| SEMI® Global Update - March 2013 | |
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| IN THIS ISSUE | |
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Fab Equipment Spending Remains Flat in 2013; Up 24% in 2014
2013 State of the Union Address; Highlights Many SEMI Priorities
Industry Leaders Contemplate Region's Future at ISS Europe 2013
Printed Electronics Sector Takes Hard Look at the Flexible Future
Developing and Strengthening 3D-IC Manufacture in Europe
Silicon Reclaim Wafer Market Expected to Reach $471 Million by 2014
LED Sector Looks for Alternative Solutions to Spur Adoption
SEMI Calls for Constructive Action on Solar Dispute
Event Calendar
WEBINAR
March 26 Outlook on the Semiconductor Manufacturing Industry
ASIA
March 19-21 SEMICON China 2013
March 19-21 FPD China 2013
March 19-21 SOLARCON China 2013
May 7-9 SEMICON Singapore 2013
EUROPE
March 10-12 PV Fab Managers Forum
March 12-13 PV Standards Mtgs at PV Fab Managers Forum
March 19 SEMI Networking Breakfast: Printed Electronics
NORTH AMERICA
March 20 SEMI Northeast Forum
March 31-April 4 NA Standards Spring Mtgs
May 13-16 ASMC 2013
May 1 SEMI Pacific Northwest Breakfast Forum

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Fab Equipment Spending Remains Flat in 2013; Up 24% in 2014 By Christian Gregor Dieseldorff, SEMI Industry Research & Statistics Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around US$ 31.7 billion, increasing to $39.3 billion in 2014 -- a 24 percent increase. The SEMI World Fab Forecast also reveals that in 2013 increases for fab equipment spending will vary by technology node and that fab construction spending will increase an overall 6.7 percent with major spending in China.
President Obama Delivers 2013 State of the Union Address; Highlights Many SEMI Priorities By Jamie Girard, SEMI Americas Public Policy On February 12, President Obama delivered the annual State of the Union address which highlighted many of the critical issues that concern SEMI members.
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Semiconductor Industry Leaders Contemplate Region's Future at ISS Europe 2013 Semiconductor industry growth drivers and European market strategies were discussed at SEMI ISS Europe 2013 in February. Executives from NXP, Infineon, STMicroelectronics and industry analysts offered perspectives.
Printed Electronics Sector Takes Hard Look at the Flexible Future By Paula Doe, SEMI Printed/flexible electronics will see more significant commercial applications in the next few years-- a report from FlexTech Alliance's annual conference in Phoenix.
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Developing and Strengthening 3D-IC Manufacture in Europe By Julien Happich, EE Times Europe The European 3D TSV Summit took place in Grenoble in late February. Over 320 attendees from 20 countries convened to discuss the latest.
Silicon Reclaim Wafer Market Expected to Reach $471 Million by 2014 By Lara Chamness, SEMI Industry Research & Statistics The worldwide reclaim wafer market is forecast to reach $471 million by 2014. The reclaim market is growing but reclaim suppliers face a number of critical issues.
LED Sector Looks for Alternative Solutions to Spur Adoption of General Lighting By Paula Doe, SEMI With the HB-LED sector counting on affordable general lighting to drive its future growth, device makers look at the potential for alternative substrates, innovative packaging and statistical process control.
"Global Trade War and Peace": SEMI Calls for Constructive Action on Solar Trade Dispute SEMI released a PV white paper, "Global Trade War and Peace: Unified Approaches to a Global Solar Energy Solution," containing key recommendations.

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Deborah Geiger Content Manager, SEMI
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