SEMI® Global Update - March 2013
IN THIS ISSUE 
Fab Equipment Spending Remains Flat in 2013; Up 24% in 2014

2013 State of the Union Address; Highlights Many SEMI Priorities

Industry Leaders Contemplate Region's Future at ISS Europe 2013

Printed Electronics Sector Takes Hard Look at the Flexible Future

Developing and Strengthening 3D-IC Manufacture in Europe

Silicon Reclaim Wafer Market Expected to Reach $471 Million by 2014

LED Sector Looks for Alternative Solutions to Spur Adoption

SEMI Calls for Constructive Action on Solar Dispute


Event Calendar

WEBINAR

March 26
Outlook on the Semiconductor Manufacturing Industry


ASIA

March 19-21
SEMICON China 2013

March 19-21
FPD China 2013

March 19-21
SOLARCON China 2013

May 7-9
SEMICON Singapore 2013


EUROPE

March 10-12
PV Fab Managers Forum

March 12-13
PV Standards Mtgs at PV Fab Managers Forum

March 19
SEMI Networking Breakfast: Printed Electronics


NORTH AMERICA

March 20
SEMI Northeast Forum

March 31-April 4
NA Standards Spring Mtgs

May 13-16
ASMC 2013

May 1
SEMI Pacific Northwest Breakfast Forum


Adhesives & Sealants Industry



SEMICON West 2013 Call for Papers
Due: March 11



Fab Equipment Spending Remains Flat in 2013; Up 24% in 2014
By Christian Gregor Dieseldorff, SEMI Industry Research & Statistics
Fab equipment spending for Front End facilities is expected to be flat in 2013, remaining around US$ 31.7 billion, increasing to $39.3 billion in 2014 -- a 24 percent increase. The SEMI World Fab Forecast also reveals that in 2013 increases for fab equipment spending will vary by technology node and that fab construction spending will increase an overall 6.7 percent with major spending in China.


President Obama Delivers 2013 State of the Union Address; Highlights Many SEMI Priorities
By Jamie Girard, SEMI Americas Public Policy

On February 12, President Obama delivered the annual State of the Union address which highlighted many of the critical issues that concern SEMI members.


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Semiconductor Industry Leaders Contemplate Region's Future at ISS Europe 2013
Semiconductor industry growth drivers and European market strategies were discussed at SEMI ISS Europe 2013 in February. Executives from NXP, Infineon, STMicroelectronics and industry analysts offered perspectives.


Printed Electronics Sector Takes Hard Look at the Flexible Future
By Paula Doe, SEMI

Printed/flexible electronics will see more significant commercial applications in the next few years-- a report from FlexTech Alliance's annual conference in Phoenix.


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Developing and Strengthening 3D-IC Manufacture in Europe
By Julien Happich, EE Times Europe

The European 3D TSV Summit took place in Grenoble in late February. Over 320 attendees from 20 countries convened to discuss the latest.


Silicon Reclaim Wafer Market Expected to Reach $471 Million by 2014
By Lara Chamness, SEMI Industry Research & Statistics

The worldwide reclaim wafer market is forecast to reach $471 million by 2014. The reclaim market is growing but reclaim suppliers face a number of critical issues.


SEMICON China 2013 SOLARCON China 2013FPD China 2013

LED Sector Looks for Alternative Solutions to Spur Adoption of General Lighting
By Paula Doe, SEMI

With the HB-LED sector counting on affordable general lighting to drive its future growth, device makers look at the potential for alternative substrates, innovative packaging and statistical process control.


"Global Trade War and Peace": SEMI Calls for Constructive Action on Solar Trade Dispute
SEMI released a PV white paper, "Global Trade War and Peace: Unified Approaches to a Global Solar Energy Solution," containing key recommendations.


SEMICON Singapore 2013

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Content Manager, SEMI
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