ISS Europe - Biographies and Abstracts

 

ISS Europe 2011 Speaker Biographies and Abstract

Jean Therme, Director CEA Grenoble, Chairman of the European Commission KET HLG (Key Enabling Technologies, High Level Group)

"KET initiative: an opportunity for the European Semiconductor Industry"

Biography

 

 

Abstract

 

Carlo Bozotti, President and CEO, STMicroelectronics

“Strengths of semiconductors in Europe”

Biography

   

Carlo Bozotti is President and Chief Executive Officer of STMicroelectronics and has held this position since March 2005. He is the Sole Member of the Management Board and chairs the Company’s Corporate Executive Committee and Corporate Strategic Committee. Bozotti also serves as Vice-Chairman of the Board of Directors at ST-Ericsson SA.
Bozotti joined SGS-ATES (later renamed SGS Microelettronica), a predecessor company to STMicroelectronics, in 1977. Ten years later, when SGS Microelettronica of Italy merged with Thomson Semiconducteurs of France to form a new European champion, which is today STMicroelectronics and is among the leading semiconductor companies worldwide, Bozotti became General Manager of the Telecom Product Division. Subsequently, he was promoted to Director of Corporate Strategic Marketing and Key Accounts and, later, to Corporate Vice President, Marketing and Sales, Americas. In 1994, Bozotti was appointed Corporate Vice President for Europe and the Headquarters Regions, overseeing the Company’s sales in Europe, as well as sales to key customers and strategic marketing worldwide. From 1998 to 2005, Bozotti served as Corporate Vice President and General Manager of the Memory Products Group.
Leveraging ST’s deep understanding of client and market needs, through the years Bozotti has contributed to forging a number of strategic alliances with key customers in different market segments. More recently, as part of his strategic efforts to build scale for the Company in several businesses, Bozotti has engineered joint ventures with other industry leaders including the spinning out of ST’s Flash memory business, which has subsequently become part of a leading broadline memory supplier, and the creation of ST-Ericsson, the 50/50 JV between STMicroelectronics and Ericsson focusing on semiconductors and platforms for mobile applications.
Carlo Bozotti was born in Noviglio, near Milan, Italy, in 1952, and graduated with a degree in Electronic Engineering from the University of Pavia, Italy.

Abstract

 
 

Frédéric Barrand, Vice President Electrical and Electronic Systems Division, PSA Peugeot Citroën

“Electricity and Electronics for e-mobility : a trend for products and services”

Biography

   

Currently VP – Electrical and Electronic Systems Division PSA Peugeot Citroën
After obtaining his engineer degree at Supelec (Ecole Supérieure d’Electricité) in 1976,
Frédéric Barrand starts his career in 1977 as R&D Engineer at CERCI and SINTRA
ALCATEL in Software real time and automation.
After a couple of years, he switches to the free lance path as a consultant in real time projects for various branch from transportation up to energy dispatching.
Beginning 1990 he joins MATRA TRANSPORT (currently SIEMENS TS) as Automatization Division Director. During this period he manages 200 people specialized in subway remote and on-board automatization systems. After this experience, he moves to GIAT INDUSTRIES where he stays from 1993 until 2003.
A.o. positions he becomes head of the 3bilion Euro Leclerc Battle Tank program, before being appointed Strategy Director of the Armored Division.
2004 is the year of a new challenge: the move to the PSA PEUGEOT CITROEN Group. As Powertrain & Chassis Director first, and more recently appointed as Vice-President Electrical and Electronic Systems Division , leading the whole developments of the domain.

Abstract

   

Over the past 30 years, embedded electronics have drastically modified the automotive industry addressing through successive "waves" :

  • combustion efficiency and engine management in order to match stringent ecological regulation standards
  • dynamics and safety efficiency with equipment such as airbags, ABS or ESP
  • driver assistance and passenger comfort with equipment such as head-up display, GPS navigation system, onboard video or more recently MP3 streaming.
  • When comparing to other Transport industries such as Aeronautics or Railways, it is likely that the next "waves" of automotive electronics will address:
  • optimized management of electrical energy (generation, storage, usage)
  • connectivity to the Transport infrastructure (represented either by companies managing the Transport infrastructure or by Energy providers)

Indeed, as with Aeronautics or Railways where similar trends have been witnessed, additional and new automotive electronics systems will help to :

  • further reduce energy consumption
  • extend driving range of hybrid and electrical vehicles
  • dematerialize sensors usually implemented in the transport infrastructure (the future Vehicle embedding the Sensor Function, its measurements being uploaded to infrastructure servers in order to be merged with other acquisition data)
  • develop services that will simplify the travel experience, will reduce its stress factor and will make it even more « green driving » (by using data merged from different Vehicles and feeding this information back with added value elaborated by Infrastructure Managers)
  • propose dedicated solutions and added value services in the Maintenance area (ie : High Voltage battery management or fleet monitoring and management)

This paper addresses some typical features related to this new market trend and request, and gives some prospective ways to customer satisfaction, leading to the OEM Commercial performance.

 

Diego Olego, Senior Vice President, Chief Technology Officer, Philips Healthcare

“Medical Healthcare and how Europe is well positioned for this market”

Biography

   

Diego Olego joined Philips in 1986 and during his career with Philips he has held several leadership position in research, technology and innovation management. Since 2005 Diego Olego is a Senior Vice President and Chief Technology Officer of Philips Healthcare responsible for the innovation strategy, technology investments and research directions of the medical division. Prior to his current appointment Diego Olego spent several years with Philips Research as a Senior Researcher, Department Head of New Device Options, Vice President and Sector Head of Electronic Design and finally Senior Vice President and Managing Director of Philips Research USA. At Philips Research Diego Olego has managed technology programs and research projects in solid state electronics, displays, software development and medical instrumentation for new products spanning the breadth of Philips businesses. Before joining Philips Diego Olego was a Researcher with the Stauffer Chemical Company and a Post Doctoral Member of Bell Laboratories. Dr. Olego holds a Master of Science degree in physics from Cordoba University in Argentina, a Master of Business Administration degree from Columbia University and a Doctor of Philosophy degree in solid state physics from Stuttgart University in Germany

Abstract

   
 

Douglas Gilstrap, Senior Vice President and Head of Group Function Strategy, Ericsson

“Future Telecommunication Applications”

Biography

   

As of October 1, 2009, Douglas L. Gilstrap is Senior Vice President and Head of Strategy at Ericsson.
Gilstrap began his career in the telecommunications and IT industry in 1991, when he joined SITA (Societé Internationale de Telecommunications Aeronautiques), a Paris-based data network cooperative serving the airline industry. Prior to that he was a consultant for KPMT Peat Marwick. 
He was appointed CFO, then COO to Equant Network Services, a spin-off of SITA which was funded by Morgan Stanley private equity. As member of Equant’s founding management team, he was instrumental in taking the company public and helped turn it into one of the world’s leading data/IP networking companies.
In 2000, Douglas was named CEO of Radianz where he led a team responsible for creating, building, and managing the largest financial extranet, providing a global IP network and hosting to the financial community. The company has been named Best Financial Network by a leading industry magazine for several years running.
Later, Gilstrap was strategic advisor for Cable & Wireless for three years, where he worked on turnaround issues which included UK development and acquisition activities.
Before joining Ericsson he was CFO of APEC (Asia Pacific Exploration Consolidated), dedicated to exploration and development of petroleum resources in Southeast Asia.
He received a BS in accounting from the University of Richmond and an MBA from Emory University in Atlanta and has also attended the select executive program at Insead, France

Abstract

 

The world is already highly connected and it's about to get even more so: today, there are about five billion mobile subscriptions worldwide. As devices of all kinds become connected, there will be more mobile subscriptions than people on the planet. Ericsson envisions an increase in the number of connected devices by a factor of ten over the coming decade.
A broad range of industries will deploy connected devices; everything from transport and health care, mining and agriculture, to manufacturing and commerce (in areas such as point of sale, vending, remote information displays and digital signage). Everything that benefits from a network connection will be connected.
To serve the divergent needs of these different segments, related industries will need provisioning solutions capable of handling very large numbers of connections, as well as infrastructure with QoS mechanisms that can handle massive amounts of simultaneous differentiated sessions.

 

Bill McClean, President, IC Insights

Biography

 

Mr. McClean began his market research career in the integrated circuit industry in 1980 and founded IC Insights in 1997. During his 29 years of tracking the IC industry, Mr. McClean has specialized in market and technology trend forecasting and was responsible for developing the IC industry cycle model. At IC Insights, he serves as managing editor of the company’s market research studies and reports. In addition, he instructs for IC Insights’ seminars and has been a guest speaker at many important annual conferences held worldwide (e.g., SEMI’s ISS and Electronic Materials Conferences, The China Electronics Conference, and The European Microelectronics Summit). Mr. McClean received his Bachelor of Science degree in Marketing and an Associate degree in Aviation from the University of Illinois.

Abstract

 

IC Insights presentation will examine the current position and future outlook for the IC market with regard to the IC industry cycle model. A top-down analysis of the IC market will be given and include trends in worldwide GDP growth, electronic system sales, and semiconductor industry capital spending and capacity. In 2010, worldwide semiconductor industry capital spending almost doubled! However, some of the worst downturns in the history of the semiconductor market have come immediately after such spending surges. Will 2011 follow this pattern? IC Insights will focus on the factors that could alter this cyclical trend.

 

Malcolm Penn, President and CEO, Future Horizons

Biography

 

Malcolm Penn is the Chairman, CEO, and founder of Future Horizons, Europe's leading semiconductor industry analyst. He is also the President of Future Horizons' Moscow-based subsidiary firm, East-West Electronics, the world’s top market research consultant on the Russian and East European electronics industry.
Established in April 1989, Future Horizons provides business support services for use in opportunity analysis, business planning and new market development in the semiconductor and related industries. Its areas of activity include market research reports, custom consulting, industry forums and seminars, IC and system design evaluation services, and industry training.
Mr. Penn has over 45 years experience in the electronics industry and for most of that time has worked extensively throughout Europe as well as in the United States, the former USSR, Japan and Korea. Future Horizons was also a member of the 1994 European Commission sponsored Cornu Panel of senior industry executives responsible for publishing the “Report of the European Microelectronics Panel” used to help formulate the strategy for EC microelectronics support in Europe.
Prior to establishing Future Horizons, Mr Penn was Vice President of Dataquest and Director of Dataquest's European Operations, responsible for establishing all Dataquest's European-based research operations. Previously he was Manager of Component Engineering for ITT Europe (now Alcatel) and prior to that held various operations and marketing management positions with the worldwide ITT Semiconductor group.

Abstract

 

Future Horizons will examine the four basic industry drivers – The Economy, IC Unit Demand, Wafer Fab Capacity and IC ASPs in a top down/bottoms up view of the underlying market trends looked at both in a forensic analytical way (the reality) and how the industry feels (the perception). 2010 caught the industry by surprise with second-half year supply shortages and allocations. It also saw capital spending increase 240 percent, the first increase in more than three years. The chip market growth rate also slowed in the fourth quarter. Was this coincidence or, as so often before, the prelude to a downturn? Is the supply shortage no over or still tight? What are the real market options for 2011?

 

Leonard Hobbs, Head of Research, Intel Ireland

“20 years of Intel Manufacturing in Europe, the successful story continues….”

Biography

 

Leonard Hobbs graduated from University College Cork Ireland in 1986 with a 1st class honours degree in Electrical Engineering and was also awarded the title of ‘graduate of the year’ by the college. He completed a Masters degree at the NMRC( now called Tyndall ), at UCC in 1988. From 1988 to 1991 he worked as a research scientist at IMEC, Belgium.
In 1991 he joined Intel and since then has been involved in every technology transfer from 0.5um to 65nm, completing a number of associated assignments to Intel’s technology sites in the US.
He currently the manager of Intel Ireland's research program in silicon technologies. The research is focused primarily on nanotechnology with a view to extending Moore’s Law.
Since 2006, Leonard has been a leading light in the establishment of Ireland’s nanotechnology ecosystem. Most recently he was appointed by the Department of Enterprise, Trade and Innovation to the National Nanotechnology Coordination Body. In Europe he is a member of AENEAS Support Group and the research committee of the European Semiconductor Industry Association.

Abstract

 

Leonard will describe Intel’s 20 years of leading edge and high volume manufacturing in Europe. He will describe how Intel has leveraged Europe’s strengths in growing beyond manufacturing and now includes such initiatives as independent living, nanotechnology research and 450mm equipment development.

GUEST SPEAKER: Richard Koo, Chief Economist, Nomura Research Institute

Biography

 

Mr. Richard C. Koo is the Chief Economist of Nomura Research Institute, with responsibilities to provide independent economic and market analysis to Nomura Securities, the leading securities house in Japan, and its clients. Before joining Nomura in 1984, Mr. Koo, a US citizen, was an economist with the Federal Reserve Bank of New York (1981-84). Prior to that, he was a Doctoral Fellow of the Board of Governors of the Federal Reserve System (1979-81). In addition to conducting financial market research, he has also advised several Japanese prime ministers on how best to deal with Japan's economic and banking problems.  
In addition to being one of the first non-Japanese to participate in the making of Japan’s 5-year economic plan, he is also the only non-Japanese member of the Defense Strategy Study Conference of the Japan Ministry of Defense.
Author of many books on Japanese economy, his latest book “The Holy Grail of Macroeconomics - Lessons from Japan’s Great Recession” (John Wiley & Sons, 2008) has been translated into and sold in four different languages.
Mr. Koo holds BAs in Political Science and Economics from the University of California at Berkeley (1976), and MA in Economics from the Johns Hopkins University (1979). From 1998 to 2010, Mr. Koo was a visiting professor at Waseda University in Tokyo.
In financial circles, Mr. Koo was ranked 1st among over 100 economists covering Japan in the Nikkei Financial Ranking for 1995, 1996 and 1997, and by the Institutional Investor magazine for 1998. He was also ranked 1st by Nikkei Newsletter on Bond and Money for 1998, 1999 and 2000. He was awarded the Abramson Award by the National Association for Business Economics, Washington D.C. for the year 2001. Mr. Koo, a native of Kobe, Japan, is married with two children.

Abstract

 

Europe and United States have caught the same rare disease that afflicted Japan during the last fifteen years where record low interest rates failed to produce economic recoveries. It is a rare disease because it strikes only after the bursting of a debt-financed bubble. But when it strikes, a large portion of private sector is no longer in a position to maximize profits, but is forced to minimize debt in order to repair its battered balance sheets and credit ratings. Once the private sector is minimizing debt, however, an entirely different policy response is needed to stabilize the economy. In particular, if the private sector is so weak that it has to deleverage even with near-zero interest rates, the current European obsession with fiscal consolidation, the only game in town, is likely to make recovery even more difficult. Mr. Richard Koo, who coined the term “balance sheet recession” to describe the disease and advised five Japanese Prime Ministers fighting the disease will share his thoughts on what policy makers must do and what business leaders must watch out for during this type of recession.

 

Paolo Gargini, Intel fellow and group director, Technology & Manufacturing, Intel

“Technical Trends”

Biography

 

Dr. Paolo Gargini is the Director of Technology Strategy for Intel Corporation in Santa Clara, California. Dr. Gargini is also responsible for world-wide research activities conducted outside Intel for the Technology and Manufacturing Group by consortia, institutes and universities.
Dr. Gargini was born in Florence, Italy and received a doctorate in Electrical Engineering in 1970 and a doctorate in Physics in 1975 from the Universita di Bologna, Italy, both with full honor and marks.
He has done research at LAMEL in Bologna, Stanford Electronics Laboratory, and Fairchild Camera and Instrument Research and Development in Palo Alto from 1970 to 1977. Since joining Intel in 1978, Dr. Gargini has conducted studies on Process Reliability; he was responsible for developing the building blocks of HMOS III and CHMOS III technologies used in the 1980’s for the 80286 and the 80386 processors. In 1985 he headed the first submicron process development team at Intel.
Dr. Gargini has been the Chairman of the Executive Steering Council (ESC) of I300I and, subsequently, of International Sematech from 1996 to 2000. He is now a member of the Sematech Board. Since 1998, Dr. Gargini has been the Chairman of the International Technology Roadmap for Semiconductors (ITRS).
He is a member of various technical committees and technical advisory boards for organizations such as the Silicon Research Corporation (SRC), and the Technology Strategic Council (TSC) of the SIA in the US, IMEC in Europe, ASET and MIRAI in Japan.
He also heads the International EUV Initiative (IEUVI), formed in 2001, that fosters cooperation and coordination among the largest EUV consortia in the world.
Dr. Gargini is the facilitator of the International Consortia Cooperation Initiative (ICCI). This initiative, started in 2000, fosters exchange of information among a selected group of leading consortia and institutes in the world.
In September 2003, Dr. Gargini was included by EE Times in a very selected group of Influencers of the semiconductor industry with the following motivation: “EE Times has chosen 13 people who are influencing the course of semiconductor development technology and taking it into realms that exceed the bounds set by the inventors of the transistor more than 50 years ago. With more than 25 years in the industry, Gargini is helping to navigate tough process and manufacturing waters.”
Dr. Gargini initiated and became the first Chairman of the Governing Council of the Nano Electronics Research Initiative (NERC) funded in June 2005 by SIA. This Initiative is aimed at supporting and focusing research in universities towards subsequent commercialization of Nanoelectronics. NERC actively cooperates in this effort with USG organizations such as NNI, NSF, DARPA, and NIST.

Abstract

 

Geometrical Scaling has powered the semiconductor industry for more than 30 years in the past century. By making horizontal and vertical transistor physical dimensions smaller and by reducing power supply voltage, in accordance to the rules of Geometrical Scaling, a new technology generation was introduced every 2-3 years featuring smaller, faster and cheaper devices.
In the past 10 years the industry has transitioned to the Equivalent Scaling methods in order to reduce horizontal physical dimensions while utilizing completely different physical phenomena and new materials to continuously improve performance.
As we face the future, it appears that additional challenges lay ahead driving the technology evolution in multiple directions. The continuation and evolution of “More Moore” will require the introduction of yet new materials and new transistor structures. On the other hand the necessity of adding new features to the next generation of products will require stacking multiple dice in a single “package” and will require coexistence of multiple and different technologies on a single substrate or board. This is commonly referred to as “More than Moore”.
The combination of all these technologies will drastically change the face of the semiconductor industry in the next decade and making the right choices will become more important than ever.

Frank Melzer, CEO, Bosch Sensortec

“MEMS Technology: from Automotive to Consumer Applications”

Biography

 

Frank Melzer is the General Manager and CEO of Bosch Sensortec.
Founded in 2005, Bosch Sensortec GmbH, as a subsidiary of Robert Bosch GmbH, provides MEMS Based Sensors for the consumer electronics and industrial market.
Frank Melzer joined Bosch in 1994. In various managerial and engineering positions at Robert Bosch in Germany and Spain he has gained deep insight into various industries.
Frank Melzer received a Ph.D. in Mechanical Engineering from the University of Stuttgart and a MBA from the Rotman School of Management at the University of Toronto.
In 2008, the German Federal President awarded Frank Melzer, Jiri Marek and Michael Offenberg the prestigious prize for achievements in technology for their innovations in MEMS Sensors.

Abstract

 

MEMS sensors have a substantial impact on automotive safety systems such as airbag or electronic stability systems. During the past years the market for consumer electronics (CE) has derived significant benefits from MEMS sensors and their various possibilities. As a market leader in automotive MEMS sensors Bosch has taken the step into the CE market and with Bosch Sensortec established a major supplier in this field. The automotive and CE market will be portrayed from this point of view within the presentation concerning key data, applications and requirements. Furthermore an overview on MEMS technology and function principles will be given as well as an outlook on possible future applications.

 

GUEST SPEAKER: Prof. Dr. Elgar Fleisch, University of St. Gallen & ETH Zurich

“How the Internet of Things will influence the Semiconductor Industry”

Biography

 

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His research focuses on the economic impacts and infrastructures of ubiquitous computing. In the Auto-ID Lab he and his team develop, in concert with a global network of universities, an infrastructure for the “Internet of Things”. In the Bits-to-Energy Lab, which he co-chairs with Prof. Mattern of ETH Zurich, he investigates and designs technologies and applications to save electric power and water, and in the Insurance-Lab, Elgar Fleisch, together with Prof. Ackermann of HSG, drives forward technology-based innovation in the insurance industry. All research projects are joint efforts of industry and academia; its results have been published in more than 300 scientific journals and books.
Elgar Fleisch is a co-founder of the university spin-offs Intellion, Synesix, Coguan, Amphiro and Dacuda, and he serves as a member of multiple management boards, and academic steering committees.

Abstract

 

In the vision of the Internet of Things (IOT) minicomputers become an invisible part of many everyday objects such as drugs, electronics, consumer goods, textiles, spare parts, facilities, locations, cases, and pallets. This merge of the physical with the digital world is turning formerly dumb things into smart products that can sense their environment, change their behavior, communicate with the Internet and other smart things and enable new services. The vision of the IOT has been around for about 40 years. Now it is becoming reality on a global scale and across all industries.
In the first part of his talk, Elgar Fleisch gives an overview on recent real world IOT-applications and sketches out its general economic impact, i.e. what happens, when things also start to serve as low-cost networked sensors. In the second part he discusses the arising impacts on the semiconductor industry, including the increasing market fragmentation, the emergence of vertical and horizontal integration skills as a new core competence, the necessity of platform strategies, the danger and impossibility of geographically separation of R&D from prototyping and production, and new production approaches that leverage the IOT.

 

Robert Hagen, Senior Director and Head of Wafer Level Packaging Segment, Infineon

“Success story of the advanced packaging technology eWLB (embedded wafer level ball grid array)

Biography

 

Robert Hagen is Senior Director of the Wafer Level Packaging Segment at Infineon Technologies and holds this position since July 2009. His area of responsibility includes the further development of the eWLB technology as well as internal and external operations.
Robert has more than 15 years of experience in the semiconductor industry. He began his career as a development engineer at the Semiconductor Group of Siemens. At Siemens and later at Infineon Technologies he held various senior management positions in the area of package development, innovation and strategy, both in Germany and Malaysia.
Robert Hagen graduated in Mechanical Engineering with the focus on manufacturing science and technical management, followed by a Doctorate at the Technical University of Munich.

Abstract

 

Higher levels of System-on-Chip (SOC) integration and the continuous move towards finer CMOS chip technology nodes are tremendously driving the interconnect density of integrated circuits. State-of-the-art packaging technologies, such as wire bonded and flip chip based ball grid arrays as well as fan-in wafer level packages, are approaching their physical limits and becoming the limiting element for system cost and performance.
Already almost ten years back Infineon Technologies started in its German packaging development center to work on the next generation packaging technology for integrated circuits. Numerous innovations in the fields of materials, equipments and processes, a seamless chip-to-package co-design flow combined with a till that time unimaginable blending of frontend and backend specific process steps had been the enablers for Infineon’s newly developed embedded wafer level ball grid array (eWLB) technology. This fan-out wafer level packaging technology not only extends standard WLB technologies to higher I/O densities but also offers superior RF performance and significant perspectives for further system integration. It is designed to fit to a broad range of applications including those from mobile communication, automotive, industrial, sensors and medicine markets.
Even this technology is still pretty young, it is already widely spread in the semiconductor industry and licensed by an IDM and multiple OSATs. Fast learning cycles and the broad manufacturing base helped to bring eWLB in record time into high-volume production at various sites with competitive yield and cost position.
eWLB: a new advanced worldwide packaging standard driven out of Germany!

 

Laurent Malier, CEO, CEA-LETI

“Heterogeneous 3D Integration

Biography

 

Laurent Malier is heading the LETI - Laboratory for Electronics and Information Technology -, a research institute, based in France, within Minatec Innovation Campus. With a permanent staff of 1,100 researchers, and a global workforce exceeding 1,600 people, the LETI develops technologies and solutions in nanoelectronics, microtechnologies and their applications, specifically in telecoms, ambient intelligence, imaging, biology and healthcare. The CEA-LETI is focused on applied research and is committed to partnerships with European Industry. It develops and transfers miniaturized devices, based on its 200mm and 300mm silicon infrastructures. Intellectual Property being strength for innovation, the CEA-LETI filed more than 280 patents in 2009 and manages a portfolio of 1,600 patents, 40% of which are engaged in licences.
Laurent Malier was graduated from Ecole Polytechnique and received his PhD degree in Solid State Physics in 1994. In 1996, he joined the French ministry of Defence, in charge of R&D strategy and programs in electronics, where he was chairing the European cooperation of MODs in electronic components. In 2001, he joined Alcatel Optronics, a company producing optoelectronic components for optical telecommunications, in charge of new product developments. He took over the semiconductor business unit of Alcatel Optronics, which became Avanex in 2003.
Laurent Malier joined the LETI in 2004, first as VP strategy and programs.

Abstract

 
 

Speaker to be announced, Osram

“Synergy between semiconductor/LED and what it means for the equipment/material suppliers”

Biography

 
   

Abstract