SEMI® Global Update ♦ October 2011
IN THIS ISSUE

End of the DRAM Era: Flash Spending Surpasses DRAM

Industry Directions Highlighted at Taiwan CEO Forum

Members Drive Innovation through Reuse of Equipment

Executive Viewpoints from SEMICON Taiwan

SEMICON Recognized as Leading Tradeshow Brand

What's Happening in Standards? Selected Updates on 450mm, 3D-IC, HB-LED, and FPD

SEMI Releases Worldwide PV Equipment Market Statistics Report

Major U.S. Patent Reform Finalized


SEMI CALENDAR

ASIA

November 9-11
SOLARCON India 2011

December 5-7
PVJapan 2011

December 7-9
SEMICON Japan 2011


EUROPE

October 10-13
Europe Fall 2011 Standards Meetings

October 11-13
SEMICON Europa

October 11-13
PE2011 - Conference and Exhibition


NORTH AMERICA

October 11
Arizona Breakfast Forum

October 24-27
North America Standards Fall 2011 Meetings

November 2
SEMI Austin Annual Industry Outlook Forum

November 6-9
International Trade Partners Conference

November 10
KGD Conference

November 14-15
Global Interposer Tech. (GIT) 2011 Workshop

December 12-14
3-D Architectures for Semiconductor Integration and Packaging


Silcotek


Classes

Fundamentals of Product Marketing

Principles of Selling to the Semiconductor Industry

Combating Aggressive Supply Chain Management

Key Semi Account Selling and Management

3D Packaging Revolution (new)

Fundamentals of Microchip Design and Fabrication (new)

Account Support Boot Camp (new)


The End of the DRAM Era: Flash Spending Surpasses DRAM
By Clark Tseng, SEMI Industry Research & Statistics, Taiwan
From 2004-2007, DRAM accounted for 30-35% of semiconductor capital equipment spending, according to the SEMI World Fab Database. However, in the last few years, the DRAM sector has been suffering from fast price erosion, fierce competition and mediocre demand.


Industry Directions Highlighted at Taiwan CEO Forum
Leaders from Mentor Graphics, Imec, TSMC and Applied Materials provided perspectives on the current state of the industry at the SEMICON Taiwan CEO Forum on September 7. That evening, 500 industry leaders gathered to honor Dr. Morris Chang, chairman and CEO of TSMC, for receiving the Akira Inoue Award for outstanding achievement in EHS.


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Technical Manufacturing Corporation

Members Drive Innovation through Reuse of Equipment
Transitioning to larger wafer sizes and solving the challenges of EUV are critical. But another quiet revolution is going on in another part of the industry. Members of the SEMI Secondary Equipment & Applications (SEA) special interest group are adding market value by servicing and renewing equipment and solving some complex equipment and process issues with diverse applications.


Executive Viewpoints from SEMICON Taiwan
Overview of Equipment and Materials Forecasts
Taiwan is the single largest semiconductor equipment and materials market in the world. The importance of the market was demonstrated at the SEMICON Taiwan 2011 press conference. Industry leaders from Applied Materials, ASE, ATMI, Epistar, KYEC, STMicroelectronics and TSMC participated with SEMI in an overview of the market.


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EuroAsia Semiconductor is a platform focusing on equipment and materials for the microelectronics production industry in Europe and Asia.


SEMICON Recognized as Leading Tradeshow Brand
SEMICON® trade shows were recognized as the leading global brand by the publishers of Trade Show Executive's magazine in the "Gold 100" Awards ceremony in Half Moon Bay, California.


What's Happening in Standards? Selected Updates on 450mm, 3D-IC, HB-LED, and FPD
The International Process Module Physical Interface Task Force (IPPI-TF) was chartered to address standardization of physical interface and other interoperability related specification for the 450mm (vacuum) process modules and transfer module of the cluster tool.



December 7-9, 2011 in Makuhari Messe, Chiba, Japan
Guide to Sessions and Events
To learn more about exhibiting, click here.


SEMI Releases Worldwide Photovoltaic Equipment Market Statistics Report
SEMI announced the release of the Worldwide PV Equipment Market Statistics Report. It is the only PV equipment book-to-bill report based on direct inputs from PV equipment suppliers. For the first time in the past six quarters, the book-to-bill ratio dipped below parity to 0.88.


Major U.S. Patent Reform Finalized
After six years and several iterations of proposed reforms, the U.S. has finalized the most significant revision of U.S. patent law in several decades. The America Invents Act (H.R. 1249) was signed into law by President Obama on September 16.



Known Good Die


Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to:

Deborah Geiger
Content Manager, SEMI
3081 Zanker Road, San Jose, California, 95134
Tel: 1.408.943.6900; Fax: 1.408.428.9600; Email: marketingservices@semi.org
Website: www.semi.org

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