He joined SOITEC mid-1995, just before SOITEC revealed its new Smart Cut ä technology dedicated to the manufacturing of a new generation of SOI substrates. Within SOITEC, he has been in charge of different R&D programs and collaborations with different partners (silicon wafer suppliers, SOITEC customers, equipment suppliers, Universities, R&D public organizations ..). Most of these programs were dedicated to the development of advanced SOI and other advanced composite substrates for specific applications. He has been involved in the development of ultra-thin or at the other extreme ultra-thick SOI substrates, high resistivity SOI for CMOS RF, high mobility SOI (strained silicon, multiple crystalline orientations, GeOI ..), SiC/GaN on Insulator, double SOI, IIIV materials composite substrates, ...
In the field of MEMS applications, most devices are based on the realization of well-defined suspended micro-structures like membranes, platesand beams. In competition to other starting substrates, SOI substrates have been used for long to realise such structures because they can bring several key advantages to the MEMS process device engineer: a very high etching selectivity of the Si/SiO2 system, a good thickness control down to extremely thin layers, reproducibly low stress layers; monocrystalline defect-free silicon layers, a CMOS front-end compatible process, a large diameter compatibility, ...
The Smart CutTM technology is the mainstream technology for fabrication of SOI substrates and it has already been proven to address a full and diversified range of applications for electronics markets: Digital PD and FD-SOI, RF-SOI, Power-SOI, Photonics-SOI, imager-SOI, etc. In this presentation, we will show how the Smart Cut technology can be applied to address specifically the MEMS applications and open up new doors of opportunities. In order to illustrate its potential and benefits, we will use a demonstration case: the Micromachined Ultrasonic Transducers (MUTs).
A Word from our Sponsor Materion
Greg Mlynar, Director, Materion
Greg Mlynar is responsible for semiconductor marketing at Materion. With over 20 years of semiconductor industry experience, Greg works with customers, sales, and operations to develop and implement Materion's global business strategy and identify new product lines and services to offer. Greg's educational background includes a Bachelors of Chemical Engineering from Villanova, a Masters of Microelectronics Engineering from RIT, and an MBA from the University of Richmond.
Molecular Vapor Deposition (MVD): a versatile, multifunctional technology with applications in MEMS, packaging and beyond
David Springer, Product Manager, SPTS Technologies
David is the Product Manager at SPTS responsible for MVD systems and coatings for MEMS applications. He joined SPTS in June 2013 when the company acquired Xactix Inc. where he was President for 11 years. Prior to XACTIX, David was president of a Design Automation startup company and received his PhDD. In Computer Engineering from Carnegie Mellon University.
MVD is a patented, well-established method for depositing self-assembled monolayer (SAM) anti-stiction coatings on MEMS devices. With a variety of available chemistries and film combinations, coatings can be tailored to meet requirements such as surviving high-temperature eutectic bonding and enhanced mechanical performance for ink jet head “wiping”.
The MVD method is uniquely suited to depositing nano-scale films at precise thickness. It delivers the precursors sequentially in small pulses, using diffusion to distribute the precursors around the chamber and within the geometry of devices. This results in extremely uniform and conformal high-quality films even in very high aspect ratio geometries. Taking this pulsed deposition concept further, theMVD method can be used for Atomic Layer Deposition (ALD) of films at low temperature (<150°C); these films exhibit expected optical and electrical properties.
In addition, MVD can be used to deposit films such as SiO2, Al2O3, TiO2and ZnO of varying thicknesses in a semi-continuous growth mode (MVD) similar to Chemical Vapor Deposition (CVD). The MVD method can deposit multi-layer films using one or all of SAM deposition, ALD and MVD opening up an array of applications. Multi-layer, conformal coatings can be used as effective transparent barriers to liquids, vapors and gases on devices, packages, bond pads, and even populated circuit boards. In the case of bond pads, these films prevent metal degradation under accelerated stress tests while allowing wire bonding directly through the protective film. A new area of interest is copper pillar protection where films as thin as 5nm can be used to prevent oxidation on copper surfaces. These multi-layer stacks have a long lifetime and provide equivalent or superior protection than much thicker coatings of Al2O3 or Parylene. Adding a hydrophobic SAM as the last deposition step provides a liquid water barrier and prevents water adsorption.
Challenges of MEMS manufacturing for industrial markets: from myth to reality
Antoine Filipe, C.T.O Inertial and MEMS Sensors, Temperature & Pressure Sensors Business Group, TDK - Tronics
Dr. Antoine Filipe is C.T.O Internal and MEMS Sensors at Temperature & Pressure Sensors Business Group, a division of TDK Corporation focusing on MEMS for industrial markets. Dr. Filipe has more than 20 years of experience in the semiconductor and MEMS industry. He has been leading the business unit for high performance-inertial sensors since 2011. Before joining Tronics, he held several management´s positions at STMicroelectronics and THALES. He has been also involved as a part-time lecturer at Ecole Polytechnique, France. Dr. Filipe holds an M.Sc. from Ecole Polytechnique and Ph.D in Solid State Physics completed within the research group of Dr. Albert Fert, 2007 Nobel Prize in Physics.
During the last decade, MEMS manufacturing has been mainly driven by the Consumer market, from inertial sensors to microphones now widely used in smartphones. Although MEMS technology is also opening exciting new opportunities for industrial markets, it is a matter of fact that the pervasion of MEMS within the industry is still limited. We will present several factors related to MEMS manufacturing that do indeed limit the deployment of MEMS technology. We will offer recommendations on how MEMS manufacturing can be more pervasive and scale to meet the future demands of the multitude of IOT sensing applications. This talk will also highlight a few guidelines to help industrial customers implementing MEMS technology within their products.
Metrology and Inspection − Ways to Address New Challenges and in the More than Moore Technology Environment
Daniel Harel, Director, Product Line Manager, Applied Materials
Daniel is the director of PDC and RD&E for the Equipment Product Group (EPG) within the Applied Global Services division at Applied Materials. In this role, he manages the engineering and project team that is focused on growing Applied’s legacy PDC business and accelerating innovation through new product development initiatives.
Daniel brings over 20 years of technology-focused product experience in emerging technology segments. Prior to joining Applied Materials, Daniel held various development positions at Unique Technologies and Philips Healthcare in Israel. He holds degrees from Israel’s Bar Ilan University in both Physics and Computer Sciences.
In the current semiconductor market environment, the More than Moore (MtM) technology segment is rapidly evolving. The metrology and inspection tools and solutions mainly focus on traditional semiconductor challenges but face some gaps when implemented into the MtM technology environment. While the main challenges of the existing new metrology and inspection tools are very small features and design rules, the MtM environment introduces various new challenges not yet addressed. New different type of substrates (SiC, Glass, Quartz, etc.), dissimilar wafer thicknesses (smaller and thicker than standard Si wafers), and the whole range of wafer sizes (150/200/300mm) require new solutions for wafer handling, alignment and mapping. The challenging features of geometry, density and new processed materials require three additional dimensional capabilities for defect detection, CD measurements and analysis.
During this session, we will share our understanding of the challenges and the impact on existing metrology and inspection solutions in the market. We will discuss ways to address these challenges with new approaches and improvements to our existing customers installed base. These solutions will enable customers to extend their tools capabilities for the evolving and challenging MtM environment and their future technology roadmap.
Embracing Design for Manufacturing in MEMS – Success and disappointments
Ian Roane, President and CEO, Micralyne Inc.
Mr. Roane is the President and CEO of Micralyne Inc., located in Edmonton, Canada. Mr. Roane joined Micralyne in 2015, and brings over 30 years of high-tech experience, having worked in a broad range of roles from engineering design, sales and marketing to executive management. Prior to joining Micralyne, Mr. Roane held numerous executive positions, including CEO of Kaben Wireless, a fabless semiconductor company specializing in IP for the wireless industry, President and CEO of Sound Design Technologies, a DSP and Wireless components provider (spin-off from Gennum Corporation) which was subsequently acquired by ON Semiconductor and Vice President of Engineering at Sirific Wireless.
Mr. Roane began his career with Ottawa-based Bell Northern Research (Nortel Networks) as an integrated circuit designer, and in his extensive technology career has held numerous roles covering all aspects of product design, development and manufacturing at organizations such as Nortel, NovAtel, National Semiconductor and Sirific Wireless.
Design For Manufacturability (DFM) is a mantra that has been successfully applied in the semiconductor industry and produced cost efficiencies to the entire value chain. As demand for MEMS devices continues to grow and products increase in complexity, the economics of MEMS production has necessitated a shift away from the “one product, one process” tradition of MEMS to design for manufacturability and early manufacturing involvement. DFM concepts have increasingly become a major component of the development effort designed to maintain and enhance the rate of technology advancement and significantly improve the development-to-manufacturing transition. This presentation will cover Micralyne’s experience in embracing DFM in MEMS products transferred to volume manufacturing - both successful and disappointing transfers
Next generation MEMS Variable Optical Attenuators: towards the maturity, silicon area optimization
Christophe Kergueris, MEMS Project Leader | R&D, Safran Colibrys
Christophe Kergueris joined Safran Colibrys in 2015 as a project leader to work on the development of new MEMS products. Prior to joining Safran Colibrys, Christophe spent more than 10 years with Tronics Microsystems in various R&D positions, working on inertial and pressure sensor developments. His engineering career started at ALCATEL CIT, improving assembly processes in a production line. Christophe holds a Phd in Molecular Electronics from the University of PARIS XI (France) and an engineering degree from ESPCI in Paris.
Safran Colibrys, a company of Safran Electronics & Defense based in Switzerland, is a world-leading supplier of standard and semi-custom MEMS motion sensor. MEMS accelerometers have been developed for more than 20 years for industrial, military, aeronautics and safety applications. In addition to manufacturing inertial sensors, Safran Colibrys offers contract manufacturing services to fabless companies in a strong growth phase, especially in the telecommunications markets.
This presentation will discuss a MEMS Variable Optical Attenuator (VOA) consisting of an electrically movable mirror on a silicon support. Produced by Safran Colibrys for more than 15 years, this MEMS die is found in key components of fiber optic transmission networks within the metropolitan area and for data center interconnections. To keep track with the recent market developments and the growth of demand, we will present how the MEMS design and process have been re-examined to reduce die size, cost and lead time, offering significant advantages over existing solutions.
Breaking the MEMS micro speaker barrier
Andrea Rusconi-Clerici, CTO, USound
Andrea Rusconi-Clerici holds a MS Degree in Mechanical Engineering at Politecnico di Milano University (graduated in 2002) and an Executive MBA focusing on Entrepreneurship and Innovation Management at SDA Bocconi Business School (graduated in 2008). He has 15 years technical experience in the MEMS industry having covered several engineering and management positions in R&D, product development, manufacturing engineering and operations. He has experience in research (Fraunhofer Institute), large companies (STMicroelectronics, Maxim Integrated) and start-up (USound, Sensordynamics). At STMicroelectronics he has been a key player for realizing the inertial MEMS business growth up to 250M$/Y revenue; activities ranged from new technologies IP and development to product families mass production.
He co-founded USound GmbH and is taking care of the technical development as CTO.
USound is challenging the status quo of the $10B micro-acoustic market with a silicon MEMS micro speaker technology which has great potential, triggering comparable disrupting dynamics as for MEMS microphones and LED. We develop and market audio solutions in the field of micro-acoustics, in particular, wired and wireless earphones, AR glasses, wearables, VR/Gaming headphones and portable consumer devices. Compared to micro speakers based on voice coil, piezo MEMS are superior in three categories: sound quality, form factor, system integration.
The biggest challenge in generating high sound pressure levels in a tiny form factor is to be able to generate large forces and elongations in a linear way. This has always been the obstacle for MEMS technologies. USound has leveraged the advent of new materials - in particular, thin film piezoceramics with high piezo coefficients – to break the barrier which previously challenged MEMS micro speakers. PZT can generate enough energy per unit area and thus mechanical force and elongation to compete with standard voice coil transducers. The MEMS motor is realized on silicon using multiple piezoelectric actuators connected together to realize a precise vertical out-of-plane movement. The piezo linear motor is faster and more precise than traditional magnetic coil technology, and for earphones, this produces deep and precise bass and crisp and clear treble with a single, extremely small transducer. Since PZT consumes 95% of reactive power, a patented energy recovery loop is transferring more than 50% of the energy back to the system making these devices extremely low power. And because USound’s micro speakers are based on planar technology, we can produce outstanding audio quality in a form factor of only 6.7x4.7x1.5mm.
Making wearables always wearable - with MEMS sensor technology
Peter Weigand, Vice President Business Strategy and Portfolio Management, Bosch Sensortec
Peter Weigand was appointed as Vice President Business Strategy and Portfolio Management of Bosch Sensortec in April 2018. He received his PhD in Physics from the Vienna Technical University in 1993, followed by postdoctoral studies at IBM T.J. Watson Research Center in the USA.
Dr. Weigand started his professional career as development engineer at Siemens in the USA, followed by various management positions at Siemens Semiconductor and Infineon Technologies in Munich. In 2000, he became a member of the M&A team to sell the Infineon Imaging Business Unit to Micronas Semiconductor and to manage its integration. In 2002, he was assigned as Vice President of the Micronas Multimedia Unit and in 2004 as the General Manager of Micronas China in Shanghai. In 2008, he was appointed as Senior Vice President Sales, Marketing and Services at Grace Semiconductor Manufacturing Corporation in Shanghai. From 2012 to 2017, he served as the CEO of an ETH based computer vision software start-up in Zurich. He successfully managed its funding by Qualcomm and its sale to the mixed reality company Magic Leap and subsequently became a partner at the Venture Capital company Speedinvest in Vienna.
Wearable applications such as fitness trackers, smart watches and wristbands are becoming more and more popular - not only among sports enthusiasts - but also for businessmen and regular end customers that value a healthy way of life. Wearable devices help to track activities, steps and the number of calories burnt during sports activities but also during people’s everyday life. An important factor that drives the popularity of wearables in this segment is their small size, especially compared to e.g. smartphones. However, that means that there is also less space available for batteries. In addition, to ensure a complete picture of one’s activities, wearables have to be always-on. Frequent charging of the devices is however not accepted by the user. Hence, low power consumption is a key requirement for sensors, while users expect an accurate measurement of their activities. Therefore, wearable devices rely more and more on useful and precise data from sensors. Usually, higher sensor precision and more demanding sensor use cases come along with higher power consumption. Here, new power-saving concepts and precise, smart sensor technology are required. These concepts are also important for IoT related use cases where batteries have to last for many years.
In his speech, Dr. Peter Weigand, Vice President Business Strategy and Portfolio Management at Bosch Sensortec, will present specific use case examples to outline how MEMS sensor technology helps to overcome the challenges related to wearables and IoT and how manufacturers and end-customers can benefit from these solutions.
Sensors enabling smart HMI
Christian Mandl, Senior Director for Human Machine Interface (HMI), Infineon Technologies AG
Christian Mandl holds a PhD Degree from the Technical University of Graz and an MBA degree from the University of Kansas.
After joining Infineon Technologies (at this time Siemens Semiconductors) in 1998, Christian has held different management positions in chip development for wireline solutions. During 2009-2012 Christian has worked as the Head of the Customer Premises Equipment (CPE) Program Management and the Head of the SOC development at Lantiq (now Intel). From 2012 onwards he has been working as a program manager for consumer sensors in Infineon Technologies and since December 2018 he is leading the Human Machine Interface group at Infineon.
Disruptive technologies have significantly changed our lifestyle in the past few decades; have revolutionized our habits, way of living, work processes and the environment that surrounds us. It has never been easier to combine existing technologies and devices with sensors. And this allows for unlimited possibilities to re-innovate our world via collecting valuable data about our environment, which can be used in multiple ways: from safer and more secure living, through process improvement to cost optimization. Sensors bridge our real world to the digital space; leading us to a new era of productivity and energy efficiency.
The sensing capabilities of machines are getting ever closer to the five human senses, thus allowing machines to comprehend the environment before acting. Machines can now shift from reactive to active mode, enabling a new wave of applications to enter into large-volume consumer markets. As an example, Depth sensing Time-of-Flight (ToF) cameras provide machines with smart-eyes to identify whom they have in front and adapt the machine reaction to each user. Voice recognition solutions provide devices with smart-ears, to answer differently depending on who they are addressing. What will come next? What new ways of smart HMI will be enabled through intuitive sensing?
AI at the Edge: Making Always-on Machine Vision a Reality
Evgeni Gousev, Senior Director Engineering, Qualcomm Technologies
Dr. Evgeni Gousev is a Senior Director of Engineering in Qualcomm Research. He leads HW R&D org in the Silicon Valley Center and is also responsible for developing ultra-low power embedded computing platform, including always-on machine vision AI technology. He has been with Qualcomm Technologies, Inc. since 2005 after joining from IBM T.J. Watson Research Center where he drove several projects in the field of advanced silicon technologies. From 1993 to 1998, Dr. Gousev held academic professorship appointments with Rutgers University and Hiroshima University (1997). Evgeni holds an M.S. degree in Applied Physics and a Ph.D. in Solid-State Physics. He has co-edited 24 books and published 163 papers and is an inventor on more than 60 issued and filed patents.
Recent progress in computing, machine learning algorithms and networks and availability of large datasets for model training have created an enormous momentum in development and wide deployment of game-changing AI applications. Intelligent devices with human-like senses have enabled a variety of new use cases and applications transforming the way we interact with each other and our surroundings. While the vast majority (>80%) of human insight comes through eyes, always-on machine vision at the edge (e.g. IoT device, smartphone) remains extremely challenging due to the significant power consumption of conventional HW architectures and complexity of algorithms. Qualcomm Research has pioneered an Always-on Computer Vision Module (CVM) combining innovations in the system architecture, ultra-low power designs, and dedicated hardware for CV algorithms running at the “edge”. With low end-to-end power consumption, tiny form factor and low cost, CVM can be integrated into a wide range of battery- and line-powered devices (IoT, mobile, VR/AR, automotive, etc.), performing object detection, feature recognition, change/motion detection, and other applications. Its processor performs 100% embedded computation within the module itself and outputs metadata.
What value can Digitization of Electrical Distribution bring to Semiconductors Fabs Managers?
Pierre Tabary, Strategic Accounts Management Program Vice-President, Schneider Electric
As Vice-President Strategic Customers and Segments, Pierre supports the development of business with International Strategic Customers of Schneider Electric and in particular, brings support to Strategic Account Executives on Strategic Account Business Plans and Global Commercial Frame Agreements. As an engineer specialized in physics, Pierre joined Schneider Electric 37 years ago. Pierre has held various Country and Business lines general management positions in Denmark, the Netherlands, China, Australia & France. He was the General Manager of Schneider Electric’s first joint-venture in China, Tianjin Merlin Gerin, from 1994 to 2000.
The digital transformation of electrical distribution brings new opportunities to enhance reliability and improve energy and operation efficiency in fabs. But securing a safer, more efficient and more reliable electrical supply to all utilities and process tools requires better monitoring systems able to provide accurate and useful information on power quality and energy usage with comprehensive dashboards and reports to support facility managers in their day-to-day mission. The digitization also enables leveraging machine learning and domain expertise for predictive maintenance to further improve energy efficiency and availability. On this new digitized context, Augmented Reality applied to the fabs operations facilitate physical maintenance activity by helping to avoid human error, reduce cost and downtime, and improve safety.
Sensing: Delivering the fuel to power AI in healthcare
Marc-Eric Jones, CEO and Founder, Léman Micro Devices
Mark-Eric Jones is CEO and a founder of Leman Micro Devices SA. He is an experienced British entrepreneur with over 30 years in CEO roles in high-tech companies, over 12 years’ executive experience in Silicon Valley private and public companies and 13 years as a CEO in Switzerland. He has a track record of creating and growing high-tech start-ups in technology and consumer electronics around the world including experience of exits through NASDAQ IPO as well as trade sales. He has an M.A. in Electrical Sciences from Trinity College, Cambridge and is a Fellow of the Institution of Electronics and Technology (IET).
Recent advances in Machine Learning and Artificial Intelligence technology promise many exciting new developments for the healthcare. However, for ML/AI to deliver on these promises, large quantities of relevant data will be required. Sensors and the data gathering hardware and software will be key to providing sufficient quantity and quality of this essential “fuel” for ML/AI. Experience gained over the past 8 years in developing a medically-accurate health sensing system for smartphones has required understanding and overcoming some of the important engineering, physiological, behavioral, privacy, regulatory and business model challenges to achieving this. This presentation illustrates some of these challenges and the approaches adopted to overcome them in order to deliver the data that will help “fuel” new developments in healthcare.
Sensors - From Red Hot Chillies to Patients
Dr. Martin Peacock is an industrial bioelectrochemist with over twenty years of biosensor experience, having had industrial roles from Abbott Diabetes to GSK, and solving technical challenges from continuous glucose monitoring to RNA analysis. In recent years Martin has set-up biosensor focused companies across the globe from Silicon Valley California to Oslo Norway. At Zimmer and Peacock, we are now distilling our experience into providing a turnkey solution to accelerate our collaborators from their research in the lab to products shipping from the loading bay at the factory. Zimmer and Peacockachieves this acceleration by providing a range of products and services including sensors, electronics, apps, laboratory testing, Cloud databases, IP generation and turnkey manufacturing. Zimmer and Peacock works with clients from academia and industry, with the focus always set on getting to market.
The future for sensors and biosensor is extremely hot; in this talk, Zimmer and Peacock discuss a myriad of sensors and applications both possible and under development from the measuring of caffeine in coffee, to the detection of sulfite in wine, to the hotness of chillies, to the ions in the blood of patients. ZP sees that the IoT is here and the next stage is chemical and biochemical sensors thought out our home and working lives. In this talk, we discuss what is possible, how to do it efficiently, and most importantly how to avoid re-inventing the wheel.
Nitin Dahad, European Correspondent, EE TIMES
Nitin Dahad is European Correspondent for EE Times, a position he took up in December 2017. He has a background in technology, international business, regional economic development, and education, through various roles over the last 33 years. He has a track record of business successes, including taking microprocessor startup ARC International to Silicon Valley, USA, and guiding it through a billion-dollar flotation on the stock exchange, and chairing photonics company CIP through its sale to Huawei. In 2002, he co-founded one of the first practical magazines for tech entrepreneurs and investors, The Chilli; and later an online innovation magazine, The Next Silicon Valley. He previously also had internal roles with GEC Plessey Semiconductor, Marconi Instruments and National Semiconductor, and as an external consultant with Dialog Semiconductor, Jennic, Coresonic, IDENT Technology, Frontier Silicon, and various other semiconductor companies. Back in the 1980s, he was also editor of EDA magazine (also known as Silicon Design).
Outside of EE Times, He currently holds various other advisory and non-executive positions, including as a board member at a local government economic development agency, the Hertfordshire Local Enterprise Partnership in the UK, where he also chairs the enterprise and innovation committee, and is a mentor at London Business School in its Entrepreneurship Summer School. He was also a technology specialist advisor to British Government’s international trade department between 2009-14, building partnerships with the technology industry and governments for trade and investment with the USA, Brazil, India, Middle East and North Africa.
Nitin has a BSc Electronic Engineering (1986) from City University, London, and is a Member of the Institution of Engineering & Technology (MIET) and has been a Charter Member of TiE (global entrepreneur network).