| SEMI® Global Update - February 2013 | |
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| IN THIS ISSUE | |
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China Semiconductor Packaging Market Outlook 2012/2013
LED Technology and Market Challenges Addressed in Taiwan
3D TSVs Come of Age
Member Insight: Developments in Advanced Packaging Lithography
Taiwan: Aggressive Investments in Equipment for 2013-2014
JC Kim Receives the SEMI Sales and Marketing Excellence Award
Intel Receives the SEMI Award for a Process and Technology Integration Breakthrough
SEMI and U.S. PVMC Sign MOU -- PV Standards and Roadmap Focus
New Edition: International Technology Roadmap for PV
High-Skilled Immigration Reform: Renewed Debate
Event Calendar
ASIA
March 19-21 SEMICON China 2013
March 19-21 FPD China 2013
March 19-21 SOLARCON China 2013
EUROPE
February 24-26 ISS Europe
March 10-12 7th PV Fab Managers Forum 2013
March 12-13 Europe PV Standards Meetings at PV Fab Managers Forum
March 19 SEMI Europe Networking Breakfast - Printed Electronics
NORTH AMERICA
March 20 SEMI Northeast Forum
March 31-April 4 North America Standards Spring Meetings
May 13-16 ASMC 2013
Courses
- Fund of Prod Mktg
- Acct Support Boot Camp
- Fundamentals of Yield
- Thin-Film PV Reliability
- Financial Boot Camp:
-Finance/Acctg Concepts
-Business Modeling
-Pricing and Costing
-Profitability Modeling

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China Semiconductor Packaging Market Outlook 2012/2013 By Yuri Cai, Industry Research & Statistics, SEMI China Packaging and assembly are key segments of the growing semiconductor supply chain in China with over 200 companies competing in the space.
LED Technology and Market Challenges Addressed in Taiwan With increasing awareness of global climate change and the importance of energy conservation, more and more countries have launched LED lighting projects and subsidy policies.
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3D TSVs Come of Age By Francoise von Trapp, 3D InCites The European 3D TSV Summit was packed with quality presentations demonstrating recent progress by the semiconductor manufacturing community. Related Article: 3D TSV: Focus on Cost of Ownership

Developments in Advanced Packaging Lithography: Q&A with Rudolph Technologies Rudolph's marketing vice president, Ardy Johnson, answers SEMI questions about recent developments in advanced packaging lithography and explains the company's strategy in entering the market.
Taiwan: Aggressive Investments in Equipment for 2013-2014 Worldwide sales of new semiconductor manufacturing equipment reached $38.2 billion in 2012 according to the year-end SEMI Semiconductor Equipment Consensus Forecast.
JC Kim Receives the SEMI Sales and Marketing Excellence Award During SEMICON Korea 2013 in Seoul on January 30, SEMI presented Joung Cho (JC) Kim, chairman, Edwards Korea Limited, with the 14th annual SEMI Sales and Marketing Excellence Award, inspired by the late Bob Graham.
Intel Receives the SEMI Award for a Process and Technology Integration Breakthrough Team members at Intel Corporation -- Mark Bohr, Robert Chau, Suman Datta, Mark Doczy, Brian Doyle, Tahir Ghani, Jack Kavalieros, Matthew Metz, and Kaizad Mistry -- are recipients of the 2012 SEMI Award for North America.

SEMI and U.S. PVMC Sign MOU SEMI and the U.S. PV Manufacturing Consortium (PVMC) signed an MOU to enhance cooperation in the areas of standards and roadmap activities.
New Edition of the Int'l Technology Roadmap for PV at PV Fab Managers Forum New edition of the ITRPV: available at the PV Fab Managers Forum on March 10-12.
High-Skilled Immigration Reform Debate President Obama pushes for comprehensive immigration reform, as well as a Senate bipartisan framework for legislation.

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