mems-and-sensors-2018-program

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Combined programs overview

Wednesday, 19thThursday, 20thFriday, 21st
Session 1Session 2Session 6
  Executive Keynotes Joint Opening SessionMEMS & Sensors Business and Market Forecast MEMS Applications
 Imaging & Sensors Overview & Markets Imaging & Sensors Applications
  Session 3Session 7
  MEMS & Sensors Technology Showcase  Joint Session (TBD)
  Imaging & Sensors Technology Showcase  
  Session 4  
  MEMS & Sensors Technologies  
  Imaging & Sensors Technology and Manufacturing  
  Session 5  
  MEMS Manufacturing  
  Imaging & Sensors Applications  
   

 

MEMS & Sensors Summit program

 

Wednesday, September 19th

 

16:00

 

Registration / Welcome Coffee 

16:45 Summit Opening by

 

     Ajit Manocha,
    President 
and CEO, SEMI 
Mounier
     Jean-Marc Chery,
     President 
and
CEO, STMicroelectronics 
 

Session 1
Executive Keynotes - Amphitheater      (Common track with Imaging & Sensors Summit
Chair: Laith Altimime, President, SEMI Europe


 

17:00 - 19:00 Executive Keynotes Featuring:  

17:00

Sensors, Cars and the Road Ahead
Lars Reger, Senior Vice President and Automotive Chief Technology Officer, NXP Semiconductors 

17:30TBA
18:00Sensors technologies: from data acquisition to embedded information 
Emmanuel Sabonnadiere, CEO of the LETI, CEA-Tech
18:30From cloud to the edge: the smart city and personal data 
Claus Habfast, Vice-Chair, Grenoble-Alps Metropolitan Council
  Stay tuned, the next keynote will be announced soon!

19:00

 

Networking Reception                                                                                                

 

 

Thursday,  September 20th 

Session 2
MEMS & Sensors Business and Market Forecast

Chair: Gerhard Lammel, Senior Manager MEMS, Bosch Sensortec 


 

08:00

 Welcome Coffee 

08:40

Wolf

Megatrends Impacts on the MEMS Business
Eric Mounier, Senior Analyst - Photonics, Sensing & Displays Division, Yole Développement    

09:05

Disruption in the authentication sensor market  
Manuel Tagliavini, Principal Analyst, MEMS & Sensors, IHS Markit

09:30

Future trends and drivers for sensors markets - The sensor users' perspective 
Michael Alexander, Partner, Roland Berger 

09:55

 

Coffee Break

 

 

Session 3
MEMS & Sensors Technology Showcase 

Chair: Ignas van Dommelen, CSO, Sencio           


 
11:00

Optimization of PMUT Fingerprint Sensor Arrays Using OnScale
Andrew Tweedie, OnScale 

11:10

New wafer bond metrology tool for process development and in-line process control 
Vytas Masteika, Process Engineer, Applied Microengineering Ltd 

11:20

PillarHall - Lateral High Aspect Ratio Test Chips
Mikko Utriainen, Senior
Scientist, VTT Technical Research Centre of Finland 

11:30

Novel Materials for MEMS Packaging
Markus Schindler, DELO Industrial Adhesives

11:40

Advanced Nano Coating Solution Benefits to IoT
Rick Fung, CEO, NanoFlowX 

11:50

Energy-efficient IoT and wearable applications – enabled by the ultra-low power MEMS acceleration sensor BMA400
Andreas Prümm, Product Manager Product Area MEMS Inertial, Bosch Sensortec GmbH 

12:00

 

Lunch  Sponsored by:
  

 

 

Session 4
MEMS & Sensors Technologies

Chair: Eric Pabo, Business Development Manager MEMS, EVG


 

14:05

Mounier

The next opportunity for MEMS: from the consumer market to high volume automotive and industrial markets  
Benedetto Vigna, President, Analog, MEMS & Sensors Group, STMicroelectronics

14:30

Mounier

MEMS-Based techniques for alignment of single/mode hybrid optics
Bardia Pezeshki, CEO, Kaiam

14:55

Advanced substrates for MEMS and photonic applications
Vesa-Pekka Lempinen, Senior Manager, Customer Support, Okmetic Oy

15:20

Smart Cut technology applied to MEMS: illustration in the field of ultrasonic transducers
Bruno Ghyselen, Senior Expert R&D corporate, SOITEC 

15:45

 

Coffee Break

  

 

 

Session 5
MEMS Manufacturing

Chair: Christophe Zinck, Senior Application Engineering Manager, ASE Group

Sponsored by 

 
16:50We Thank our Sponsor
Greg Mlynar, Director, Materion
16:55

Molecular Vapor Deposition (MDV): a versatile, multifunctional technology with
applications in MEMS, packaging and beyond. 
David Springer, Product Manager for MVD, SPTS

17:20 Challenges of MEMS manufacturing for industrial markets: from myth to reality
Antoine Filipe, Director of High-Performance Inertial Products, TDK-Tronics
17:45

Metrology and Inspection − Ways to Address New Challenges and in the More
than Moore Technology Environment

Daniel Harel, Director Product Management, Applied Materials

18:10

Embracing Design for Manufacturing in MEMS – Success and Disappointment
Ian Roane, President and CEO, Micralyne 

18:35 End of 2nd day
18:45 Bus Shuttle
19:00  

GALA DINNER at Le Téléférique                                                                                             Sponsored by:  



 

Friday, September 21st

 

Session 6
MEMS Applications

Chair: Frederic Breussin, VP of Strategic Development, Yole Développement 


 

08:00

 Welcome Coffee

08:35

Next generation MEMS Variable Optical Attenuators: towards the maturity,
silicon area optimization and process robustification
 
Valerie Redron, Senior Director AME, SAFRAN - Colibrys 

09:00

Breaking the MEMS micro speaker barrier
Andrea Rusconi-Clerici, CTO, USound

09:25

Making wearables always wearable - with MEMS sensor technology  
Peter Weigand, VP Business Strategy, Bosch Sensortec

09:50

Sensors enabling smart HMI 
Christian Mandl, Senior Director for Human Machine Interface (HMI), Infineon Technologies AG

10:15

 

Coffee Break

  

 

 

Session 7
Smart applications using AI, AR, VR and VM          
(Common track with Imaging & Sensors Summit)

Chair: Jean-Luc Jaffard, Consultant & Advisor, Redbelt Conseil


 
11:00AI at the Edge: Making Always-on Machine Vision a Reality
Evgeni Gousev, Senior Director Engineering, Qualcomm Technologies
11:25What value can Digitization of Electrical Distribution bring to Semiconductor Fabs Managers?
Pierre Tabary, Vice-President Strategic Customers and Segments, Schneider Electric
 
11:50Sensing, Delivering the fuel to power AI in healthcare
Mark-Eric Jones, CEO
Léman Micro Devices
12:15
Sensors - From Red Hot Chillies to Patients

12:40

Mounier

Closing Remarks  
Junko YoshidaChief International Correspondent, EE TIMES

12:50

 

LunchSponsored by:
 
 
 
 

B2B Matchmaking

Don’t miss the opportunity to meet with peers and network! All registered attendees can benefit of our B2B Matchmaking 
  • Find new customers, suppliers and cooperation partners
  • Present yourself to visitors and exhibitor
  • Meet your future cooperation partners

 

 

 

List of the Steering Committee

Roberto Zafalon
STMicroelectronics
Frederic Breussin
Yole Développement
Marco FerreraSTMicroelectronics
Marc Hennemeyer
Suss MicroTec
Gerhard Lammel
Bosch Sensortec
Philippe MonnoyerVTT
Marc Osajda
NXP
Eric Pabo
EVG
Philippe Robert
CEA Leti
Uwe Schwarz
X-Fab
Manuel Tagliavini
IHS Markit
Dave Thomas
SPTS Technologies 
Ignas van Dommelen
Sencio
Martina Vogel
Fraunhofer ENAS
Anna-Riikka Vuorikari-Antikainen
Okmetic
Christophe Zinck
ASE Group
Mario ZotesInfineon Technologies AG
Michael CiesinskiSEMI
Heidi HoffmanSEMI
Steve WhalleySEMI