Volume 8, Issue 2


In This Issue for October 2013

Korea: Critical Equipment Communications Standards Translated

Test Method for Liquid Filter Performance

Seismic Protection/EHS Standards

North America Award Winners

Surface Mount Sandwich Component Dimensions

SEMI E33-1012/EMC Overview

Ultrapure Water Standards

Call for Participation: Interlaboratory Study on PV28-2012 Test Methods

Upcoming Regional Meetings

Oct 28 - 31, 2013
NA Fall Standards Meetings

Nov 5, 2013
NA Standards Liquid Chemicals Fall Meetings

Nov 15, 2013
NA Standards Compound Semiconductor Materials Technical Committee Meeting

Full Calendar of Events

From the Director's Desk
James Amano
Senior Director

3D-IC Standardization Progress Continues

Since its formation in December 2010, the SEMI 3DS-IC Standards Committee has made significant progress in establishing key standards in areas such as TSV metrology, glass carrier wafers, and terminology. The committee's two newest standards are SEMI 3D6-0913 - Guide for Chemical Mechanical Planarization (CMP) and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration, and SEMI 3D7-0913 - Guide for Alignment Mark for 3DS-IC Process. The addition of these 2 new standards brings the total number of published SEMI 3D standards to seven. SEMI 3D6-0913 defines the specifications for middle end of line (MEOL) process related manufacturing flow. In order to speed up volume production of 3DS-IC products, a generic middle-end process flow is needed to communicate the frontend and backend processes. More...

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