|SEMI® Global Update - November 2013|
|IN THIS ISSUE|| |
2nd Call for Papers|
Due: November 14
FROM THE SEMI EUROPE PRESIDENT
SEMICON Europa 2013 Demonstrated the Potential of Europe in Semiconductor Technology and Manufacturing
Over 320 international exhibitors and 4’000 executives, engineers and business professionals convened at SEMICON Europe 2013 last month to visit the exhibition area and attend one or several of the 40 conference and technology sessions with over 300 presentations. SEMICON Europa validated itself again as the biggest event in Europe to address advanced semiconductor and related markets. Most exhibitors reported higher both traffic with concrete leads for equipment purchases and cooperation compared to the year before. This observation is also supported by the 10 percent increase in the official number of visitors. (more)
Complimentary Webinar: 3D TSV Without Limits
Monday, November 18 / 4pm CET, 3pm GMT, 7am PST
Join us for this informative webinar about 3D TSV technologies, presenting mid to long term perspectives.
Packaging Materials Trends -- Mobility is the Key Market Driver
By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI
The electronics industry trend towards smaller and thinner form factors has ushered an era of significant changes in packaging materials.
Memory Materials Revolution Highlighted at SMC
By Tom Morrow, SEMI
While the number of materials used in semiconductor logic will increase approximately 50% in the transition from 32nm to 22nm production, the materials revolution in memory will be even more pronounced.
SMC Keynote PPT--Gregg Bartlett, GlobalFoundries
SEMI Members only--15+ SMC Keynotes/PPTs
Benedetto Vigna of STMicroelectronics Honored with European SEMI Award 2013
Benedetto Vigna, EVP and GM at STMicroelectronics, was presented with the European SEMI Award 2013 on October 8 during SEMICON Europa 2013.
Plastic Electronics Conference to Rotate Between Dresden and Grenoble
Next year's Plastic Electronics Conference (PE2014) will be held in Grenoble. It will alternate with Dresden in future years to better address pan-European opportunities and challenges in Plastic Electronics.
450 Central Features 10+ New 450 Presentations from SEMICON Europa
450 Central features many articles and 10+ new 450 presentations (including AMAT, CNSE, ENIAC, Fraunhofer, G450C, Intel) from SEMICON Europa.
3D-IC Standardization Progress Continues
By James Amano, SEMI International Standards
SEMI has two new 3D-IC standards: Guide for CMP and Micro-Bump Processes for Frontside TSV Integration and Guide for Alignment Mark for 3DS-IC Process. Now there are seven published SEMI 3D standards.
Pervasive Computing: Are you Ready?
By Karen Savala, SEMI Americas
Pervasive computing is changing the landscape of the microelectronics industry, fragmenting the future of both Moore's Law and More-than-Moore technologies.
450mm Update on SEMI Standards--Oct 2013
Thirteen SEMI Standards task forces are working on key 450mm issues. SEMI has 19 450mm standards with 14+ in the pipeline.
SEMI Testifies at House Manufacturing Caucus
SEMI testified at the U.S. House of Representatives' Manufacturing Caucus and provided remarks at an October 29 briefing to examine manufacturing innovation in the United States.
Top Executives Gather at SEMICON Japan: Focus on Technologies, Business and the Future
The semiconductor industry and its supply chain are facing technical and business challenges today.
SEMI Market Data Makes a Difference
Market research reports help guide important investment and strategic decisions. Learn more...
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