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Volume 7, Issue 2 |
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Intersolar Europe Update
SEMICON Europa 2012 Technical Standards Meetings |
 From the Director's DeskJames Amano Senior Director SEMI International Standards & EHS First 3D-IC Standard Approved Formed in late 2010, the SEMI 3DS-IC Committee recently approved its first Standard for publication during SEMICON West 2012. Pending successful procedural review, the Document will be published as SEMI 3D1, Terminology for Through Silicon Via Geometrical Metrology. SEMI 3D1 will provide a starting point for standardization of geometrical metrology for selected dimensions of through silicon vias (TSVs). The Inspection & Metrology Task Force recognized the need for such a standard because although different technologies can measure various geometrical parameters of an individual TSV, or of an array of TSVs, such as pitch, top diameter, top area, depth, taper (or sidewall angle), bottom area, and bottom diameter, it is currently difficult to compare results from the various measurement technologies as parameters are often described by similar names, but actually represent different aspects of the TSV geometry. SEMI 3D1 is an important first step in promoting common understanding and precise communication between stakeholders in the 3D-IC manufacturing supply chain. In addition, the 3DS-IC Committee is actively working on multiple other activities, organized within five task forces. The Thin Wafer Handling Task Force aims to develop standards for reliable handling and shipping of thin wafers and dies (e.g., micro-pillar grid arrays, or MPGA) used in high-volume manufacturing. As part of this effort the TF will define thin wafer handling requirements including physical interfaces used in 3D-IC manufacturing, as well as shipping requirements, including packaging, reliability, and other relevant criteria for both thin wafers and MPGAs. The task force's first effort is SEMI Draft Document 5175, Guide for Multi-Wafer Transport and Storage Containers for Thin Wafers. More...  Join Our Mailing List Don't miss out on news of importance to the SEMI International Standards community. Click here to subscribe. Subscribe to SEMI Newsletters |
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