SEMI® Global Update - November 2012
IN THIS ISSUE 
European Consortia, ASML, Supplier Network Plan for 450mm Transition

"3D-IC Supply Chain Readiness" Forum at SEMICON Taiwan 2012

SMIC: Development of Technology in IC Design and Manaufacturing

Solar Cell Technology Standard Receives International Recognition

New Memory Cell Material Systems and Collaboration Models at SMC 2012

Opportunities in OLEDs, Energy Storage, and Power Semiconductors

Micromanufacturing Solutions Improve Performance for Batteries and Supercapacitors

SEMI Releases Additional Intellectual Property Survey Information


Event Calendar

ASIA

December 5-7
SEMICON Japan

December 5-7
PV Japan

Jan 30-Feb 1, 2013
SEMICON Korea 2013

Jan 30-Feb 1, 2013
LED Korea 2013


EUROPE

January 22-23, 2013
European 3D TSV Summit

February 24-26, 2013
ISS Europe


NORTH AMERICA

November 4-7
International Technology Partners Conference

November 8
SEMI Pacific Northwest Dinner Forum

December 11
Webinar: Outlook on the Semiconductor Mfg Ind

January 13-16, 2013
Industry Strategy Symposium (ISS) US

Courses
--Microchip Design & Fab
--The 3D Pkg Revolution
--CMOS Proc Integration
--Acct Selling and Mgmt


Hilco Industrial


Global SMT & Packaging
European Consortia, ASML, Supplier Network Plan for 450mm Transition
European government representatives, consortia and suppliers discussed programs to support the anticipated conversion of leading-edge wafer manufacturing to 450mm wafers at SEMICON Europa in Dresden.
Related Presentation: "450 Update on SEMI Standards"
450 Central: Viewpoints, Industry News, Presentations, & More



"3D-IC Supply Chain Readiness" Forum at SEMICON Taiwan 2012
By Dr. Phil Garrou
Most industry leaders currently involved in 3D development believe that the realization of 3D-IC technology into high-volume manufacturing is not a question of "if" but "when," and this year's forum was focused on industrial readiness and infrastructure maturity.
Related Article: "3D TSV: Ready for Manufacturing?"


SMIC: Sustained Development of Cutting-Edge Technology in IC Design and Manufacturing
By Gang Yao, SEMI China
SEMI China's Gang Yao interviewed SMIC's Li Xuwu about the company's efforts in accelerate development of cutting-edge technology in IC design and manufacturing.


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Solar Cell Technology Standard Receives International Recognition
On October 3 at PV Taiwan 2012, SEMI and ITRI jointly announced a new standard that reduces damage to solar cells due to the vibration caused during transportation.


New Memory Cell Material Systems and Evolving Collaboration Models Highlight SMC 2012
John Smythe of Micron kicked off the Strategic Materials Conference on October 23, with an overview of the materials challenges to continued scaling in memory, including a status update on novel and emerging materials sets that may have potential at sub-20nm.


Supply Chain Opportunities in OLEDs, Energy Storage, and Power Semiconductors
By Paula Doe, SEMI Emerging Markets
Materials experts from across the supply chain gathered at SMC 2012, discussing key materials needs for micromanufacturing outside the CMOS mainstream-- from OLEDs and GaN-on-silicon power semiconductors to alternatives like graphene, CNTs and self-assembling polymers.


SEMICON Japan 2012

Micromanufacturing Solutions Improve Performance for Batteries and Supercapacitors
By Paula Doe, SEMI Emerging Markets
Solid state batteries are finally seeing real revenues in some specialty niches, but scaling the technology to more demanding mainstream applications still requires significant investment.


SEMI Releases Additional Intellectual Property Survey Information
As a follow up to the March SEMI IP survey, SEMI polled it members to gather additional anecdotal information regarding the challenges faced in protecting their IP in a real world setting.


SEMICON Korea 2013LED Korea 2013

Call for Papers:
ASMC 2013 - Due Date Extended to November 12

semi.directory.com 450mm Central


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Deborah Geiger
Content Manager, SEMI
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Tel: 1.408.943.6900; Fax: 1.408.428.9600; Email: marketingservices@semi.org
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