North America Technical Service Engineering Manager, Henkel Corporation
Mike Tsai is the North America Technical Service Engineering Manager for Semiconductor Materials at Henkel Corporation. He has 18 years of experience in the semiconductor industry enabling next-generation process, equipment, and material development for flip chip and wafer level packaging from concept to high volume manufacturing.
Mike obtained both his Bachelor's and Master's degrees in Mechanical Engineering from the Georgia Institute of Technology in Atlanta, GA. He started his career at Intel Arizona in 2000 as a flip chip R&D process engineer and held various engineering and management roles in the Technology Manufacturing Group. He moved to California in 2012 and worked for ASE San Diego as a Technical Program Manager with focus on cellphone application device qualification and new product introduction. In 2015, Mike was part of Qualcomm's QCT Package Engineering team, managing package architecture and design for RF modules.
Mike joined Henkel's Technical Customer Service group in 2017. Currently, he leads an engineering team to support semiconductor material evaluations and product launches for die attach flip chip, and wafer-level packages.