European-3D-Summit-2018-Sponsors

 
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European 3D Summit ● 22-24 Jan 2018 ● Dresden, Germany

 


Sponsorship 2018


Five years strong, the European 3D Summit has become one of the most visible 3D Integration events! Sponsors of the European 3D Summit event stand out as leaders in the 3D microelectronics industry and leave a strong impression of their brand in the minds of attendees coming from the industry.
 

Click below to discover our sponsorship offers:

         

Contact: Denada Hodaj • Tel: +33 4 56 52 94 45 • E-Mail: dhodaj@semi.org or check our Sponsorship Package


Sponsors 2018

 

Platinum Sponsor


SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced etch, PVD, CVD and MVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets. SPTS is an established leader in process technologies for MEMS manufacturing with 27 of the top 30 MEMS manufacturers and all MEMS foundries as customers. SPTS has manufacturing facilities in Newport (UK),  Allentown (USA, Pennsylvania), San Jose (USA, California), and operates across 19 countries in Europe, North America and Asia-Pacific.

For more information please visit www.spts.com

Gold Sponsor


ASE GroupAlongside a broad portfolio of established technologies, ASE is also delivering innovative advanced packaging and System-in-Package solutions to meet growth momentum across a broad range of end markets. For more about our advances in SiP, WLP, MEMS, Flip Chip, and, 2.5D, 3D & TSV technologies, all ultimately geared towards applications to improve lifestyle and efficiency, please visit: www.aseglobal.com
 

Silver Sponsor


SUSS MicrotecSuss MicroTec Group is a leading supplier of equipment and process solutions for microstructuring applications with more than sixty years of engineering experience. Our portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding and photomask processing, complemented by micro-optical components.
The production of memory chips, cameras for mobile phones or tire pressure sensors – the equipment solutions of SUSS MicroTec are applied within a wide variety of manufacturing processes for applications of daily or industrial use. Customers in the semiconductor industry and related markets like Advanced Packaging, MEMS and LED appreciate our comprehensive experience in wafer processing. This makes us a valuable partner for high-volume production as well as for research and development.

For more information, please visitwww.suss.com

Event Sponsor



EVG

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world.

For more information please visit www.EVGroup.com
 


JSR Micro N.V., based in Leuven, Belgium, is a subsidiary of JSR Corporation, a multinational company employing over 6000 people worldwide and a leading materials supplier in a variety of technology driven markets. JSR’s global network is headquartered in Tokyo. JSR is a research-oriented organization that pursues close collaborations with leading innovators in a number of industries that are key to the present and future welfare of human society: life-sciences, energy storage, synthetic rubbers, electronic materials, display and optical materials. ‘Innovation one-on-one’ summarizes our value proposition to our customers. Through a very early and close collaboration JSR offers its customers a competitive advantage based on leading edge technologies, consistent high quality and balanced cost of ownership.

For more information, please visit www.jsrmicro.com
 


Our core business is to support semiconductor manufacturers throughout the world with innovative solutions for plasma based, photo resist removal and surface cleaning equipment, as well as isotropic etch systems that are used in the fabrication of integrated circuits and other semiconductor devices. Trymax has expanded its activities and industrial collaborations, and is now able to combine its innovative technical leadership with its expertise in systems and process design to  provide the semiconductor, telecommunications, MEMS, data storage and related industries with a wide range of plasma etching and resist removal solutions.

For more information please visit http://www.trymax.nl/