SEMI® Global Update ♦ January 2012 IN THIS ISSUE SEMI Grenoble Tackles Member Expectations Fearless into a "Doomsday" Year Substrates for Semiconductor Packaging LED Fab Equipment Spending to Decline 18% in 2012 Packaging Community Takes on New Challenges through Industry Collaboration Printed Electronics Start to Show Up in Volume Hybrid Products Large Screen OLED TVs Debut at CES Official Establishment of SEMI China Photovoltaic Standards Committee SEMI CALENDAR EUROPE 14-15 February Metal Bulletin's Minor Metals Conference 26-28 February ISS Europe 2012 25-27 March PV Fab Managers Forum 27-28 March Europe PV Standards Mtgs 24-25 April The Future World Symposium 2012 ASIA 7-9 February SEMICON Korea 2012 7-9 February LED Korea 2012 8-9 February Korea Standards Meetings 20-22 March SEMICON China 2012 20-22 March FPD China 2012 20-22 March SOLARCON China 2012 NORTH AMERICA 15-18 January Industry Strategy Symposium 2012 7 March SEMI Northeast Forum: Wafers to Wall Street FROM THE SEMI EUROPE PRESIDENT SEMI Grenoble Tackles Member Expectations Over two years ago, SEMI Europe acquired JEMI France. Building on the strengths of the two associations, the goal was to further promote the industry in the southern part of Europe. Locating the new combined organization in France allowed for stronger ties with its major micro-electronics cluster in Grenoble. The new office called "SEMI Europe Grenoble Office" has come a long way since then. The new executive team is now fully operational. Led by Anne-Marie Dutron, the business model focuses on developing membership in Southern Europe and developing local events. (more) Heinz Kundert www.semi.org/europe www.pvgroup.org Fearless into a "Doomsday" Year: Examining Fab Spending and Capacity into 2012 and Beyond By Christian Dieseldorff, SEMI Industry Research & Statistics The Mayan "Long Count" calendar marks the end of a 5,126-year era. According to some interpretations of the ancient Mayan calendar, the world is going to end on December 21, 2012. The worldwide economy and, therefore, the semiconductor industry depend more upon consumer sentiment and confidence. Will a new "fear factor" affect 2012? Substrates for Semiconductor Packaging: 2012 Market Outlook for Laminate/Leadframe Materials By Jan Vardaman, TechSearch International, and Dan Tracy, SEMI Combined, laminate substrates and leadframes will represent an estimated US$ 13.3 billion market in 2011 and is forecasted to reach $14 billion in 2012. LED Fab Equipment Spending to Decline 18% in 2012 Following a massive 36% increase in equipment spending in 2011 (up to US$ 2.42 billion), worldwide LED manufacturing equipment spending is projected to decline 18% in 2012 to $1.97 billion according to the latest SEMI Opto/LED FabWatch and Forecast. Worldwide LED manufacturing capacity is expected to reach two million wafers in 2012 (4" equivalent per month), a 27% increase over 2011. Advertisement Packaging Community Takes on New Challenges through Industry Collaboration As the semiconductor industry responds to increasing demands for lower power, higher performance and reduced form factor, packaging technologies are increasingly important. This enhanced importance in the micro-electronics food chain is mirrored in a growth of the different segments of the packaging market. Printed Electronics Start to Show Up in Volume Hybrid Products By Paula Doe, SEMI Emerging Markets Despite its huge potential for making low-cost large-area lighting, solar panels, and displays, printed electronics has struggled to find commercial applications. So far, it's been hard to match the cost or performance of vacuum deposition on wafers or glass. Large Screen OLED TVs Debut at CES Capital Spending Expected To Ramp to Meet Next Generation Display Technology Large-size OLED displays from LG and Samsung are expected to debut at this year's Consumer Electronics Show in Las Vegas, ushering in what some predict will be major transformation of the LCD display industry. Merrill Lynch estimates OLED displays will grow from US$ 4 billion in 2011 to $20B in 2015 and as high as $35B in 2017. Official Establishment of SEMI China Photovoltaic Standards Committee During the SEMI International Standards Committee (ISC) meeting held at PVJapan 2011, formation of the SEMI China Photovoltaic Standards Committee was officially approved by the ISC. European Commission invites Member States and interested parties to submit input on the EU state aid rules for supporting R&D&I. Fill out the Commission's questionnaire: 24 February 2012 deadline. Digital Agenda: Commission consults on massive expansion of LED lighting in Europe: The EC has adopted a Green Paper and launched a public consultation on the future of LED-based lighting (deadline: February 29). Click here for more info. Support SEMI Europe's Advocacy Join the following partners already confirmed: Austriamicrosystems, Digmesa, e-concept, Evatec, EVG, FEI, FOGALE nanotech, FUJIFILM Electronic Materials, IDA Ireland, IMEC, Nanium, Oxford Instruments, Pactech, Protec Carrier Systems, ROHM Semiconductor, S.P.M., Semilab, Siltronic, STMicroelectronics, Tokyo Electron, Vistec, and many more… Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to: Carlos Lee Content Manager, SEMI Europe Avenue des Arts 40 Brussels B-1040, Belgium Tel: 32.2.289.6490; Fax: 32.2.511.4345; Email: semieurope@semi.org Website: www.semi.org/europe Subscribe ¦ Unsubscribe Copyright © Semiconductor Equipment and Materials International (SEMI), all rights reserved