SEMI® Global Update - February 2013
IN THIS ISSUE 
China Semiconductor Packaging Market Outlook 2012/2013

LED Technology and Market Challenges Addressed in Taiwan

3D TSVs Come of Age

Member Insight: Developments in Advanced Packaging Lithography

Taiwan: Aggressive Investments in Equipment for 2013-2014

JC Kim Receives the SEMI Sales and Marketing Excellence Award

Intel Receives the SEMI Award for a Process and Technology Integration Breakthrough

SEMI and U.S. PVMC Sign MOU -- PV Standards and Roadmap Focus

New Edition: International Technology Roadmap for PV

High-Skilled Immigration Reform: Renewed Debate


Event Calendar

ASIA

March 19-21
SEMICON China 2013

March 19-21
FPD China 2013

March 19-21
SOLARCON China 2013


EUROPE

February 24-26
ISS Europe

March 10-12
7th PV Fab Managers Forum 2013

March 12-13
Europe PV Standards Meetings at PV Fab Managers Forum

March 19
SEMI Europe Networking Breakfast - Printed Electronics


NORTH AMERICA

March 20
SEMI Northeast Forum

March 31-April 4
North America Standards Spring Meetings

May 13-16
ASMC 2013

Courses
- Fund of Prod Mktg
- Acct Support Boot Camp
- Fundamentals of Yield
- Thin-Film PV Reliability
- Financial Boot Camp:
  -Finance/Acctg Concepts
  -Business Modeling
  -Pricing and Costing
  -Profitability Modeling



CS International


China Semiconductor Packaging Market Outlook 2012/2013
By Yuri Cai, Industry Research & Statistics, SEMI China

Packaging and assembly are key segments of the growing semiconductor supply chain in China with over 200 companies competing in the space.


LED Technology and Market Challenges Addressed in Taiwan
With increasing awareness of global climate change and the importance of energy conservation, more and more countries have launched LED lighting projects and subsidy policies.


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3D TSVs Come of Age
By Francoise von Trapp, 3D InCites

The European 3D TSV Summit was packed with quality presentations demonstrating recent progress by the semiconductor manufacturing community.
Related Article: 3D TSV: Focus on Cost of Ownership




Ardy JohnsonDevelopments in Advanced Packaging Lithography: Q&A with Rudolph Technologies
Rudolph's marketing vice president, Ardy Johnson, answers SEMI questions about recent developments in advanced packaging lithography and explains the company's strategy in entering the market.


SEMICON China 2013 SOLARCON China 2013FPD China 2013

Taiwan: Aggressive Investments in Equipment for 2013-2014
Worldwide sales of new semiconductor manufacturing equipment reached $38.2 billion in 2012 according to the year-end SEMI Semiconductor Equipment Consensus Forecast.


JC Kim Receives the SEMI Sales and Marketing Excellence Award
During SEMICON Korea 2013 in Seoul on January 30, SEMI presented Joung Cho (JC) Kim, chairman, Edwards Korea Limited, with the 14th annual SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.


Intel Receives the SEMI Award for a Process and Technology Integration Breakthrough
Team members at Intel Corporation -- Mark Bohr, Robert Chau, Suman Datta, Mark Doczy, Brian Doyle, Tahir Ghani, Jack Kavalieros, Matthew Metz, and Kaizad Mistry -- are recipients of the 2012 SEMI Award for North America.


ASMC 2013

SEMI and U.S. PVMC Sign MOU
SEMI and the U.S. PV Manufacturing Consortium (PVMC) signed an MOU to enhance cooperation in the areas of standards and roadmap activities.


New Edition of the Int'l Technology Roadmap for PV at PV Fab Managers Forum
New edition of the ITRPV: available at the PV Fab Managers Forum on March 10-12.


High-Skilled Immigration Reform Debate
President Obama pushes for comprehensive immigration reform, as well as a Senate bipartisan framework for legislation.


ISS Europe 2013

semi.directory.com 450mm Central


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