|SEMI® Global Update - December 2013|
|IN THIS ISSUE|| |
FROM SEMI SOUTHEAST ASIA
Developing a Semiconductor Talent Pipeline in Southeast Asia
One of our biggest challenges is workforce development: How do we continue talent development for the semiconductor industry in a conductive environment to encourage growth?
This problem is not centric to Singapore alone but regionally and globally as well. Malaysia for instance, as recently as two weeks ago, announced that the Semiconductor Fabrication Association of Malaysia (SFAM) and Mimos Bhd, together with TalentCorp launched the Talent Development Programme in a move to overcome the severe shortage of skilled semiconductor engineers in the country. (more)
Kai Fai Ng
Fab Equipment Spending Down; 33% Growth in 2014 Forecast
By Christian Gregor Dieseldorff, Industry Research & Statistics
SEMI's World Fab Forecast report, published in November, predicts that fab equipment spending, including new, used and in-house equipment, is down in 2013 but is expected to grow almost 33% (to US$39.5B) in 2014 -- with Taiwan, Korea and the Americas highest in spending.
Semiconductor New Equipment Market: $32B for 2013; Growth in 2014 and 2015
By Lara Chamness, SEMI Industry Research & Statistics
SEMI projects that worldwide sales of new semiconductor manufacturing equipment will reach $32B in 2013, with growth forecasted for both 2014 and 2015.
Critical Assembly & Test Issues Addressed by Experts at Malaysia Forum
The SEMI Malaysia Forum addressed key Assembly & Test issues on November 20 with 200+ participants from over 50 companies. Featured experts from 15+ companies -- including MIDA, GfK, Equvo, ASM Technology, LTX-Credence, and more. Five presentations are summarized.
New Taiwan Exhibition Co-Location Bridges LED Manufacturing and Lighting Supply Chains
In 2014, LED Taiwan will co-locate with the Taiwan International Lighting Show (TILS). Taiwan has 41 LED fabs representing over 21% of the world's capacity -- more than any other region.
3D TSV without Limits
By Yann Guillou, SEMI Europe
SEMI offered a webinar entitled "3D TSV without Limits" which featured speakers from imec, CEA-LETI and Fraunhofer-IZM introducing topics that they will present in depth at the European 3D TSV Summit (Jan 20-22).
Path to Widespread Adaptive Test Revealed at CAST Workshop
By Tom Morrow, SEMI
Adaptive test is the most essential test process and methodology change needed to achieve lower test costs. But massive changes must occur in the fragmented test ecosystem where diverse data formats, transport protocols and database accessibility now amount to a vast "Tower of Babel."
Complimentary Webinar Recording: Trace Ionic Contamination Monitoring in Semi. & Electronics Fabrication
Learn about how contaminants in ultrapure water (UPW) can undermine process yield. Sponsored by Thermo Scientific.
Flexible, Printed Electronics -- At the Tipping Point
By Heidi Hoffman, FlexTech Alliance
SEMI members are the infrastructure upon which the modern microelectronics (IC) industry is built. Over the past 50 years the IC revolution led to unprecedented growth in information technology and information services.
EHS Regulations to Watch
Brief updates on EU Reach, Taiwan Reach, and EU Market Surveillance regulations.
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