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Associate your company’s name with cutting-edge MEMS Technology! 
 


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SPONSOR NOWAGREEMENT FORM


CONTACT
Denada Hodaj
, Europe Sales Manager

Email: dhodaj@semi.org
Tel.: + 33 4 56 52 94 45

 

Sponsors 2018


 
Gold Sponsor 
ASE Group with a proven track record spanning over three decades, ASE, the OSAT market leader, continues its tradition of manufacturing expertise through orchestrated collaboration with customers, suppliers and partners, alike. Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging, System-in-Package and MEMS solutions to meet growth momentum across a broad range of end markets. For more about our advances in Wire Bond, System-in-Package, Wafer Level Packaging, Fan Out, Flip Chip, MEMS & Sensors, and, 2.5D & 3D technologies, all ultimately geared towards applications to improve lifestyle and efficiency.

For more information, please visit: www.aseglobal.com 

  

As a trusted, collaborative partner to the world’s leading semiconductor companies, Lam Research is a fundamental enabler of the silicon roadmap. In fact, today, nearly every advanced chip is built with Lam technology. Our innovative wafer fabrication equipment and services allow chipmakers to build smaller, faster, and better performing electronic devices for front-end wafer processing, as well as advanced packaging, MEMS, power devices, LED, and IoT applications. Comprehensive customer support offerings deliver value throughout the equipment lifecycle, from system installation, production ramp, and new technology upgrades through end-of-life asset management.

For more information, please visit us
: www.lamresearch.com.
  
The SUSS MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.

The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.

For more information, please visit www.suss.com 

  
Silver Sponsor 
  
Applied Materials, Inc. (Nasdaq: AMAT) is the global leader in precision materials engineering solutions for the semiconductor, flat panel display and solar photovoltaic industries. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world. 

For more information, please visit www.appliedmaterials.com

  
EV Group

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.

For more information, please visit www.EVGroup.com

  
Spts
SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, CVD and MVD® wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high-speed RF device, power management and LED manufacturing.

With the acquisition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet/3D printing solutions for die level printing and UV Laser Drilling for through mold vias. SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific.

For more information, please visit www.spts.com and www.orbotech.com 
 
  
Event Sponsors 
  
Invest in Grenoble - Alps is the inward investment agency for Greater Grenoble, French Tech city in the French Alps. We promote the Greater Grenoble area’s assets internationally and support newly arrived companies to successfully develop their business into our ecosystem. Greater Grenoble, Silicon Valley in the French Alps, has top expertise in Micro & Nanoelectronics, Semiconductor and Digital technologies, including AI and Advanced Computing, Imaging and Photonics, Energy, Healthcare and Medical Technologies, and is as well a fertile environment to test new smart city services and applications. Invest in Grenoble Alps works closely with CEA-LETI, World Wide R&D player for Microelectronics, industrial cluster Minalogic as well as French Tech in the Alps, with stakeholders in Microelectronics, software and IoT at the top level. It is also an active member of the Silicon Europe Alliance, a Meta cluster which unites 14 Advanced Electronics clusters in Europe, and has developed strong international partnerships with ecosystems in the US (Albany NY), Taiwan, Korea and Singapore.

For more information, please visit: http://www.grenoble-alps.com/ 
  
jsr micro
JSR Micro N.V., based in Leuven, Belgium, is a subsidiary of JSR Corporation, a multinational company employing over 6000 people worldwide and a leading materials supplier in a variety of technology-driven markets. JSR’s global network is headquartered in Tokyo. JSR is a research-oriented organization that pursues close collaborations with leading innovators in a number of industries that are key to the present and future welfare of human society: life-sciences, energy storage, synthetic rubbers, electronic materials, display and optical materials. ‘Innovation one-on-one’ summarizes our value proposition to our customers. Through a very early and close collaboration, JSR offers its customers a competitive advantage based on leading-edge technologies, consistent high quality and balanced cost of ownership.
 
For more information, please visit www.jsrmicro.com 
  

KST World Corp. services as a wafer foundry providing various services, especially super thick oxide film up to 12-inch size over 25um, with patented technology for over 20 years. Using thick oxide film technology, we provide unique thick BOX SOI wafers, not only normal SOI wafer or cavity SOI wafer. Today, KST World’s unique and advanced technologies meet and drive customer’s technological requirements in the worldwide market.

For more information, please visit http://www.kstworld.co.jp

  
materionMaterion Advanced Materials is a global industry leader supporting all major semiconductor applications including MEMS, STT-RAM, PC-RAM, Display and Consumer Electronics. We manufacture a comprehensive range of precious and non-precious thin film deposition materials and innovative microelectronic packaging devices. We offer leading-edge products such as our new BondFlowTM Adhesive and a range of sputtering targets, evaporation materials, braze and soldering materials, plating anodes and a large portfolio of high-reliability ceramic packages and hermetic cover/lids. development in respect of ultrasound methodology and transducer development.

For more information, please visit: www.materion.com 

  

VON ARDENNE is one of the leading providers of PVD coating and your partner of choice if you are looking for systems with a modular design that can be easily tailored to your technology and productivity requirements. These modular process systems are ideally suited to be applied in research and development as well as for volume production. For customers who are active in the field of MEMS, we offer equipment for the manufacturing of micromirror arrays for industrial applications. Sensor applications, conductive and active layers, as well as highly encapsulating barrier layers, can be deposited with our systems.

For more information, please visit: www.vonardenne.biz  

 

 


Sponsorship Opportunities SEMI MEMS & Sensors Summit

 

Important deadlines and facts:

Please make sure to submit your company logo as a vector graphic (.eps or .ai format) in 4 colors (4c)
for print purposes and as an RGB image for digital applications.
  • For digital material (logo on SEMI Website, logo on marketing emails, newsletter and other digital
    material: please submit your files 
    together with your signed sponsorship agreement form to
    increase your visibility.
  • Please provide a company description (max 800 characters incl. spaces)
  • Thank you for your collaboration! By delayed receipt of your files only digital options available

 


 

Our 2017 Sponsors:

Click here and check who supported the MEMS & Sensors Summit last year.