Imaging and Sensors Summit Program

 
 

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AGENDA

Wednesday, September 20th


 

16:00

 

Registration / Welcome Coffee 

16:45

 

Opening
Ajit Manocha, President and CEO, SEMI 
Laith Altimime, President, SEMI Europe

 


Session 1: GLOBAL TRENDS (common track of the Imaging & Sensor Summit- Amphitheater)
Chair:         Laith Altimime, President, SEMI Europe


 

17:00

The next wave of sensors – smart and connected
Carlo Bozotti, CEO, STMicroelectronics                 

17:30

Chae Lee

Sensor as a solution
Chae Lee, Senior VP, LG Electonics

18:00

Wolf

 

New Technologies and Applications for Micro-(Opto-)Electro-Mechanical Systems at Fraunhofer
Hubert Karl Lakner, Chairman of the Board of Directors of the Fraunhofer Group for Microelectronics, and Director of Fraunhofer IPMS

 

18:30

Wolf

In the era of mixed reality and augmented environment sensing, what does innovation mean? What is Leti’s vision?
Marie Noelle Semeria, CEO, Cea-Leti

19:00

 

Networking Reception                                                                            sponsored by:    

 

Thursday,  September 21st 


Session 2: Present and Future Imaging Application
Chair:         Jean-Luc Jaffard, Director, Red Belt SA


 

08:00 Welcome Coffee

08:40

How can Virtual and Augmented Reality address the rapidly changing knowledge transfer needs caused by technology disruption?
Mats Johansson, CEO, EON Reality

09:05

Kuhnke

3D Time-of-Flight Cameras in Industrial Applications
Thomas Kuhnke, Senior Electronics Design Engineer, 3D Business, Basler AG

09:30

Tuomas Pantsar

Hybrid semiconductor direct conversion CMOS x-ray imaging detectors with application examples   
Tuomas Pantsar, Chief Technology Officer / Charge Integration, Oy Ajat

09:55

Phillip Wartenberg

CMOS based microdisplays, imager and sensors enhanced by OLED/OPD integration  
Philipp Wartenberg, IC Design Engineer and Project Manager / Deputy head of department IC and System Design,
Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP

10:30

 

Coffee Break

 


Session 3:  Technologies for Autonomous Vehicle        
Chair:           Bernd Buxbaum, CEO, pmdtechnologies ag


 

11:10

Deeplearning@ST, accelerating convolutional neural networks with a scalable architecture in FD-SOI 28nm
Thomas Boesch, Senior Design Engineer, Member of Technical Staff, STMicroelectronics

11:35

Simon Thibault

Custom Approach From Lens Design to The Next Generation of 360o Virtual Reality Applications
Simon Thibault, Professor Laval University and Principal Lens Designer Immervision

12:05

Wolf

Challenging the point-cloud conundrum                              
Max Ruffo, Founder and CEO, Terabee

12:35

David Coupe

ADAS computer vision products: how to reach energy efficiency rating “AAA” with proper HW/SW mix?
David Coupe, System strategy/CTO, Bosch Visiontec

13:00

 

Lunch                                                                          sponsored by:      

 


Session 4: Imaging Core Technologies
Chair:         Bruno Mourey, CTO, CEA-LETI


 

14:05

Bhanti

TSMC Imaging Technology to Enable Innovation in AR/VR Applications
Tripti Bhanti, Senior Technical Manager, TSMC Europe BV

14:30​

Thomas Uhrmann

Fusion Bonding Enabler for Backside Illuminated Image Sensors - What’s Next
Thomas Uhrmann, Director of Business Development, EVG

14:55

Technological Trends in Thermal Image Sensors
Christel-loic Tisse, Technical & Innovation Director, ULIS

15:20

Lutz Mattheier

Packaging of Image Sensors and Devices
Lutz Mattheier, Manager Assembly Technology Development, First Sensor Microelectronic Packaging GmbH

15:45

 

Coffee Break

16:10

Image Fusion: How to Best Utilize Dual Cameras
Roy Fridman, Director of Product Marketing, Corephotonics

 


Session 5: Start-up Pitches Session
Chair:          Philippe Monnoyer,  Business Development Manager, VTT


 

17:15​

LabPad, my handy lab. From smartphone sensors to universal minilabs
Vincent Poher, President, AVALUN

17:30

Palle Dinesen

Intelligent, low-cost sensor architecture and devices for IoT applications
Palle Dinesen, CEO, UbiqiSense

17:45

Tapani Ryhänen

High Performance CMOS Integrated Graphene Photodetectors
Tapani Ryhänen, CEO, Emberion

18:00

Renato Turchetta

Custom CMOS image sensors
Renato Turchetta, CEO, IMASENIC

 

 

 

18:45​

 
Gala Dinner (MEMS and Imaging Summits)
Entrance tickets can be purchased before the event                                                                          sponsored by:      

 

Friday, September 22nd


 

08:00

 

Welcome Coffee

 


Session 6: Hyperspectral and Industrial Imaging
Chair:         Markus Rossi, Senior Vice President Innovations, AMS AG


 

08:20

Lensfree microscopy: a new framework for the imaging of viruses, bacteria, cells and tissue
Cedric Allier, Scientist & Project Manager, CEA-Leti                

08:45

New developments in logarithmic pixels and sensors
Yang Ni, Founder & CTO, NIT

09:10

Juha Kalliopuska

Colour X-ray Imaging Solutions for Non-Destructive Testing based on Photon Counting Technology
Juha Kalliopuska, Chief Executive Officer and Co-founder, Advacam

09:35

Guy Meynants

High resolution global shutter image sensors for machine vision and 8K video
Guy Meynants, Engineering Fellow, ams/CMOSIS

10:00

VTT’s hyperspectral imaging technology - from high-performance applications towards volume scalability
Anna Rissanen, Research Team Leader, VTT

10:25

 

Coffee Break

 


Session 7: Smart Applications using AR, VR, and 3D (common track of the Imaging & Sensor Summit- Amphitheater)
Chair:  Jean-Luc Jaffard, Director, Red Belt SA


 

11:00

Virtual & Augmented reality @ Airbus, the new deal !
Fabien Dumon, Simulation Software Engineer, Airbus Defense & Space

11:25

Key technologies and EDA environment for enabling smart Cyber Physical Systems
Thierry Collette, VP Division, Architecture, Design and Embedded SW division, CEATech

11:50

Image Sensors for Future VR
Yiwan Wong, Partnership Lead, Oculus Research

12:15

Helm

Ambient Sensing – New ways how intelligent devices can cope with the environment
Roland Helm, Segment Head Sensors, Infineon Technologies AG

12:40

 

Closing Remarks

13:00

 

Lunch                                                                          sponsored by:      


B2B Matchmaking

Don’t miss the opportunity to meet with peers and network! All registered attendees can benefit of our B2B Matchmaking (Rooms Chrome – Minatec Maison)
  • Find new customers, suppliers and cooperation partners
  • Present yourself to visitors and exhibitor
  • Meet your future cooperation partners

List of the Steering committee 

Jean-Luc Jaffard (Chairman)

Redbelt Conseil

Andreas Braeuer

Fraunhofer-Institut IOF

Bernd Buxbaum

pmdtechnologies ag

Bruno Mourey

CEA-Leti

Markus Rossi

Heptagon Microoptics

Marcus Verhoeven

aSpect Systems GmbH

Marc Vasseur

STMicroelectronics

Lindsay Grant

Omnivision

Matthias Schicke

Fujifilm

Pierre Cambou

Yole Développement