European 3D Summit 2017 – Sponsors


Sponsorship 2017

Four years strong, the European 3D Summit has become one of the most visible 3D Integration events! Sponsors of the European 3D Summit event stand out as leaders in the 3D microelectronics industry and leave a strong impression of their brand in the minds of attendees coming from the industry.
>Sponsorship OpportunitiesCLICK HEREContact
Associate your name with leading 3D Integration Technology!
Apply for sponsorship today!
Anne-Marie Dutron, 
Sr. Director of Business Development



Sponsors 2017


Platinum Sponsors

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets. With the acquisition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet solutions for die level printing and UV Laser Drilling for through mold vias. SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific.
For more information please visit and


Gold Sponsors

The ASE Group is the world's largest provider of independent semiconductor manufacturing services in assembly and test. Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and SiP solutions to meet growth momentum across a broad range of end markets. While addressing global proliferation of sophisticated electronics geared towards improving lifestyle and efficiency, ASE strengthened its OSAT market leadership position by generating sales revenues of US$4.84 Billion in 2013 and employs over 50,000 people worldwide.
For more information on ASE, including our advances in SiP, copper pillar, and, 2.5D, 3D & TSV technologies, please visit


EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.
For more information please visit


As one of three advanced-research institutes within the CEA Technological Research Division, CEA-Leti serves as a bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. It is committed to creating innovation and transferring it to industry. Backed by its portfolio of 2,800 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched 54 startups. Its 8,500m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. With a staff of more than 1,800, Leti is based in Grenoble, France, and has offices in Silicon Valley, Calif., and Tokyo.
For more information please visit


Silver Sponsors

Applied Materials, Inc. (Nasdaq: AMAT) is the global leader in precision materials engineering solutions for the semiconductor, flat panel display and solar photovoltaic industries. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world.
For more information please visit


Imec is the world-leading research and innovation hub in nanoelectronics and digital technologies. The combination of our widely acclaimed leadership in microchip technology and profound software and ICT expertise is what makes us unique. By leveraging our world-class infrastructure and local and global ecosystem of partners across a multitude of industries, we create groundbreaking innovation in application domains such as healthcare, smart cities and mobility, logistics and manufacturing, and energy. Imec’s industrial affiliation program on 3D-IC technology explores technology options to define innovative solutions for cost-effective realization of 3D interconnect using through-silicon-vias (TSV), fine pitch microbumps as well as wafer-to-wafer bonding. Imec’s 3D integration processes are completely executed on 300mm. To give our partners maximal information, we integrate and test baseline 3D-processes and flows on functional circuit demonstration vehicles. Imec also explores 3D design to propose methodologies for critical design issues, enabling effective use of 3D interconnection on system level.
For more information please visit


KOBUS (formerly Altatech Deposition Division) has developed a unique deposition method at the crossroads of ALD and CVD: F.A.S.T. for Fast Atomic Sequential Technology. Based on proprietary CVD reactor design combined with pulsed capability, it is optimal for thick and conformal layer and offers solution for 3D integration challenges. KOBUS develops highly efficient cost effective CVD technologies used for R&D, pilot and manufacturing of semiconductor, LEDs, MEMS and photovoltaic devices. KOBUS offers a unique portfolio of equipments for both mature and advanced materials deposition. Today KOBUS develops a unique portfolio of technologies – including standard and customized equipment and expertise.
For more information please visit


With more than 60 years of engineering experience SUSS MicroTec is a leading supplier of process equipment for microstructuring in the semiconductor industry and related markets. Our portfolio covers a comprehensive range ofproducts and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.
For more information please visit



besi logo
Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. Customers are primarily leading semiconductor manufacturers, assembly subcontractors and electronics and industrial companies. Besi's ordinary shares are listed on Euronext Amsterdam (symbol: BESI) and OTCQX International (symbol: BESIY) and its headquarters are located in Duiven, the Netherlands.
For more information please visit


Beginning in 1934 as Japan's pioneering photographic film maker, Fujifilm has leveraged its imaging and information technology to become a global presence known for innovation in healthcare, graphic arts, optical devices, highly functional materials and other high-tech areas. From our roots as a photographic film manufacturer, we have steadily pursued innovative solutions in an increasingly broad range of fields, from imaging to medical systems.
For more information please visit


kla tencor
KLA-Tencor, a leading supplier of process control and yield management solutions, serves the semiconductor and related nanoelectronics industries with state-of-the-art inspection and metrology technologies. With a broad portfolio of application-focused technologies and expertise, KLA-Tencor helps nanoelectronics manufacturers manage yield throughout the fabrication process and respond to the challenges posed by shrinking device sizes, the transition to new production materials, new device and circuit architecture, more demanding lithography processes and new back-end packaging techniques. KLA-Tencor is headquartered in Milpitas, Calif., and has manufacturing, support and R&D facilities throughout the world.
For more information please visit


Lam Research
Lam Research Corp. is a trusted global supplier of innovative wafer fabrication equipment and services to the semiconductor industry.  Lam's broad portfolio of market-leading deposition, etch, and clean solutions helps customers achieve success on the wafer by enabling device features that are 1,000 times smaller than a grain of sand, resulting in smaller, faster, more powerful, and more power-efficient chips.  Through collaboration, continuous innovation, and delivering on commitments, Lam is transforming atomic-scale engineering and enabling its customers to shape the future of technology. 
For more information, please visit



Mentor Graphics is a leader in electronic design automation software. We enable companies to develop better electronic products faster and more cost-effectively. Our innovative products and solutions help engineers conquer design challenges in the increasingly complex worlds of board and chip design
For more information please visit
STMicroelectronics is a world leader in providing the semiconductor solutions that make a positive contribution to people’s lives, today and into the future. Offering one of the industry’s broadest product portfolios, ST serves customers across the spectrum of electronics applications with innovative semiconductor solutions for Smart Driving and the Internet of Things. By getting more from technology to get more from life, ST stands for life.augmented.
For more information, please visit:


Trymax Semiconductor BV and Trymax Semiconductor Equipment BV are privately held companies.  Trymax has been on operation since 2003 and has its registered headquarters in Nijmegen, the Netherlands. We are ISO-9001 accredited and operate on a global basis, supporting our customers who operate across Europe, Asia and America.Our core business is to support semiconductor manufacturers throughout the world with innovative solutions for plasma based, photo resist removal and surface cleaning equipment, as well as isotropic etch systems that are used in the fabrication of integrated circuits and other semiconductor devices.Trymax has expanded its activities and industrial collaborations, and is now able to combine its innovative technical leadership with its expertise in systems and process design to  provide the semiconductor, telecommunications, MEMS, data storage and related industries with a wide range of plasma etching and resist removal solutions.
For more information please visit