Yongjin Kim - 3D Flexible Metal Interconnect for FHE

Session 22: Direct Write

3D Flexible Metal Interconnection for FHE (flexible hybrid electronic) Devices using an Electrohydrodynamic (EHD) Technique
Thursday, June 22, 2017 
10:40 AM - 11:00 AM

A FHE(flexible hybrid electronic) devices are recently recognized as the next generation technique combining benefits from both sides such as flexible organic fields and rigid Si based fields. While the organic based field gives much flexibility with the characteristics of low cost production, they also suffer from its inherent limitations such as low charge transport, process temperature limitation, and etc. Those limitations, based on material itself, make the flexible electronic device very difficult to compete with Si-based rigid electronics that have excellent device performance. However, the rigid Si based devices are also very weak when they are in use for the flexible applications. This is why we think the FHE is the next generation technique. In order to achieve and visualize this new concept, thin device (≤ 50μm) showing high device performance was attached on the surface of deformable/flexible polymer substrates to construct flexible electronic device circuits and it is required to interconnect the thin Si based chip on the flexible polymer substrate. For this specific interconnection, we utilized an ElectroHydroDynamic (EHD) micro-patterning system which is not damaging the flexible substrate unlike the conventional wire bonding method that mechanically damages during the bonding process. To form narrow Ag based metal interconnections, we optimized various experimental parameters (flow rate [μl/min], applying voltage [kV], working distance [㎛], jetting velocity and acceleration [mm/s, mm/s2]) and the metal lines were sintered at 150 oC for 30 mins to remove any solvent contained in the solution based Ag ink.

 

Speaker's Biography

Dr. Yongjin Kim has worked in the field of organic based electronic devices for 10 years for encapsulation, reliability and indirect printing. He received a Ph.D. from Georgia Institute of Technology, US in OPVs and OLEDs. Recently, he has focused on the formation of Ag based 3D metal interconnections for FHE (flexible hybrid electronic) devices using an EHD (ElectroHydroDynamic) system at KIMM (Korea Institute of Machinery and Materials). His role also involved the reliability test for FHE devices including the investigation of the fracture and fatigue mechanism leading to developing a long term and reliable flexible electronics.

 


SPEAKER
Yongjin Kim
Korea Institute of Machinery and Materials (KIMM)