European 3D Summit ● 22-24 Jan 2018 ● Dresden, Germany
Heterogeneous Integration driving 3D
This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, thermal management and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.
Spotlight on Applications and future 3D Technologies
Reputable keynote and invited speakers will present their choices and strategies among the 3D Integration technologies pallet, giving particular attention to current adoption for applications such as high-end memories, performance applications, mobile, imaging and automotive.
SEMI intends to highlight the latest business challenges and opportunities in the 3D sector by kicking off the summit with a market briefing. At the market briefing, attendees will hear from several 3D and packaging industry experts who will present their exclusive business & market insights and reverse engineering analysis confirming the huge growth of advanced packaging as forecasted.
Association Partners 2018
Media Partners 2018
Thank you to all the 2018 media partners for their support and promotion.
To support the European 3D Summit 2018 please contact Serena Brischetto, Manager Marketing and Communications, via firstname.lastname@example.org