SEMI Europe Committee Members
SEMI Europe Committees
Over 135 experts and influential leaders from the industry guide and support SEMI Europe.
| Mike Allison, Edwards | Rob Hartman, ASML | |||||||
| Alain Astier, STMicroelectronics | Michael Hummel, Texas Instruments | |||||||
| André-Jacques Auberton-Hervé, Soitec (chairman) | Paul Hyland, Aixtron | |||||||
| Frank Averdung, Suss MicroTec | Alain Jarre, Recif Technologies | |||||||
| Volker Braetsch, Siltronic | Eric Maiser, VDMA Productronic | |||||||
| Gabriel Crean, CEA / Letî | Franco Preti, LPE | |||||||
| Gilbert Declerck, IMEC | Dirk Steenkamp, Centrotherm | |||||||
| Andreas Dill, OC Oerlikon | Eicke Weber, FhG ISE | |||||||
| Heinz-Martin Esser, Roth&Rau | ||||||||
European Advisory PV Group Committee
| Harald Binder, BTC Technologies (Chair) | Hartmut Nussbaumer, RENA | |||||||
| Wolfgang Binder, Edwards Vacuum | Lutz Redmann, Jonas & Redmann | |||||||
| Richard Grundmueller, Innolas Systems | Horst Reichardt, DAS Europe | |||||||
| Andreas Guenther, Linde Electronics | Manfred Schroeder, Ebara Europe | |||||||
| Karl Hesse, Wacker Chemie AG | Norbert Thiel, PVA Tepla (Co-Chair) | |||||||
| Hansjörg Kranz, Applied Materials | Harald Wanka, Manz Automation | |||||||
| Sylvère Leu, Meyer Burger Technology | ||||||||
ISS Europe Conference Committee
| Alain Astier, STMicroelectronics | Bernd Haeuser, Bosch | |||||||
| Paul Boudre, COO, Soitec | Leonard Hobbs, Intel | |||||||
| David Brough, Tokyo Electron | Hans-Dirk Loewe, Infineon | |||||||
Cor Claeys, IMEC (chairman) | Hans Richter, GFWW | |||||||
| Peter Connock, memstar | Gerd Teepe, GlobalFoundries | |||||||
| Johannes Froehling, AIXTRON SE | Frits van Hout, ASML | |||||||
| Maurice Geraets, Mobility NXP | ||||||||
European Regional Standards Committee
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Semiconductor Technology Programs Committee (STC)
| Michael Arnold, PEER Group | Didier Louis, CEA-Leti | |||||||
| Livio Baldi, Micron | Richard Oechsner, Fraunhofer IISB | |||||||
| Bernie Capraro, Intel Ireland Ltd | Lothar Pfitzner, Fraunhofer IISB | |||||||
| Johann Bartha, Technical University Dresden | Ivo Raaijmakers, ASM International | |||||||
| Tom Beens, Umicore | Peter Schaeffler, Texas Instruments | |||||||
| Jacques Berg, Tokyo Electron | Ernst Feistle, Applied Materials | |||||||
| Guy Duboi, GDCL | Martin McCallum, Nikon | |||||||
| Fabrice Letertre, Soitec | Karsten Schneider, Applied Materials | |||||||
| Pierre-Jerome Goirand, STMicroelectronics | Joachim Pelka, Fraunhofer | |||||||
| Mart Graef, TU Delft (chairman) | Matty Caymax, imec | |||||||
| Martin Heerschop, GE Capital | Philippe Campion, STMicroelectronics | |||||||
| Lutz Labs, Infineon | ||||||||
European Manufacturing Test Conference (EMTC) Committee
| Davide Appello, STMicroelectronics | Stefan Gasteiger, Advantest | |||||||
| Conceicao Caldeira, Nanium | Klaus-Detlef Paesch, GlobalFoundries | |||||||
| Peter Cockburn, Itxc | Chris Portelli-Hale, STMicroelectronics (co-chair) | |||||||
| Stefan Eichenberger, NXP | René Segers (chairman) | |||||||
| Piergiorgio Galletta, Micron | Paul Vanulsen, Salland | |||||||
Fab Managers Forum Committee
| Philippe Campion, Operations Manager, STMicroelectronics | Peter Schaeffler, Manufacturing Manager, Texas Instruments Deutschland | |||||||
| Michael Lehnert, CEO, LFoundry | Johannnes Sturm, Infineon | |||||||
| Riccardo Martorelli, Site Manager, Micron Technology Italia | Mario von Podewils, Manager Operations, X-Fab Erfurt | |||||||
| Detlef Nagel, Manager Product Line BiMOS Chips, ABB Switzerland, Semiconductors | Thorsten Widmer, Fab Manager, Robert Bosch | |||||||
International MEMS/MST Industry Forum Committee
| Jérémie Bouchaud, iSuppli | Martina Vogel, Fraunhofer ENAS | |||||||
| Markus Gabriel, Suss MicroTec | Anna-Riikka Vuorikari-Antikainen, Okmetic | |||||||
| Stephane Gervais-Ducouret, Freescale | Laurent Robin, Yole Developpement | |||||||
| Erik Jung, Fraunhofer IMZ | Christian Schaefer, PVA Tepla | |||||||
| Gerhard Lammel, Bosch (chairman) | Uwe Schwarz, X-Fab | |||||||
| Paul Lindner, EVG | Thomas Gessner, Fraunhofer ENAS | |||||||
| Ignas van Dommelen, Sencio |
Advanced Packaging Conference Committee
| Rolf Aschenbrenner, Fraunhofer IZM | Graham Jones, Henkel | |||||||
| Eef Bagerman, NXP | Albert Koller, Oerlikon | |||||||
| Eric Beyne, imec | Steffen Kroehnert, Nanium | |||||||
| Andreas Fischer, Bosch | Thomas Oppert, PAC TECH | |||||||
| Michel Garnier, STMicroelectronics | Klaus Pressel, Infineon | |||||||
| Andy Longford, PandA Europe (chairman) | Klaus Schrimper, Hesse-Knipps | |||||||
| Jens Mueller, IMAPS Europe Chapter | ||||||||
