SEMI® Global Update ♦ December 2011
IN THIS ISSUE

Semiconductor Equipment: Growth Expected for 2011; Decline in 2012

Advanced Packaging Unit Growth Drives Material Consumption

Consumer Markets Drive MEMS Scaling and Efforts to Cut Development Time

Fast Forward: Finding New Common Ground in Process Technology R&D

From Process to Profit: New Dimensions of Growth in the Semiconductor Industry

Taiwan-initiated Solar Panel Shipping Standard Garners International Approval

SEMI Urges Productive Dialog to Trade Policies


SEMI CALENDAR

ASIA

December 5-7
PVJapan 2011

December 7-9
SEMICON Japan 2011

February 7-9
SEMICON Korea 2012

February 7-9
LED Korea 2012

EUROPE

December 8
Photonics TechBRIEFING

February 26-28
ISS Europe 2012

NORTH AMERICA

December 12-14
3-D Architectures for Semiconductor Integration and Packaging

January 15-18
Industry Strategy Symposium 2012

Classes

3D Pkg Revolution (new)

Fundamentals of Microchip Design and Fab (new)

Semiconductor Equipment: Growth Expected for 2011; Decline in 2012
By Lara Chamness, SEMI Industry Research and Statistics
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will reach $41.8 billion in 2011, according to the year-end edition of the SEMI Capital Equipment Forecast. Following a 151% market increase in 2010, the equipment market will expand by 4.7% in 2011, declining in 2012 before resuming growth in 2013.


Market Growth for Packaging Materials: Advanced Packaging Unit Growth Drives Material Consumption
By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI
Following a record year in terms of semiconductor sales and unit shipments, 2011 turned into a lower growth year than initially expected with several challenges emerging for the packaging material suppliers.


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Consumer Markets Drive MEMS Scaling and Efforts to Cut Development Time
By Paula Doe, SEMI Emerging Markets
Robust global demand for smart phones and tablets will drive steady double-digit annual growth for MEMS devices for the next five years-- to reach a $12-17 billion market. These markets push the MEMS sector to focus more on scaling device size and finding ways to reduce development time and speed time-to-market of new applications.


Fast Forward: Finding New Common Ground in Process Technology R&D
By Dan Armbrust, SEMATECH
The structural evolution our industry over the last decade has heightened the need for collaboration. Our industry will need to adopt new strategies for cooperation that forge new common ground spanning more broadly across regions, extending more deeply into the supply chain, cutting across technology disciplines, and using shared industry R&D centers.



From Process to Profit: New Dimensions of Growth in the Semiconductor Industry
With the "triple threat" of FinFET, EUV and 450 facing the industry--during a period of uncertain economic growth--at no time during this long history has the issues, challenges and opportunities on the horizon been more daunting or complex.


Register for SEMI Webcast:
Power Semiconductor Technology
- P. Roussel, Yole: Wide Band Gap Technologies
- M. Germain, EpiGaN: GaN on Silicon Production Technology
- J. Oh, SEMATECH: VLSI Processing of III-V on Si for Logic & Beyond


Taiwan-initiated Solar Panel Shipping Standard Garners International Approval
SEMI announced the publication of SEMI PV23-1011. The new standard can reduce costs related to damage incurred during the transportation of PV modules. The new standard was primarily authored by the SEMI Taiwan PV Standards Committee, and vetted by the global SEMI PV Standards Committee.


SEMI Urges Productive Dialog on Trade Policies
By Bettina Weiss, SEMI PV Group
Global PV competition is increasing international trade disputes. SEMI released a statement in November in response to a trade complaint by SolarWorld and other domestic solar manufacturers, alleging illegal Chinese subsidies of solar panels in the U.S.


MEMS Executive Congress

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Content Manager, SEMI
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