SEMI® Global Update - November 2012 IN THIS ISSUE The Battle for Progress in 3D Integration European Consortia, ASML, Supplier Network Plan for 450mm Transition "3D-IC Supply Chain Readiness" Forum at SEMICON Taiwan 2012 3D TSV: Ready for Manufacturing? SMIC: Development of Technology in IC Design and Manaufacturing New Memory Cell Material Systems and Collaboration Models at SMC 2012 Russia Announces Increased Microelectronics Support Opportunities in OLEDs, Energy Storage, and Power Semiconductors Micromanufacturing Solutions Improve Performance for Batteries and Supercapacitors SEMI Releases Additional Intellectual Property Survey Information Solar Cell Technology Standard Receives International Recognition Event Calendar EUROPE December 6 SEMI Networking Breakfast January 22-23, 2013 European 3D TSV Summit February 24-26, 2013 ISS Europe March 10-12, 2013 PV Fab Managers Forum ASIA December 5-7 SEMICON Japan December 5-7 PV Japan Jan 30-Feb 1, 2013 SEMICON Korea 2013 Jan 30-Feb 1, 2013 LED Korea 2013 NORTH AMERICA November 8 SEMI Pacific Northwest Dinner Forum December 11 Webinar: Outlook on the Semiconductor Manufacturing Industry January 13-16, 2013 Industry Strategy Symposium (ISS) US Courses -- Fund of Microchip Design & Fabrication -- The 3D Packaging Revolution -- CMOS Process Integration for Planar and FinFET Logic -- Acct Selling and Mgmt FROM THE SEMI EUROPE PRESIDENT The Battle for Progress in 3D Integration Profound changes -- in technological complexity, market demand and business model diversity -- are taking place in the markets that SEMI serves. In the semiconductors industry, demand drivers in mobile applications and other areas are accelerating the introduction of non-planar transistor architectures, 3D chip stacking, 450mm wafer manufacturing, and other areas. I'd like to focus in on the area of 3D integration. European companies continue to be at the forefront of 3D TSV technology. R&D organizations such as CEA-LETI, Fraunhofer-IZM and imec are among the pioneers. (more) Heinz Kundert www.semi.org/europe www.pvgroup.org Advertisement Silicon Semiconductor Global audience of 45,000 industry professionals Focusing on the manufacturing technologies Dedicated to the silicon semiconductor industry since 1978 Sister publication to Compound Semiconductor European Consortia, ASML, Supplier Network Plan for 450mm Transition European government representatives, consortia and suppliers discussed programs to support the anticipated conversion of leading-edge wafer manufacturing to 450mm wafers at SEMICON Europa in Dresden. Related Presentation: "450 Update on SEMI Standards" 450 Central: Viewpoints, Industry News, Presentations, & More "3D-IC Supply Chain Readiness" Forum at SEMICON Taiwan 2012 By Dr. Phil Garrou Most industry leaders currently involved in 3D development believe that the realization of 3D-IC technology into high-volume manufacturing is not a question of "if" but "when," and this year's forum was focused on industrial readiness and infrastructure maturity. 3D TSV: Ready for Manufacturing? By Yann Guillou, SEMI Europe In 2012, 3D TSV is one of the hottest technologies, along with 450mm and EUV, in the semiconductor industry due to the technology's huge potential. SMIC: Sustained Development of Cutting-Edge Technology in IC Design and Manufacturing By Gang Yao, SEMI China SEMI China's Gang Yao interviewed SMIC's Li Xuwu about the company's efforts in accelerate development of cutting-edge technology in IC design and manufacturing. New Memory Cell Material Systems and Evolving Collaboration Models Highlight SMC 2012 John Smythe of Micron kicked off the Strategic Materials Conference on October 23, with an overview of the materials challenges to continued scaling in memory, including a status update on novel and emerging materials sets that may have potential at sub-20nm. Russia Announces Increased Microelectronics Support The Russian government has approved a program for the development of the electronic industry in 2015-2025 requiring up to 517 billion rubles for the coming years (US$ 16.4 billion). Supply Chain Opportunities in OLEDs, Energy Storage, and Power Semiconductors By Paula Doe, SEMI Emerging Markets Materials experts from across the supply chain gathered at SMC 2012, discussing key materials needs for micromanufacturing outside the CMOS mainstream-- from OLEDs and GaN-on-silicon power semiconductors to alternatives like graphene, CNTs and self-assembling polymers. Micromanufacturing Solutions Improve Performance for Batteries and Supercapacitors By Paula Doe, SEMI Emerging Markets Solid state batteries are finally seeing real revenues in some specialty niches, but scaling the technology to more demanding mainstream applications still requires significant investment. SEMI Releases Additional Intellectual Property Survey Information As a follow up to the March SEMI IP survey, SEMI polled it members to gather additional anecdotal information regarding the challenges faced in protecting their IP in a real world setting. Solar Cell Technology Standard Receives International Recognition On October 3 at PV Taiwan 2012, SEMI and ITRI jointly announced a new standard that reduces damage to solar cells due to the vibration caused during transportation. Call for Papers: ASMC 2013 - Due Date Extended to November 12 Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to: Beat Mueller Content Manager, SEMI Europe 14, Rue de la Science, 1040 Brussels, Belgium Tel: 32.2.609.5334; Fax: 32.2.416.6448; Email: semieurope@semi.org Website: www.semi.org/europe Subscribe ¦ Unsubscribe Copyright © 2012 SEMI. All rights reserved.