Associate your company’s name with cutting-edge MEMS Technology!
Denada Hodaj, Europe Sales Manager
Tel.: + 33 4 56 52 94 45
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|ASE Group with a proven track record spanning over three decades, ASE, the OSAT market leader, continues its tradition of manufacturing expertise through orchestrated collaboration with customers, suppliers and partners, alike. Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging, System-in-Package and MEMS solutions to meet growth momentum across a broad range of end markets. For more about our advances in Wire Bond, System-in-Package, Wafer Level Packaging, Fan Out, Flip Chip, MEMS & Sensors, and, 2.5D & 3D technologies, all ultimately geared towards applications to improve lifestyle and efficiency.
For more information, please www.aseglobal.comvisit :
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The SUSS MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.
The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.
For more information, please visit www.suss.com
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|Silver Sponsor|| |
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|Applied Materials, Inc. (Nasdaq: AMAT) is the global leader in precision materials engineering solutions for the semiconductor, flat panel display and solar photovoltaic industries. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world.
For more information, please visit www.appliedmaterials.com
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EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.
For more information, please visit www.EVGroup.com
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SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, CVD and MVD® wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high-speed RF device, power management and LED manufacturing.
With the acquisition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet/3D printing solutions for die level printing and UV Laser Drilling for through mold vias. SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific.
|Event Sponsors|| |
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JSR Micro N.V., based in Leuven, Belgium, is a subsidiary of JSR Corporation, a multinational company employing over 6000 people worldwide and a leading materials supplier in a variety of technology-driven markets. JSR’s global network is headquartered in Tokyo. JSR is a research-oriented organization that pursues close collaborations with leading innovators in a number of industries that are key to the present and future welfare of human society: life-sciences, energy storage, synthetic rubbers, electronic materials, display and optical materials. ‘Innovation one-on-one’ summarizes our value proposition to our customers. Through a very early and close collaboration, JSR offers its customers a competitive advantage based on leading-edge technologies, consistent high quality and balanced cost of ownership.
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|Materion Advanced Materials is a global industry leader supporting all major semiconductor applications including MEMS, STT-RAM, PC-RAM, Display and Consumer Electronics. We manufacture a comprehensive range of precious and non-precious thin film deposition materials and innovative microelectronic packaging devices. We offer leading-edge products such as our new BondFlowTM Adhesive and a range of sputtering targets, evaporation materials, braze and soldering materials, plating anodes and a large portfolio of high-reliability ceramic packages and hermetic cover/lids. development in respect of ultrasound methodology and transducer development.
For more information, please visit: www.materion.com
Important deadlines and facts:
Please make sure to submit your company logo as a vector graphic (.eps or .ai format) in 4 colors (4c)
for print purposes and as an RGB image for digital applications.
Our 2017 Sponsors:
Click here and check who supported the MEMS & Sensors Summit last year.