SEMI® Global Update - November 2012
IN THIS ISSUE
The Battle for Progress in 3D Integration

European Consortia, ASML, Supplier Network Plan for 450mm Transition

"3D-IC Supply Chain Readiness" Forum at SEMICON Taiwan 2012

3D TSV: Ready for Manufacturing?

SMIC: Development of Technology in IC Design and Manaufacturing

New Memory Cell Material Systems and Collaboration Models at SMC 2012

Russia Announces Increased Microelectronics Support

Opportunities in OLEDs, Energy Storage, and Power Semiconductors

Micromanufacturing Solutions Improve Performance for Batteries and Supercapacitors

SEMI Releases Additional Intellectual Property Survey Information

Solar Cell Technology Standard Receives International Recognition


Event Calendar

EUROPE

December 6
SEMI Networking Breakfast

January 22-23, 2013
European 3D TSV Summit

February 24-26, 2013
ISS Europe

March 10-12, 2013
PV Fab Managers Forum


ASIA

December 5-7
SEMICON Japan

December 5-7
PV Japan

Jan 30-Feb 1, 2013
SEMICON Korea 2013

Jan 30-Feb 1, 2013
LED Korea 2013


NORTH AMERICA

November 8
SEMI Pacific Northwest Dinner Forum

December 11
Webinar: Outlook on the Semiconductor Manufacturing Industry

January 13-16, 2013
Industry Strategy Symposium (ISS) US

Courses

-- Fund of Microchip Design & Fabrication
-- The 3D Packaging Revolution
-- CMOS Process Integration for Planar and FinFET Logic
-- Acct Selling and Mgmt


Hilco Industrial


Global SMT & Packaging
FROM THE SEMI EUROPE PRESIDENT

The Battle for Progress in 3D Integration

Heinz Kundert, SEMI Europe PresidentProfound changes -- in technological complexity, market demand and business model diversity -- are taking place in the markets that SEMI serves. In the semiconductors industry, demand drivers in mobile applications and other areas are accelerating the introduction of non-planar transistor architectures, 3D chip stacking, 450mm wafer manufacturing, and other areas.

I'd like to focus in on the area of 3D integration. European companies continue to be at the forefront of 3D TSV technology. R&D organizations such as CEA-LETI, Fraunhofer-IZM and imec are among the pioneers. (more)

Heinz Kundert
www.semi.org/europe
www.pvgroup.org


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European Consortia, ASML, Supplier Network Plan for 450mm Transition
European government representatives, consortia and suppliers discussed programs to support the anticipated conversion of leading-edge wafer manufacturing to 450mm wafers at SEMICON Europa in Dresden.
Related Presentation: "450 Update on SEMI Standards"
450 Central: Viewpoints, Industry News, Presentations, & More



"3D-IC Supply Chain Readiness" Forum at SEMICON Taiwan 2012
By Dr. Phil Garrou
Most industry leaders currently involved in 3D development believe that the realization of 3D-IC technology into high-volume manufacturing is not a question of "if" but "when," and this year's forum was focused on industrial readiness and infrastructure maturity.


3D TSV: Ready for Manufacturing?
By Yann Guillou, SEMI Europe
In 2012, 3D TSV is one of the hottest technologies, along with 450mm and EUV, in the semiconductor industry due to the technology's huge potential.


ISS Europe 2013

SMIC: Sustained Development of Cutting-Edge Technology in IC Design and Manufacturing
By Gang Yao, SEMI China
SEMI China's Gang Yao interviewed SMIC's Li Xuwu about the company's efforts in accelerate development of cutting-edge technology in IC design and manufacturing.


New Memory Cell Material Systems and Evolving Collaboration Models Highlight SMC 2012
John Smythe of Micron kicked off the Strategic Materials Conference on October 23, with an overview of the materials challenges to continued scaling in memory, including a status update on novel and emerging materials sets that may have potential at sub-20nm.


Russia Announces Increased Microelectronics Support
The Russian government has approved a program for the development of the electronic industry in 2015-2025 requiring up to 517 billion rubles for the coming years (US$ 16.4 billion).


Supply Chain Opportunities in OLEDs, Energy Storage, and Power Semiconductors
By Paula Doe, SEMI Emerging Markets
Materials experts from across the supply chain gathered at SMC 2012, discussing key materials needs for micromanufacturing outside the CMOS mainstream-- from OLEDs and GaN-on-silicon power semiconductors to alternatives like graphene, CNTs and self-assembling polymers.


SEMICON Japan 2012

Micromanufacturing Solutions Improve Performance for Batteries and Supercapacitors
By Paula Doe, SEMI Emerging Markets
Solid state batteries are finally seeing real revenues in some specialty niches, but scaling the technology to more demanding mainstream applications still requires significant investment.


SEMI Releases Additional Intellectual Property Survey Information
As a follow up to the March SEMI IP survey, SEMI polled it members to gather additional anecdotal information regarding the challenges faced in protecting their IP in a real world setting.


Solar Cell Technology Standard Receives International Recognition
On October 3 at PV Taiwan 2012, SEMI and ITRI jointly announced a new standard that reduces damage to solar cells due to the vibration caused during transportation.


Call for Papers:
ASMC 2013 - Due Date Extended to November 12

semi.directory.com 450mm Central


Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to:

Beat Mueller
Content Manager, SEMI Europe
14, Rue de la Science, 1040 Brussels, Belgium
Tel: 32.2.609.5334; Fax: 32.2.416.6448; Email: semieurope@semi.org
Website: www.semi.org/europe

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