3D & Systems Summit ● 28-30 Jan 2019 ● Dresden, Germany
From 3D technologies to Heterogeneous Integration and
High-Density Systems for different applications
The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors.
Registration will open soon - Stay tuned!
2019 MAIN TOPICS & HIGHLIGHTS
- 3DIC Through-Silicon-Via (TSV) technology
- 2.5D, 3D FO-WLP/e-WLB
- Active and passive interposers
- Stacked dies or stacked wafers
- 3D alternative technologies
- 5G Integration
- Invited speakers and Keynotes
- Exhibition area
- Networking opportunities
Have a look at last year summit:
For more information, please contact:
Senior Manager, Program & Events, SEMI Europe
Tel: +49 30 3030807718
SEMI EUROPE 2019 SPONSORS
Interested in sponsoring the 2019 summit?
European Sales Manager
Tel: +33 - 4 - 56 593059
2019 MEDIA AND ASSOCIATION PARTNERS
We thank all 2019 media and association partners for their support and promotion.
To support the 3D & Systems Summit 2019 please contact:
Manager Marketing and Communications,