Strategic Materials Conference 2017

Strategic Materials Conference 2017

Monday, Sep 18 – Wednesday, Sep 20, 2017
07:30 AM – 07:00 PM
Monday, Sep 18, 2017 to Wednesday, Sep 20, 2017
DoubleTree by Hilton
2050 Gateway Place
San Jose, California, United States - 95110

Materials Accelerating Innovation"

The Strategic Materials Conference—SMC 2017, is a two and half day conference with a, newly added pre-conference Welcome Reception on Monday, September 18, from 5:30–7:00pm. SMC brings together key players from the semiconductor industry ecosystem to share insights on the latest developments in Advanced Materials. It is the only premier conference devoted to technology and business drivers of materials in the microelectronics supply chain. SMC is also a great opportunity to network with industry leaders and colleagues.

This year's conference theme is “Materials Accelerating Innovation,”  and will delve into what’s driving demand for new materials, 5nm and Beyond, the Future of the Materials Market in China, Heterogeneous Integration, and many more topics.The conference attracts a highly influential audience from every segment of the semiconductor manufacturing industry and provides comprehensive in-depth content and unprecedented networking opportunities for professionals who share common strategic objectives for the extended electronics ecosystem.

Keynotes

Future of Semiconductor:
Moore’s Law Plus 
 

 

The Next Level:
Is it Time for Equipment and Materials Suppliers to Collaborate More?

 

Collaborate to Win in China

 

 

 

 

 
Mark Papermaster
Chief Technology Officer and Senior Vice President
Technology and Engineering 
 Dave Hemker, Ph.D.
Senior Vice President and Technical Fellow
 Sunny Hui
Senior Vice President,
Marketing
 
   
      

PARTICIPATING COMPANIES 

Network with industry leaders and colleagues from these companies:
 

 
  • 3M
  • Air Liquide Electronics U.S
  • Air Liquide Advanced Materials
  • Air Products & Chemicals
  • Advanced Materials Technology
  • AMD
  • ANGUS Chemical Company
  • Applied Materials
  • Applied Seals North America (ASNA)
  • Applied Ventures
  • ARM
  • ASE Group
  • Bain Capital
  • Banner Industries
  • Brewer Science
  • Cabot Microelectronics 
  • CASPA
  • Columbus Chemical Industries
  • CoorsTek
  • Credit Suisse
  • Daikin Industries
  • Digital Specialty Chemicals
  • Dow Chemical
  • Dow Corning
  • Dow Electronic Materials
  • DuPont USA
  • DuPont EKC Technology
  • Edwards Vacuum
  • EKK Eagle Semicon Components
  • EMD Performance Materials
  • Entegris
  • Electronic Fluorocarbons
  • Evercore
 
  • FESTO
  • Fine Consulting
  • Gelest
  • Global Water Intelligence
  • Greene, Tweed & Co.
  • Ham-Let
  • Heraeus Contact Materials
  • Honeywell
  • IBM
  • IHS Chemical Week (Press)
  • IMEC
  • Inpria
  • Intel Corporation
  • Intermolecular
  • Johnson Matthey
  • JSR Corporation
  • JSR Micro
  • JX Nippon Mining & Metals
  • King Industries Inc.
  • KLA-Tencor Corporation
  • KMG Electronic Chemicals
  • Konfoong Materials International
  • Lam Research 
  • LG Siltron
  • Linde Electronics and Specialty Gases
  • Linx Consulting
  • Institute for Defense Analyses
  • Materion
  • Matheson Gas
  • Mitsui Chemicals
  • MSR-FSR
  • Navin Fluorine International
  • Nazoom
  • Nissan Chemical America
  • Norquay Technology Incorporated
  • NuMat Technologies
  • Nye Lubricants
  • OMRON
 
  • Oak-Mitsui Technologies
  • QSIL Corporation
  • Pall Corporation
  • Pioneer Materials
  • Pixelligent Technologies
  • Praxair Inc.
  • Precision Polymer Engineering Ltd.
  • RASIRC
  • ReVera
  • SACHEM
  • Samsung Austin Semiconductor
  • San Jose State University
  • SCI Engineered Materials
  • Semiconductor Manufacturing International Corporation (SMIC)
  • SemiEngineering (Press)
  • SemiWiki (Press)
  • Silfex a Division of Lam Research
  • Silicon Catalyst
  • Siliconware USA, Inc.
  • SiVance
  • SKW Associates
  • Spectrum Semiconductor Materials
  • Stanford University
  • SUMCO Phoenix Corp.
  • Talon Innovations
  • Taiwan Semiconductor Manufacturing Company (TSMC)
  • The Dow Chemical Company
  • The Linde Group
  • TEL
  • TOK America
  • Toppan Photomasks, Inc. 
  • Tosoh SGM USA
  • Tosoh Specialty Metals
  • Trace Zero
  • TSI Semiconductors
  • Ultra Clean Technology
  • Umicore AG&Co KG
  • University of California Berkeley
  • University of California Los Angeles (UCLA)
  • University of Chicago
  • Versum Materials
  • Wacker
 

   

     
      
Sponsorship Opportunities:
Reach out to decision makers involved in all aspects of semiconductor manufacturing and the microelectronics supply chain by sponsoring SMC.

Contact: 
Shane Poblete, spoblete@semi.org, Tel: +1.202.847.5983
 Event Contact:
Lin Tso
ltso@semi.org
Tel: 1.408.943.7920  
Cell: 1.510-921-1165
 
      

 


SMC 2017 Downloadable Agenda

 

MONDAY, SEPTEMBER 18  
5:30–7:00pm 

Registration (Check-in) and Welcome Reception 

Reception sponsor:  

TUESDAY, SEPTEMBER 19

  
7:30–8:30am 

Registration & Check-in

 

Breakfast sponsor:  
8:30–8:35am  

Welcome
Dave Anderson, President, SEMI Americas

 
    
8:35–8:40am

Opening Remarks –  SMC 2017 Co-Chair
Mark Thirsk, Managing Partner, Linx Consulting

 

    
8:40–9:20am

Keynote: Future of Semiconductor: Moore’s Law Plus  

Mark Papermaster
Chief Technology Officer and Senior Vice President, Technology and Engineering
AMD

   
9:20–9:50am

Keynote: The Next Level: Is it Time for Equipment and Materials Suppliers to Collaborate More?

David Hemker, Ph.D.
Senior Vice President and Technical Fellow
Lam Research

Keynote sponsor: 

    
9:50–10:20am 

Networking Break 

Break sponsor: 

    

SESSION 1: ECONOMIC / MARKET TRENDS; THE CONSOLIDATION GAME (M&A),
                     CHINA, 200MM, & MORE
       

Session sponsor: 
10:20–10:25am 

Welcome and Introductions
Sanjay Malhotra, Senior Director, Applied Materials
 

 
10:25–10:55am

Drivers and Opportunities for the Wafer Fab Equipment Industry

Arthur Sherman
CMO & Vice President of Strategy & Market Research
Applied Materials

    
10:55–11:25am

The Rise of China IC Industry: Challenges and Opportunities

Lung Chu
President
SEMI China  

    
11:25–11:55am

Trends in the Materials Market in 2017

Mark Thirsk
Managing Partner
Linx Consulting

 
    
11:55–12:25pm

Semiconductor Renaissance – The Staples of a Data Driven Economy

John Pitzer
Managing Director
Credit Suisse

    
12:25–1:30pm 

Lunch

 

SESSION 2: PROCESS CHALLENGES AT 5NM AND BEYOND    

Session sponsor:  
1:30–1:35pm

Welcome and Introductions SMC 2017 Co-Chair
Mark Thirsk, Managing Partner, Linx Consulting

    
1:35–2:05pm

The Art of Advanced Materials Management

Joe Wu, Ph.D.
Deputy Director, Nano-Materials Center
TSMC

    
2:05–2:35pm  

Beyond CMOS — The Rise of Non-volatile Switches

Lucian Shifren
Senior Principal Research Engineer
ARM

    
2:35–3:05pm

Material Challenges of 1x and Beyond Technology Nodes

Pratik Joshi, Ph.D.,
Staff Engineer, Materials Technology
Samsung Austin Semiconductor

 
    
3:05–3:35pm 

Networking Break

Break sponsor: 

SESSION 3: UNIVERSITIES: INNOVATION DRIVERS

 
3:35–3:40pm 

Welcome and Introductions
Kim Arnold, Executive Director, Wafer Level Packaging, Brewer Science

    
3:40–4:10pm

Extending the Era of Moore’s Law through Materials Innovation

Tsu-Jae King Liu, Ph.D.
University of California, Berkeley

    
4:10–4:40pm

Paper and Circuits, only Atoms Thick

Jiwoong Park, Ph.D.
Department of Chemistry Institute for Molecular Engineering James Franck Institute
University of Chicago

 
    
4:40–5:10pm 

Selective Atomic Layer Processing

Stacey Bent, Ph.D.
Stanford University

 
    
5:10–7:00pm 

SMC 2017 Networking Reception

Reception sponsor:  

 

WEDNESDAY, SEPTEMBER 20

  

SESSION 4: THE FUTURE OF MATERIALS MARKET IN CHINA  

Session sponsor:  
    
7:30–8:30am 

Continental Breakfast and Networking

Breakfast sponsor:  
8:30–8:35am 

Welcome—SMC Co-Chair
Wenge Yang, Ph.D., Vice President of Marketing, Entegris

 
8:35–9:05am

Keynote: Collaborate to Win in China

Sunny Hui
Senior Vice President, Marketing
Semiconductor Manufacturing International Corporation
(SMIC)

 
    
9:05–9:35am

China Semiconductor Materials Market: Opportunities and Challenges

Shuji Dinglee
Global Head of Lithography Technologies
Dow Chemical Company

 
    
9:35–10:05am

The Progress of Ultra-high Purity Metal Material for PVD in China

Lijun Yao, Ph.D.
Chairman & President
Konfoong Materials International (KFMI)

10:05–10:35am 


Networking Break  

 

Break sponsor:  

SESSION 5: MATERIALS SUPPLY CHAIN CHALLENGES IN ADJACENT INDUSTRIES

 
10:35–10:40am 

Welcome and Introductions
Ravi Kanjolia, Ph.D., CTO, Deposition Materials
EMD Performance Materials

 
10:40–11:10am

Safety Critical: Emerging Quality and Supply Chain Requirements for Automotive Electronics

Anish Tolia, Ph.D.
VP Global Marketing, Electronics

The Linde Group  

    
11:10–11:40am

Novel Metal Oxide Nanocrystals and Nanocomposites Technology Enabling Next Generation Opto-Electronic Devices

Shree Deshpande
VP Business Development
Pixelligent Technologies

    
11:40–12:10pm

Top Down vs. Bottom Up: Approaches for Making Electronics Systems Flexible

Julie Bert, Ph.D.
Research Staff, Prototype Devices and Circuits
PARC, a Xerox Company

12:10–1:30pm 

Lunch

 
SESSION 6: HETEROGENEOUS INTEGRATION: DESIGN TO NEW MATERIALS & PACKAGINGSession sponsor: Brewer Science Logo
1:30–1:35pm 

Welcome and Introductions:  Session Sponsor:  Brewer Science
Kevin Peterson, Director of Sales & Marketing, JX Nippon Mining & Metals

1:35–2:05pm

Heterogeneous Integration for Performance and Scaling

Subramanian Iyer
Distinguished Chancellor’s Professor, Electrical Engineering Department
UCLA

    
2:05–2:35pm

3D Systems Partitioning-Processing Options and How They Link to Advanced Packaging

Andy Miller
Group Leader, 3D Enables System Integration
IMEC

    
2:35–3:05pm

FanOut Enabling the Third Wave of Interconnect Technology

Eelco Bergman, Sr. Director, Sales and Business Development
ASE Group 

 
3:05–3:35pm 


Networking Break   

Break sponsor:

SESSION 7: EXECUTIVE PANEL 

Session sponsor: Brewer Science Logo
3:35–3:45pm 

Welcome and Introductions
Kurt Carlsen, Director, Strategic Sourcing, Air Liquide

 
  

PANELISTS:

 
3:45–3:50pm

Device Maker Perspective

Joe Wu, Ph.D.
Deputy Director, Nano-Materials Center, TSMC

 
    
3:50–3:55pm

Device Maker Perspective

E. Steve Putna, Ph.D.
Materials & Equipment, Global Supply Management, Intel

 
    
3:55–4:00pm

Equipment Manufacturer Perspective

Ben Rathsack
Director, Product Technology and Marketing, Tokyo Electron

    
4:00–4:05pm

Materials Manufacturer Perspective

Gene Karwacki
Director, Global Strategic Marketing, Versum Materials

4:05–4:45pm 

Panel Discussion and Q&A

 
4:45–5:00pm 

Closing Remarks — Bart Pitcock, Vice President and General Manager, North America,
KMG Electronic Chemicals, CGMG Co-Chair 

Full Conference Pricing 

     Extended through September 7, 2017

 After September 7,  2017  

SEMI Members        

         US $535.00

    US $635.00

Non Members

         US $695.00

    US $795.00

*Students (with valid ID; code required)

         US $80.00

    US $100.00

Please contact Lin Tso (ltso@semi.org) for Student Code.

Full registration includes all meals (breakfast, lunch, receptions, and breaks), conference sessions, receptions and speaker presentation. 
Airfare and hotel accommodations are not included.

Venue and Hotel Accommodations:

DoubleTree by Hilton San Jose

2050 Gateway Place
San Jose, CA 95110

 

Make a Reservation

  • Call central reservations at 1-800-222-8733 
  • Call Laura Oey-Dehn at 408.437.2810 or email: laura.oey@hilton.com

 

 

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