• European Advisory Board
• Russian Advisory Committee
• SEMICON Europa Event Committee
• Semiconductor Technology Programs Committee (STC)
• European Advisory PV Group Committee
• European Manufacturing Test Conference (EMTC) Committee

• International MEMS/MST Industry Forum Committee
• Advanced Packaging Conference Committee
• European Regional Standards Committee
• ISS Conference Committee
• SEMI European Award Committee

• Mike Allison, Edwards
• Alain Astier, STMicroelectronics
• André-Jacques Auberton-Hervé, Soitec (chairman)
•  Frank Averdung, Suss MicroTec
• Volker Braetsch, Siltronic
•  Gabriel Crean, CEA / Letî
• Gilbert Declerck, IMEC
•  Andreas Dill, OC Oerlikon
• Heinz-Martin Esser, Roth&Rau
• Rob Hartman, ASML
• Michael Hummel, Texas Instruments
•  Paul Hyland, Aixtron
•  Alain Jarre, Recif Technologies
• Eric Maiser, VDMA Productronic
•  Franco Preti, LPE
•  Dirk Steenkamp, Centrotherm
• Eicke Weber, FhG ISE

SEMI organizes annual Member
Forum to meet with members

• Alain Astier, STMicroelectronics
• Jacques Berg, Tokyo Electron
• Jarek Dolak, SVCS
• Valery Dshkhunyan, Angstrem
• Andrey Golushko, Mikron
• Arieh Greenberg, M+W Group
• Marcel Kemp, ASML
• Igor Kucheryavy, Tronic Pte. (chairman)
• Alexander Kurliandsky, Electronintorg SP
• Michael Lev, Camtek
• Elena Lysyak, Centrotherm SiTec GmbH
• Hermann Marsch, Maicom Quartz
• Anatoly Sukhoparov, Angstrem T
• Torsten Thieme, Memsfabneon

Russian Advisory Committee kick-off
meeting October 2007

• Michael Arnold, PEER Group
• Livio Baldi, Micron
• Bernie Capraro, Intel Ireland Ltd
  
• Johann Bartha, Technical University Dresden
• Tom Beens, Umicore
• Jacques Berg, Tokyo Electron
• Guy Duboi, GDCL
• Fabrice Letertre, Soitec
• Pierre-Jerome Goirand, STMicroelectronics
  
• Mart Graef, TU Delft (chairman)
• Martin Heerschop, GE Capital
• Lutz Labs, Infineon
  
• Didier Louis, CEA-Leti
• Richard Oechsner, Fraunhofer IISB
• Lothar Pfitzner, Fraunhofer IISB
• Ivo Raaijmakers, ASM International
• Peter Schaeffler, Texas Instruments
• Ernst Feistle, Applied Materials
• Martin McCallum, Nikon
• Karsten Schneider, Applied Materials
• Joachim Pelka, Fraunhofer
• Matty Caymax, imec
• Philippe Campion, STMicroelectronics
  

SEMICON Europa Executive Summit
attracts over 200 top-industry leaders

• Harald Binder, BTC Technologies  (Chair)
• Wolfgang Binder, Edwards Vacuum
• Richard Grundmueller, Innolas Systems
• Andreas Guenther, Linde Electronics
• Karl Hesse, Wacker Chemie AG
• Hansjörg Kranz, Applied Materials
• Sylvère Leu, Meyer Burger Technology
• Hartmut Nussbaumer, RENA
• Lutz Redmann, Jonas & Redmann
• Horst Reichardt, DAS Europe
• Manfred Schroeder, Ebara Europe
• Norbert Thiel, PVA Tepla  (Co-Chair) 
• Harald Wanka, Manz Automation

Q-Cells fab visit

• Davide Appello, STMicroelectronics
• Conceicao Caldeira, Nanium
• Peter Cockburn, Itxc
• Stefan Eichenberger, NXP
• Piergiorgio Galletta, Micron
  
• Stefan Gasteiger, Advantest
• Klaus-Detlef Paesch, GlobalFoundries
• Chris Portelli-Hale, STMicroelectronics (co-chair)
• René Segers (chairman)
• Paul Vanulsen, Salland
  

SEMI Europe FMF Committee (Fab Managers Forum)

• Philippe Campion, Operations Manager, STMicroelectronics
• Michael Lehnert, CEO, LFoundry
• Riccardo Martorelli, Site Manager, Micron Technology Italia
• Detlef Nagel, Manager Product Line BiMOS Chips, ABB Switzerland, Semiconductors
• Peter Schaeffler, Manufacturing Manager, Texas Instruments Deutschland
• Johannnes Sturm, Infineon
• Mario von Podewils, Manager Operations, X-Fab Erfurt
• Thorsten Widmer, Fab Manager, Robert Bosch
  

• Jérémie Bouchaud, iSuppli
• Markus Gabriel, Suss MicroTec
• Stephane Gervais-Ducouret, Freescale
• Erik Jung, Fraunhofer IMZ
  
• Gerhard Lammel, Bosch (chairman)
• Paul Lindner, EVG
•   Ignas van Dommelen, Sencio
• Martina Vogel, Fraunhofer ENAS
• Anna-Riikka Vuorikari-Antikainen, Okmetic
• Laurent Robin, Yole Developpement
   
• Christian Schaefer, PVA Tepla
• Uwe Schwarz, X-Fab
• Thomas Gessner, Fraunhofer ENAS

• Rolf Aschenbrenner, Fraunhofer IZM
• Eef Bagerman, NXP
• Eric Beyne, imec
  
• Andreas Fischer, Bosch
• Michel Garnier, STMicroelectronics
  
• Andy Longford, PandA Europe (chairman)
• Jens Mueller, IMAPS Europe Chapter
• Graham Jones, Henkel
• Albert Koller, Oerlikon
  
• Steffen Kroehnert, Nanium
• Thomas Oppert, PAC TECH
• Klaus Pressel, Infineon
• Klaus Schrimper, Hesse-Knipps
  

SEMICON Europa Packaging
conference and Committee

• Werner Bergholz, University of Bremen (chairman)
• Roland Bindemann, Freiberger Compound Materials
• Massimo Carrubba, Numonyx
• Jean-Marie Collard, Solvay (chairman)
• Gummaar De Vos, FFEM
• Gordon Ferrier, Air Products
• Alfred Honold, InReCon
• Wolfgang Jantz, SemiMap
• Andy Longford, PandA Europe
• Frank Petzold, Trustsec IT Solution
• Lothar Pfitzner, Fraunhofer IISB
• Bert Planting, ASML
• Peter Wagner
• Arnd-Dietrich Weber, SiCrystal

ERSC pre-meeting dinner in Dresden

• Alain Astier, STMicroelectronics
• Paul Boudre, Soitec
• David Brough, Tokyo Electron
• Cor Claeys, IMEC (chairman)
• Peter Connock, memstar® Technology
• Frits van Hout, ASML
  
• Maurice Geraets, NXP
• Bernd Haeuser, Bosch
• Leonard Hobbs, Intel
• Hans Richter, IHP
• Gerd Teepe, GlobalFoundries
• Michael Hummel (guest)
  

ISS Committee in Zurich

• Brendan Bold, X-Fab
• Michel Brillouet, CEA-LETI
• Elmar Cullmann, Suss MicroTec
• Giorgio De Santi, Numonyx
• Mart Graef, TU Delft (chairman)
• Jean-Pierre Joly, INES
• Peter Kuecher, Fraunhofer CNT
• Klaus-Dieter Lang, Fraunhofer IZM
• Lode Lauwers, IMEC
• Heiner Ryssel, Fraunhofer IISB
• Karl-Heinz Stegemann, Signet Solar

Herbert Reichel, Fraunhofer IZM,
receives European SEMI Award 2010