3D-systems-summit

 

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3D & Systems Summit ● 28-30 Jan 2019 ● Dresden, Germany


From 3D technologies to Heterogeneous Integration and
High-Density Systems for different applications 


The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors. 


2019 MAIN TOPICS & HIGHLIGHTS  

  • 3DIC Through-Silicon-Via (TSV) technology 
  • 2.5D, 3D FO-WLP/e-WLB
  • Active and passive interposers
  • Stacked dies or stacked wafers 
  • 3D alternative technologies 
  • 5G Integration
  • Invited speakers and Keynotes
  • Exhibition area
  • Networking opportunities

 

Have a look at last year summit:


 

CONTACTS

For more information, please contact: 

Christina Fritsch

Senior Manager, Program & Events, SEMI Europe
Tel: +49 30 3030807718
E-mail cfritsch@semi.org 

 

 

 

 

 

 

 

 

 

 

SEMI EUROPE 2019 SPONSORS​​

Interested in sponsoring the 2019 summit?
Please contact:

Denada Hodaj
European Sales Manager
Tel: +33 - 4 - 56 593059
E-mail: 
dhodaj@semi.org 

 



2019 MEDIA AND ASSOCIATION PARTNERS

We thank all 2019 media and association partners for their support and promotion. 

3DInCitesChipScaleReviewClean Room Magazine
    
i-Micronews
    
 
    

To support the 3D & Systems Summit 2019 please contact:

Serena Brischetto 
Manager Marketing and Communications, 
E-mail: sbrischetto@semi.org 


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