MEMS and Sensors 2017 Program

 

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AGENDA

Wednesday, September 20th


 

16:00

 

Registration / Welcome Coffee 

16:45

 

Opening
Ajit Manocha, President and CEO, SEMI 
Laith Altimime, President, SEMI Europe

 


Session 1: GLOBAL TRENDS (common track of the Imaging & Sensor Summit- Amphitheater)
Chair:          Laith Altimime, President, SEMI Europe


 

17:00

The next wave of sensors – smart and connected
Carlo Bozotti, CEO, STMicroelectronics                 

17:30

Chae Lee

Sensor as a solution
Chae Lee, Senior VP, LG Electronics

18:00

Wolf

 

New Technologies and Applications for Micro-(Opto-)Electro-Mechanical Systems at Fraunhofer
Hubert Karl Lakner, Chairman of the Board of Directors of the Fraunhofer Group for Microelectronics and Director of Fraunhofer IPMS

 

18:30

Wolf

In the era of mixed reality and augmented environment sensing, what does innovation mean? What is Leti’s vision?
Marie Noelle Semeria, CEO, Cea-Leti

19:00

 

Networking Reception                                                                                                 sponsored by: 

 

Thursday,  September 21st 


Session 2: MEMS & Sensors Business and Market Forecast
Chair:    Marc Osajda, Business Development Manager, NXP


 

08:00 Welcome Coffee

08:40

Wolf

Machine Hearing: Audio is Key to AI Usage
Peter Cooney, Principal Analyst & Director, SAR Insight & Consulting

09:05

Mounier

MEMS and Sensors, the New Deal!
Eric Mounier, Senior Analyst, Yole Développement

09:30

Bouchaud

Disruptions in the MEMS microphone industry
Jeremie Bouchaud, Director and Senior Principal Analyst, MEMS & Sensors, IHS Technology

09:55

 

Coffee Break

 


Session 3: / MEMS & Sensors Technology Showcase
Chair:    Anne-Marie Dutron, Chief Technology Officer Emerging Technologies, SEMI                         sponsored by:  


 Read about our Technology Showcase finalists here 

11:00

Wolf

New Bosch MEMS microscanner BML050 for interactive laser projection - Transforming any surface into a virtual user interface
Lutz Rauscher, Bosch Sensortec GmbH
11:10Bekkers
cMUT: Breakthrough ultrasonic technology
Paul Bekkers, Philips Innovation Services
11:20
Ubiquitous Spectral Sensing - Si-Ware's NeoSpectra MEMS Spectral Sensors Enabling Material Analysis Anywhere
Bassam Saadany, Business Unit Manager, MEMS Business Unit, Si-Ware
11:30
Grafe
MEMS-based ultrasonic sensor systems for applications in gaseous and fluid environment
Mario Grafe, Fraunhofer Institute for Photonic Microsystems IPMS
11:40
Rupin
Ultrasonic piezo transducers for smart haptic solution for touch screen applications
11:50 Discussion

12:00

 

Lunch                                                                          sponsored by:      

 


Session 4: MEMS & Sensors Technologies
Chair:    Ignas van Dommelen, CSO, Sencio                                        sponsored by: 

14:05

Wolf

Role of inertial sensing in autonomous driving
Tommi Vilenius, Senior Manager, Automotive Business Development, Murata

14:30​

Hartwell

A Backup Solution for your Experiences
Peter Hartwell, Sr. Director Advanced Technology, TDK/Invensense

14:55

Yimin Guan

Intelligent Microfluidic Modules and Applications
Yimin Guan, Vice President, SITRI

15:20

Horsley

Using MEMS to Bring Ultrasonic Sensing to Consumer Electronics
David Horsley, CTO, Chirp Microtechnologies   

15:45

 

Coffee Break

 


Session 5: MEMS Manufacturing
Chair:    Dave Thomas, Marketing Director, Etch Products, SPTS Technologies               sponsored by:  


 

17:15​Pabo

Autonomous Driving, Sensors, and Wafer Bonding​
Eric Pabo, Business Development Manager MEMS, EVG

17:40

Ganio

Wafer-level MEMS test and MEMS WLCSP final test: Requirements and solutions
Andrea Ganio, VP – Worldwide Operations, SPEA

18:05

Herbig

From sampling to ramping: the long way towards high volume MEMS production      
Volker Herbig, Vice President Business Unit MEMS, X-Fab

18:45​

 

Gala Dinner (MEMS and Imaging Summits)
Entrance tickets can be purchased before the event. The Gala Dinner venue is only 5 walking minutes away.         sponsored by:    
If you require assistance, and need a taxi service, please contact us beforehand.

 

Friday, September 22nd


 

08:00

 

Welcome Coffee

 


Session 6: MEMS Applications
Chair: Gerhard Lammel, Senior Manager MEMS, Bosch Sensortec


 

08:35

Wolfgang Schmitt

The hidden champions of your everyday life – how MEMS sensors enable the IoT
Wolfgang Schmitt, Senior Manager Strategic Marketing, Bosch Sensortec                

09:00

MEMS and Sensors: Spanning Mobile to Automotive Requirements
Sitaram Arkalgud, Vice President - 3D Applications, Xperi Corporation

09:25

Pradilla

From sensors to cloud: IoT solutions for a Smart World
Sandra Pradilla, KAM Europe & Africa Distribution Channel, Libelium

09:50

Lathinen

Motion Measurement: the next big thing in sports monitoring
Terho Lahtinen, Senior Manager, Future Concepts, Suunto

10:15

 

Coffee Break

 


Session 7: Smart Applications using AR, VR, and 3D
(common track of the Imaging & Sensor Summit- Amphitheater)
Chair:    Jean-Luc Jaffard, Director, Red Belt SA


 

11:00

Virtual & Augmented reality @ Airbus, the new deal !
Fabien Dumon, Simulation Software Engineer, Airbus Defense & Space

11:25

Key technologies and EDA environment for enabling smart Cyber Physical Systems
Thierry Collette, DVP Division, Architecture, Design and Embedded SW division, CEATech

11:50

Yiwan Wong

Image Sensors for Future VR
Yiwan Wong, Partnership Lead, Oculus Research

12:15

Helm

Ambient Sensing – New ways how intelligent devices can cope with the environment
Roland Helm, Segment Head Sensors, Infineon Technologies AG

12:40

 

Closing Remarks

13:00

 

Lunch                                                                                         sponsored by:      

 
See last year Program and Speakers: European MEMS Summit 2016
 

B2B Matchmaking

Don’t miss the opportunity to meet with peers and network! All registered attendees can benefit of our B2B Matchmaking (Rooms Chrome – Minatec Maison)
  • Find new customers, suppliers and cooperation partners
  • Present yourself to visitors and exhibitor
  • Meet your future cooperation partners

 

List of the Steering Committee

 

Rolf Aschenbrenner
Fraunhofer IZM
Jérémie Bouchaud
IHS
Frederic Breussin
Yole Développement
Marc Hennemeyer
Suss MicroTec
Gerhard Lammel
Bosch Sensortec
Marc Osajda
NXP
Eric Pabo
EVG
Philippe Robert
CEA Leti
Uwe Schwarz
X-Fab
Dave Thomas
SPTS Technologies 
Ignas van Dommelen
Sencio
Martina Vogel
Fraunhofer ENAS
Anna-Riikka Vuorikari-Antikainen
Okmetic
Marco Ferrera
STMicroelectronics
Christophe Zinck
ASE Group
Philippe Monnoyer
VTT
Sampo Harkoenen
Infineon

 

Marketing & Sponsorship Opportunities Contact


• Denada Hodaj • Tel: +33 4 56 59 30 59 E-Mail: dhodaj@semi.org mail or check our Sponsorship Package

 

Event Organiser Contact 


Anne-Marie DutronTel: +33 4 56 59 30 56 • E-Mail: adutron@semi.org mail