SEMI® Global Update ♦ August 2012 IN THIS ISSUE Accelerating Next Generation Semiconductor Manufacturing Technologies Semiconductor Fab Materials Outlook Semiconductor Equipment Sales: Expect $42.4 Billion in 2012; $46.7 Billion in 2013 Dynamic Changes Impacting Advanced Electronic Materials Industry Member Insight: As Memory Moves Ahead Spotlight on 3D-IC, 450mm Wafer Transition, and MEMS -- SEMICON Taiwan 2012 Preview First 3D-IC Standard Approved PV Industry Quarterly Update-Q2'2012 Supply Chain Readiness in an Era of Accelerated Change Managing the Talent Crunch -- SEMI Singapore Workforce Development SEMI Announces Results of Board Elections and Leadership Appointments U.S. Commerce Department Implements 2011 Wassenaar Arrangement Update Taiwan LED Industry Aims to Innovate in High-Value Applications Walking the Walk: Intel's Journey to Environmental Excellence SEMI and SST Announce 2012 "Best of West" Award Winner SEMI High Tech U Reunion Event Calendar EUROPE September 20 SEMI Networking Day Italy October 8-11 Standards Meetings October 9-11 SEMICON Europa October 9-11 Plastic Electronics Exhibition and Conference ASIA August 15 Market Outlook Webinar September 3-5 SOLARCON India September 5-7 SEMICON Taiwan September 6-7 SiP Global Summit NORTH AMERICA August 30 Silicon Valley Forecast Luncheon September 19 Northeast Forum September 27 Austin Golf Classic October 11 Arizona Breakfast Forum October 23-24 Strategic Materials Conference October 28-November 1 Standards Fall 2012 Meetings October 30 Austin Breakfast Forum Courses Acct Support Boot Camp Principles of Selling to the Semiconductor Industry Fundamentals of Product Marketing Combating Aggressive Supply Chain Mgmt CALL FOR NOMINATIONS SEMI Europe Standards Awards 2012 CALL FOR PAPERS ASMC 2013 FROM THE SEMI EUROPE PRESIDENT Accelerating Next Generation Semiconductor Manufacturing Technologies While there is currently a new round of uncertainty in the market and the near-term industry outlook is less than clear, semiconductor manufacturers are investing in advanced process technologies for both wafer fabrication and device packaging. Several market leaders in both the front- and backend of the industry are spending at record levels. While overall equipment spending is expected to decline in 2012, growth is forecasted for 2013 with fab equipment spending expected to reach a record high -- if macroeconomic factors do not intervene. In 2013, equipment sales should increase and approach US$3.3 billion in Europe. (more) Heinz Kundert www.semi.org/europe www.pvgroup.org Advertisement Semiconductor Fab Materials Outlook By Dan Tracy, SEMI Industry Research and Statistics While segments of the global economy are slowing and uncertainty is once again on the rise, fundamental unit trends for semiconductor materials have improved in recent months and growth expectations for the fab materials market remain modest for 2012 and into 2013. Semiconductor Equipment Sales: Expect $42.4 Billion in 2012; $46.7 Billion in 2013 SEMI projects semiconductor equipment sales will reach $42.4 billion in 2012, the fourth highest spending year in history, with higher spending only in 2011 ($43.5 billion), 2007 ($42.8 billion) and 2000 ($47.7 billion). Advertisement 3rd CS International Conference "Bringing together leading Compound Semiconductor industry insiders" 4-5th March 2013, Frankfurt, Germany Visit www.cs-international.net for further information. Dynamic Changes Impacting Advanced Electronic Materials Industry The $100B+ electronics materials industry is undergoing rapid metamorphosis as technologies, markets, business models, and materials management practices are all being restructured to meet the needs of a profit-hungry, environmentally-conscious and innovation-dependent world. As Memory Moves Ahead By Er-Xuan Ping, Applied Materials Complex challenges exist in designing and fabricating the ICs that enable the mobile market. These technologies are encountering scaling limits beyond the 2x nm node as reliability, power consumption, and structural complexities that limit yield and increase cost become more significant. Spotlight on 3D-IC, 450mm Wafer Transition, and MEMS -- SEMICON Taiwan 2012 Preview Driven by consumer demand for tablet, smartphone, and mobile devices, Taiwanese chipmakers, LED manufacturers, and Outsourced Semiconductor Assembly and Test (OSAT) firms will spend firm nearly $40 billion in the next two years on equipment and materials. Advertisement First 3D-IC Standard Approved By James Amano, International Standards, SEMI Formed in late 2010, the SEMI 3DS-IC Committee recently approved its first Standard for publication "Terminology for TSV Geometrical Metrology." PV Industry Quarterly Update-Q2'2012 By Melody Song, SEMI Industry Research and Statistics While global PV demand continues to grow, due to oversupply and falling prices, manufacturers' profitability continues to be a challenge, significantly impacting equipment spending and investing confidence. More News: Supply Chain Readiness in an Era of Accelerated Change Managing the Talent Crunch -- SEMI Singapore Workforce Development SEMI Announces Results of Board Elections and Leadership Appointments U.S. Commerce Department Implements 2011 Wassenaar Arrangement Update Taiwan LED Industry Aims to Innovate in High-Value Applications Walking the Walk: Intel's Journey to Environmental Excellence SEMI and SST Announce 2012 "Best of West" Award Winner SEMI High Tech U Reunion Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to: Carlos Lee Content Manager, SEMI Europe 14, Rue de la Science 1040 Brussels, Belgium Tel: 32.2.609.5334; Fax: 32.2.416.6448; Email: semieurope@semi.org Website: www.semi.org/europe Subscribe ¦ Unsubscribe Copyright © 2012 SEMI. All rights reserved.