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European 3D Summit ● 22-24 Jan 2018 ● Dresden, Germany


Sponsorship 2018

Five years strong, the European 3D Summit has become one of the most visible 3D Integration events! Sponsors of the European 3D Summit event stand out as leaders in the 3D microelectronics industry and leave a strong impression of their brand in the minds of attendees coming from the industry.

Click below to discover our sponsorship offers:


Contact: Denada Hodaj • Tel: +33 4 56 52 94 45 • E-Mail: or check our Sponsorship Package

Sponsors 2018


Platinum Sponsor

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, CVD and MVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets. SPTS is an established leader in process technologies for MEMS manufacturing with 27 of the top 30 MEMS manufacturers and all MEMS foundries as customers. SPTS has manufacturing facilities in Newport (UK),  Allentown (USA, Pennsylvania), San Jose (USA, California), and operates across 19 countries in Europe, North America and Asia-Pacific.

For more information please visit

Gold Sponsor

ASE Group

Alongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in SiP, WLP, MEMS, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit:

Silver Sponsors

Applied Materials is the leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. Our expertise in modifying materials at atomic levels and on an industrial scale enables customers to transform possibilities into reality. We collaborate with customers to predict and solve problems, and improve equipment and fab productivity. At Applied Materials, our innovations make possible the technology shaping the future.

For more information, please visit


SUSS Microtec


Suss MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.
The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.

For more information, please visit

Event Sponsor

Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Besi develops leading edge assembly processes and equipment for leadframe, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. 

For more information, please visit

The City of Dresden is an excellent place for creative minds. It has given rise to many inventions which have set worldwide trends, including Europe’s first porcelain (1708), Germany’s first locomotive (1838) and the first 35-mm SLR camera (1936). 48,000 people at approx. 1 500 companies work in the microelectronics cluster in Dresden, Europe’s largest microelectronics hub. As such, Dresden is one of Germany’s top ranked cities for technological competitiveness – evidenced by the high number of patent applications lodged in cutting-edge technology.

For more information, please visit


EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.

For more information please visit


FUJIFILM Electronic Materials (Europe) is a leading supplier to the semiconductor and packaging market. 
Our product portfolio consists of a broad range of photoresists, polyimides, CMP materials, thin film systems and high purity chemicals to the technologically demanding semiconductor manufacturers.

Some eye-catchers for 3D integration:
- Our  low-cure polyimides, a protective / dielectric layer for redistribution applications as well as buffer-coat before packaging.
- New concept of temporary bonding materials in which protective and anti-sticking functions are combined into one layer, single coat.
- A range of specialty etchants, cleaners, removers dedicated to 3D integration.

For more information, please visit us:

JSR Micro N.V., based in Leuven, Belgium, is a subsidiary of JSR Corporation, a multinational company employing over 6000 people worldwide and a leading materials supplier in a variety of technology driven markets. JSR’s global network is headquartered in Tokyo. JSR is a research-oriented organization that pursues close collaborations with leading innovators in a number of industries that are key to the present and future welfare of human society: life-sciences, energy storage, synthetic rubbers, electronic materials, display and optical materials. ‘Innovation one-on-one’ summarizes our value proposition to our customers. Through a very early and close collaboration JSR offers its customers a competitive advantage based on leading edge technologies, consistent high quality and balanced cost of ownership.

For more information, please visit

KLA-Tencor Corporation, a leading provider of process control and yield management solutions, partners with customers around the world to develop state-of-the-art inspection and metrology technologies. These technologies serve the semiconductor and other related nanoelectronics industries. With a portfolio of industry-standard products and a team of world-class engineers and scientists, the company has created superior solutions for its customers for more than 40 years. Headquartered in Milpitas, Calif., KLA-Tencor has dedicated customer operations and service centers around the world.

Additional information may be found at


As a trusted, collaborative partner to the world’s leading semiconductor companies, Lam Research is a fundamental enabler of the silicon roadmap. In fact, today, nearly every advanced chip is built with Lam technology. Our innovative wafer fabrication equipment and services allow chipmakers to build smaller, faster, and better performing electronic devices. We combine superior systems engineering, technology leadership, a strong values-based culture, and unwavering commitment to customer success to accelerate innovation, enabling our customers to shape the future.

Learn more at


Mentor Graphics is a technology leader in electronic design automation (EDA), providing software and hardware design solutions that enable companies to develop better electronic products faster and more cost-effectively.

For more information, please visit

Our core business is to support semiconductor manufacturers throughout the world with innovative solutions for plasma based, photo resist removal and surface cleaning equipment, as well as isotropic etch systems that are used in the fabrication of integrated circuits and other semiconductor devices. Trymax has expanded its activities and industrial collaborations, and is now able to combine its innovative technical leadership with its expertise in systems and process design to  provide the semiconductor, telecommunications, MEMS, data storage and related industries with a wide range of plasma etching and resist removal solutions.

For more information please visit