| SEMI® Global Update - October 2012 | |
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| IN THIS ISSUE | |
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Japan Semiconductor Industry -- Fabs, Equipment, and Materials
TSMC Unveils Schedule for 450mm Mass Production; Lithography is the Key
China to Invest $40 Billion by 2015 for Solar Development
Semiconductor Materials Market to Surpass $50 Billion in 2013
Semiconductor Industry Moves toward Automated LED Production on 6-inch Wafers
Taiwan President Speaks to 500+ Industry Leaders at SEMICON Taiwan Gala
Washington Update: Congress Leaves Unfinished Business
Successful SEMI Members Day in Korea
ARM, Corning, Micron and TSMC Share Strategies for Embracing Change
Event Calendar
ASIA
October 3-5 PV Taiwan 2012
October 12 Korea FPD Metrology Tech Committee Mtg
October 19 Korea Facilities Tech Committee Mtg
October 19 China LED Manufacturing Technology Conference
October 31-November 1 LED Tutorial 2012
December 5-7 SEMICON Japan
December 5-7 PV Japan
EUROPE
October 8-11 Standards Meetings
October 9-11 SEMICON Europa
October 9-11 Plastic Electronics Exhibition and Conference
NORTH AMERICA
October 11 Arizona Breakfast Forum
October 23-24 Strategic Materials Conference
October 28-November 1 Standards Fall 2012 Meetings
October 30 Austin Industry Outlook Forum
November 4-7 International Technology Partners Conference
November 8 SEMI Pacific Northwest Dinner Forum
Courses
Product Marketing
Supply Chain Mgmt
Acct Selling and Mgmt
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Japan Semiconductor Industry -- Fabs, Equipment, and Materials By Dan Tracy, SEMI Industry Research and Statistics Semiconductor manufacturers in Japan are either consolidating or closing fabs, and, in several cases, transitioning to a "fab-lite" strategy, all in a restructuring effort to meet the market challenges ahead. While device manufacturers are consolidating manufacturing operations and plan to outsource more wafer fabrication and package assembly to foundries and packaging subcontractors, a large installed fab capacity remains in Japan.
TSMC Unveils Schedule for 450 Mass Production; Lithography is the Key At the SEMICON Taiwan 2012 450mm Supply Chain Forum on September 7, leading foundries and equipment manufacturers (including TSMC, TEL, Lam Research, Applied Materials and KLA-Tencor) convened to discuss the latest trends in 450nm technology, opportunities and challenges. Related Presentation: "450mm Challenges and Opportunities" Dr. C.S. Yoo, TSMC (source: 450 Central website)
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China to Invest $40 Billion by 2015 for Solar Development By Melody Song, SEMI Industry Research and Statistics On September 12, 2012, China's National Energy Administration (NEA) announced the finalized 12th Five-Year Plan for solar development. The plan sets a target of 21GW installed solar capacity by 2015, which includes 20GW PV installations and 1GW CSP installations.
Semiconductor Materials Market to Surpass $50 Billion in 2013 By Lara Chamness, SEMI Industry Research & Statistics Given current macroeconomic headwinds, this year is proving to be challenging to forecast. Most analysts have recently downgraded their semiconductor revenue forecasts to flat or low-single digits.
Semiconductor Industry Moves toward Automated LED Production on 6-inch Wafers By Paula Doe, SEMI Emerging Markets With the fast-growing demand for HB-LEDs, the industry has added roughly 100 new fabs in the last five years, for a total of 169 LED fabs worldwide.

More News:
Taiwan President Ma Ying-Jeou Speaks to 500+ Industry Leaders at SEMICON Taiwan Gala Dinner
Washington Update: Congress Leaves Unfinished Business before November Elections
Successful SEMI Members Day in Korea
ARM, Corning, Micron and TSMC Share Strategies for Embracing Change -- at SEMICON Taiwan Executive Summit
Call for Papers:
ASMC 2013 - Due: Oct 31

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