European-3D-Summit-2018

 
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European 3D Summit ● 22-24 Jan 2018 ● Dresden, Germany


Heterogeneous Integration driving 3D


This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, thermal management and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.


Spotlight on Applications and future 3D Technologies

Reputable keynote and invited speakers will present their choices and strategies among the 3D Integration technologies pallet, giving particular attention to current adoption for applications such as high-end memories, performance applications, mobile, imaging and automotive.

SEMI intends to highlight the latest business challenges and opportunities in the 3D sector by kicking off the summit with a market briefing. At the market briefing, attendees will hear from several 3D and packaging industry experts who will present their exclusive business & market insights and reverse engineering analysis confirming the huge growth of advanced packaging as forecasted.

 


 
 

Are you looking for 3 minutes of glory?
Share your innovative ideas on 3D technologies and get immediate feedback at the 3D Speakers´ Corner (located in the exhibition area).

 

Take advantage of our New Business Development platform: meet your customers, peers and suppliers at the B2B Matchmaking.
 

 

Join us! This is the platform for networking, business development and exchange of technical knowledge within peers.
 

Register here for a 3 minutes pitch.

 

Register here and upload your profile.

  

 

Click here to register for the Fraunhofer Tour (on 22 January, free of charge)

  

 

 

 

 

 

 

 

 

 

 


Association Partners 2018

 
          
 

 


Media Partners 2018

Thank you to all the 2018 media partners for their support and promotion. 

3DInCitesChipScaleReviewClean Room Magazine 
    
i-Micronews 
    
smartsystemintegration 
    

To support the European 3D Summit 2018 please contact Serena Brischetto, Manager Marketing and Communications, via sbrischetto@semi.org 

 

 

 

 

Platinum Sponsor

  

 

 

 

Gold Sponsor

ASE Group

 

 

 

Silver Sponsors

SUSS Microtec

 

 

  
Event Sponsors

 

 

EVG