European Advisory Board

			Mike Allison, Edwards					Rob Hartman, ASML
			Alain Astier, STMicroelectronics					Michael Hummel, Texas Instruments
			André-Jacques Auberton-Hervé, Soitec (chairman)					Paul Hyland, Aixtron
			Frank Averdung, Suss MicroTec					Alain Jarre, Recif Technologies
			Volker Braetsch, Siltronic					Eric Maiser, VDMA Productronic
			Gabriel Crean, CEA / Letî					Franco Preti, LPE
			Gilbert Declerck, IMEC					Dirk Steenkamp, Centrotherm
			Andreas Dill, OC Oerlikon					Eicke Weber, FhG ISE
			Heinz-Martin Esser, Roth&Rau

European Advisory PV Group Committee

			Harald Binder, BTC Technologies (Chair)					Hartmut Nussbaumer, RENA
			Wolfgang Binder, Edwards Vacuum					Lutz Redmann, Jonas & Redmann
			Richard Grundmueller, Innolas Systems					Horst Reichardt, DAS Europe
			Andreas Guenther, Linde Electronics					Manfred Schroeder, Ebara Europe
			Karl Hesse, Wacker Chemie AG					Norbert Thiel, PVA Tepla (Co-Chair)
			Hansjörg Kranz, Applied Materials					Harald Wanka, Manz Automation
			Sylvère Leu, Meyer Burger Technology

ISS Europe Conference Committee

			Alain Astier, STMicroelectronics					Bernd Haeuser, Bosch
			Paul Boudre, COO, Soitec					Leonard Hobbs, Intel
			David Brough, Tokyo Electron					Hans-Dirk Loewe, Infineon
			Cor Claeys, IMEC (chairman)					Hans Richter, GFWW
			Peter Connock, memstar					Gerd Teepe, GlobalFoundries
			Johannes Froehling, AIXTRON SE					Frits van Hout, ASML
			Maurice Geraets, Mobility NXP

European Regional Standards Committee

SEMI European Award Committee

Semiconductor Technology Programs Committee (STC)

			Michael Arnold, PEER Group					Didier Louis, CEA-Leti
			Livio Baldi, Micron					Richard Oechsner, Fraunhofer IISB
			Bernie Capraro, Intel Ireland Ltd					Lothar Pfitzner, Fraunhofer IISB
			Johann Bartha, Technical University Dresden					Ivo Raaijmakers, ASM International
			Tom Beens, Umicore					Peter Schaeffler, Texas Instruments
			Jacques Berg, Tokyo Electron					Ernst Feistle, Applied Materials
			Guy Duboi, GDCL					Martin McCallum, Nikon
			Fabrice Letertre, Soitec					Karsten Schneider, Applied Materials
			Pierre-Jerome Goirand, STMicroelectronics					Joachim Pelka, Fraunhofer
			Mart Graef, TU Delft (chairman)					Matty Caymax, imec
			Martin Heerschop, GE Capital					Philippe Campion, STMicroelectronics
			Lutz Labs, Infineon

European Manufacturing Test Conference (EMTC) Committee

			Davide Appello, STMicroelectronics					Stefan Gasteiger, Advantest
			Conceicao Caldeira, Nanium					Klaus-Detlef Paesch, GlobalFoundries
			Peter Cockburn, Itxc					Chris Portelli-Hale, STMicroelectronics (co-chair)
			Stefan Eichenberger, NXP					René Segers (chairman)
			Piergiorgio Galletta, Micron					Paul Vanulsen, Salland

Fab Managers Forum Committee

			Philippe Campion, Operations Manager, STMicroelectronics					Peter Schaeffler, Manufacturing Manager, Texas Instruments Deutschland
			Michael Lehnert, CEO, LFoundry					Johannnes Sturm, Infineon
			Riccardo Martorelli, Site Manager, Micron Technology Italia					Mario von Podewils, Manager Operations, X-Fab Erfurt
			Detlef Nagel, Manager Product Line BiMOS Chips, ABB Switzerland, Semiconductors					Thorsten Widmer, Fab Manager, Robert Bosch

International MEMS/MST Industry Forum Committee

			Jérémie Bouchaud, iSuppli					Martina Vogel, Fraunhofer ENAS
			Markus Gabriel, Suss MicroTec					Anna-Riikka Vuorikari-Antikainen, Okmetic
			Stephane Gervais-Ducouret, Freescale					Laurent Robin, Yole Developpement
			Erik Jung, Fraunhofer IMZ					Christian Schaefer, PVA Tepla
			Gerhard Lammel, Bosch (chairman)					Uwe Schwarz, X-Fab
			Paul Lindner, EVG					Thomas Gessner, Fraunhofer ENAS
			Ignas van Dommelen, Sencio

Advanced Packaging Conference Committee

			Rolf Aschenbrenner, Fraunhofer IZM					Graham Jones, Henkel
			Eef Bagerman, NXP					Albert Koller, Oerlikon
			Eric Beyne, imec					Steffen Kroehnert, Nanium
			Andreas Fischer, Bosch					Thomas Oppert, PAC TECH
			Michel Garnier, STMicroelectronics					Klaus Pressel, Infineon
			Andy Longford, PandA Europe (chairman)					Klaus Schrimper, Hesse-Knipps
			Jens Mueller, IMAPS Europe Chapter