Summary of 2017FLEX South East Asia

Summary of 2017FLEX South East Asia

The 2nd Annual FLEX Southeast Asia was held on October 25-26, 2017 in Singapore at the Suntec Singapore Convention & Exhibition Center. Held in conjunction with the Advanced Semiconductor Technology Conference (ASTC), this year’s FLEX SEA theme was “The Convergent Future: Industries-wide Disruption through Flexible Hybrid Electronics.”

Over 2 days, 80+ attendees listened as 17 presenters addressed how flexible hybrid electronics (FHE) is disrupting the electronics industry and adding a new component to the semiconductor mix by producing evolved integrated products rather than a replacement or competitor.

Key takeaways from day 1 included a review by Jennifer Colegrove of Touch Display Research of the hot technology trends of AI quantum dots, flex displays, gesture & voice and proximity control. 

Raghu Das from IDTechEx, explained that 60% of the leading market drivers for FHE depend on the flexible and conformal form factor enabled by the technology. Other drivers include cost/performance at 35% and transparency as driving 5% of the market. In 2017, printed, flexible and organic electronics is a $29.3 billion industry, with OLED displays making up the majority at $21.4 billion, with printed sensors at $6.1 billion and conductive ink at $1.4 billion.

Chee Kien Lim from STATS ChicPAC built further on the new technology possibilities and emphasized system-in-package (SiP) technology is emerging as a formidable contender as a paradigm shift accelerator for the microelectronics industries.  Together with thin flex substrates, thin die, IPD and wafer leveling packaging in various applications, the future looks bright for innovation and further growth for the industry. 

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