EU Funding Program Testimonials
EU Funding Program Testimonials
AIXTRON AG Testimonial (By Prof. Dr. Michael Heuken, VP, Corporate Research and Development, AIXTRON AG)
As a high technology company, AIXTRON maintains a strong Research and Development infrastructure, with significant resources devoted to R&D projects. AIXTRON’s R&D activities are critical for the company’s strategy to maintain its position as one of the world’s leading providers of deposition equipment for the manufacturing of complex device structures for the semiconductor industry.
One important building block in AIXTRON’s longer term R&D policy is the participation in publicly-funded R&D projects. National as well as European funded R&D projects give AIXTRON the chance to collaborate with many well-known universities and research centres in the development of future advanced deposition technologies. The technology developments in the frame of such research cooperation give AIXTRON the opportunity to develop risky new deposition processes and prototype equipment ahead of marked requirements.
Currently, AIXTRON participates in six running FP7 projects, one last FP6 project, and two NIAC as well as three FP7 proposals submitted for the last calls.
AIXTRON’s funded European projects involve the development and manufacturing of processes and equipment for the selective MOCVD of IIII-V materials on Si (DUALLOGIC), material development for next generation on capacitors and memories (MAXCAPS), development and manufacturing of MOCVD production technology for III-V based concentrator solar cells (APOLLON), InAlN based HEMTS and sensors on diamond and SiC (MORGaN) as well as Si and InGaN nano rods for solar cell applications (ROD-SOL).
The large variety of R&D projects helps improve the competitiveness of AIXTRON deposition technology for the numerous emerging markets in the semiconductor sector. The European and national-funded projects strengthen AIXTRON’s position as a European world-leading manufacturer of CVD equipment and result in the creation of new jobs at AIXTRON as well as on the sub-supplier site.
Vistec Electron Beam Testimonial (By Ines Stolberg, manager, Strategic Marketing Litho, Vistec Electron Beam GmbH)
As a long-standing European equipment supplier, the Vistec Electron Beam GmbH is providing leading edge technology solutions for advanced electron-beam lithography in both direct write as well as mask making applications. Constantly increasing lithography performance requirements and an ever growing system complexity are the most challenging aspects of the company’s business, which necessitate world class R&D to enable high innovation speed. Beside Vistec’s internal R&D resources the company takes advantage out of the regional and European research infrastructure.
Since 2001, Vistec Electron Beam has participated in five different MEDEA / MEDEA+ projects and submitted a project outline for a multiple electron-beam lithography system in the recent ENIAC call. Being a partner in such European and national-funded projects ensures an aligned and application orientated product development. As an equipment supplier, Vistec established contacts with leading edge European research institutes, semiconductor manufacturers and their tremendous expertise, which hold up until today. The introduction of silicon-based electron-beam direct write for fast prototyping, design evaluation and low volume production at STMicroelectronics / CEA Leti, for the most part explored in MEDEA / MEDEA+ projects, stands as an example for the fruitful cooperation.
Even with formal requirements, administration and reporting need resources, which are often hard to spare for SMEs, the participation in European projects is more than worthwhile. These projects are very important to keep Vistec competitive in its field as it is today. Vistec Electron Beam benefits from synergies within the European and worldwide semiconductor eco-system.
To learn more about how your company can get funding from the EU for its R&D activities, please contact Carlos Lee at firstname.lastname@example.org.
August 5, 2009
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