SEMI Europe Committee Members

SEMI Europe Committees

Over 135 experts and influential leaders from the industry guide and support SEMI Europe.

European Advisory Board Russian Advisory Committee SEMICON Europa Event Committee Semiconductor Technology Programs Committee (STC) European Advisory PV Group Committee European Manufacturing Test Conference (EMTC) Committee	International MEMS/MST Industry Forum Committee Advanced Packaging Conference Committee European Regional Standards Committee ISS Conference Committee SEMI European Award Committee
European Advisory Board Mike Allison, Edwards Alain Astier, STMicroelectronics André-Jacques Auberton-Hervé, Soitec (chairman) Volker Braetsch, Siltronic Gilbert Declerck, IMEC Heinz-Martin Esser, Roth&Rau Rob Hartman, ASML Michael Hummel, Texas Instruments Eric Maiser, VDMA Productronic Gerhard Rauter, Q-Cells Franz Richter, Thin Materials Gael Schmidt, SET Eicke Weber, FhG ISE		SEMI organizes annual Member Forum to meet with members
Russian Advisory Committee Alain Astier, ST Microelectronics Martin Beigl, M+W Group Jacques Berg, Tokyo Electron Alois Brandner, Applied Materials Jarek Dolak, SVCS Valery Dshkhunyan, Angstrem Andrey Golushko, Mikron Andrey Kotenko, NITOL Solar Igor Kucheryavy, Tronic Pte. (chairman) Alexander Kurliandsky, Electronintorg SP Michael Lev, Camtek Elena Lysyak, Centrotherm SiTec GmbH Hermann Marsch, Maicom Quartz Anatoly Sukhoparov, Angstrem T Manfred Schroeder, EBARA Torsten Thieme, Memsfab Dagmar Vogt, Vogt Group SE		Russian Advisory Committee kick-off meeting October 2007
Semiconductor Technology Programs Committee (STC) Lutz Labs, Infineon Michael Arnold, PEER Group Livio Baldi, Numonyx Johann Bartha, Technical University Dresden Tom Beens, Umicore Jacques Berg, Tokyo Electron Christian Carlier, STMicroelectronics Guy Dubois Fabrice Letertre, Soitec Mart Graef, TU Delft (chairman) Martin Heerschop, GE Capital Didier Louis, CEA-Leti Richard Oechsner, Fraunhofer IISB Lothar Pfitzner, Fraunhofer IISB Ivo Raaijmakers, ASM International Peter Schaeffler, Texas Instruments Ernst Feistle, Applied Materials		SEMICON Europa Executive Summit attracts over 200 top-industry leaders
European Advisory PV Group Committee Harald Binder, BTC Technologies (Chair) Wolfgang Binder, Edwards Vacuum Richard Grundmueller, Innolas Systems Andreas Guenther, Linde Electronics Karl Hesse, Wacker Chemie AG Hansjörg Kranz, Applied Materials Sylvère Leu, Meyer Burger Technology Hartmut Nussbaumer, RENA Rainer Ostermann, Festo Lutz Redmann, Jonas & Redmann Horst Reichardt, DAS Europe Silvia Roth, Roth & Rau Manfred Schroeder, Ebara Europe Norbert Thiel, PVA Tepla (Co-Chair) Dagmar Vogt, vogt Group Harald Wanka, Manz Automation Eicke Weber, Fraunhofer ISE		*Q-Cells fab visit*
European Manufacturing Test Conference (EMTC) Committee Davide Appello, STMicroelectronics Roger Barth, Numonyx Stefan Eichenberger, NXP Stefan Gasteiger, Advantest Klaus-Detlef Paesch, GlobalFoundries Chris Portelli-Hale, STMicroelectronics (co-chair) Ulrich Schoettmer, Verigy Martin Stadler, Teradyne René Segers (co-chair)
International MEMS/MST Industry Forum Committee Jérémie Bouchaud, iSuppli Markus Gabriel, Suss MicroTec Gerhard Lammel, Bosch (chairman) Paul Lindner, EVG Mikko Montonen, Okmetic Felix Rudolf, Colibrys (co-chair) Christian Schaefer, PVA Tepla Uwe Schwarz, X-Fab Peter Willemse, ASML Thomas Gessner, Fraunhofer ENAS
Advanced Packaging Conference Committee Rolf Aschenbrenner, Fraunhofer IZM Eef Bagerman, NXP Andreas Dill, Oerlikon Andreas Fischer, Bosch Andy Longford, PandA Europe (chairman) Jens Mueller, IMAPS Europe Chapter Graham Jones, Henkel Steffen Kroehnert, Nanium Thomas Oppert, PAC TECH Klaus Pressel, Infineon Mark Shaw, STMicroelectronics Ignas van Dommelen, Elmos		SEMICON Europa Packaging conference and Committee
European Regional Standards Committee Werner Bergholz, University of Bremen (chairman) Roland Bindemann, Freiberger Compound Materials Massimo Carrubba, Numonyx Jean-Marie Collard, Solvay (chairman) Gummaar De Vos, FFEM Gordon Ferrier, Air Products Alfred Honold, InReCon Wolfgang Jantz, SemiMap Andy Longford, PandA Europe Frank Petzold, Trustsec IT Solution Lothar Pfitzner, Fraunhofer IISB Bert Planting, ASML Peter Wagner Arnd-Dietrich Weber, SiCrystal		*ERSC pre-meeting dinner in Dresden*
ISS Conference Alain Astier, STMicroelectronics Paul Boudre, Soitec David Brough, Tokyo Electron Cor Claeys, IMEC (chairman) Peter Connock, memstar® Technology Horst Gant, Infineon Maurice Geraets, NXP Bernd Haeuser, Bosch Leonard Hobbs, Intel Hans Richter, IHP Gerd Teepe, GlobalFoundries		*ISS Committee in Zurich*
SEMI European Award Committee Brendan Bold, X-Fab Michel Brillouet, CEA-LETI Elmar Cullmann, Suss MicroTec Giorgio De Santi, Numonyx Mart Graef, TU Delft (chairman) Jean-Pierre Joly, INES Peter Kuecher, Fraunhofer CNT Klaus-Dieter Lang, Fraunhofer IZM Lode Lauwers, IMEC Heiner Ryssel, Fraunhofer IISB Karl-Heinz Stegemann, Signet Solar		Herbert Reichel, Fraunhofer IZM, receives European SEMI Award 2010