|SEMI® Global Update - October 2013|
|IN THIS ISSUE|
FROM THE PRESIDENT & CEO OF SEMI
A Transforming Industry: Applied Materials Merges with TEL
Last week's blockbuster announcement of the merger between Tokyo Electron, or TEL, and Applied Materials struck me like two good friends who've surprisingly revealed they were getting married: we are certainly happy for them, but know this will have significant impact on our shared circle of associates, colleagues and partners. Three of the principals in the deal -- Tetsuro Higashi, Tetsuo Tsuneishi, and Mike Splinter -- will serve as the new company's chairman and vice chairmen, respectively, are also SEMI Board members who have taken extremely active leadership roles in the association. Gary Dickerson, Applied Materials' president and CEO, and an industry veteran of 30 years, will be the CEO of the new company. (more)
Complimentary WEBINAR on Oct. 18:
Trace Ionic Contamination Monitoring in Semiconductor & Electronics Fabrication
Learn about how contaminants in ultrapure water (UPW) can undermine process yield. Sponsored by Thermo Scientific.
Flash, LED, and MEMS Investments in Japan
By Dan Tracy, SEMI Industry Research & Statistics
In Japan, the closure and consolidation of 27 facilities from 2009-2012 reduced the installed fab capacity. But investments continued in some industry segments, and from 2010-2012, front-end equipment spending totaled $11.3B in Japan (and total equipment, if include packaging and test equipment, $13.7B.).
European Path to 450mm, Test & Packaging, and MEMS Highlight SEMICON Europa 2013
European semiconductor equipment spending will double next year. The 450mm wafer transition and other critical issues will highlight SEMICON Europa.
Semiconductor Materials Market to Approach $50 Billion in 2014
By Lara Chamness, SEMI Industry Research & Statistics
Given the industry's anemic performance during the first part of the year, a number of analysts have recently downgraded their 2013 semiconductor revenue forecasts to low-single digits, while forecasting stronger growth in 2014.
New Material Requirements and Outlook for Memory, Logic, MEMS, and more at SMC 2013
The Strategic Materials Conference (Oct 16-17) will include focused sessions and tracks on the advanced material outlook for semiconductor memory, logic, MEMS, and beyond-CMOS devices, and plastic electronics.
Taiwan to Lead Both Semiconductor Equipment and Materials in 2013
By SEMI Taiwan
In recent years, Taiwan has become the world center for semiconductors with manufacturers investing heavily in both hardware and materials. It is expected that total spending for these segments in Taiwan will be on the order of $20 billion for 2013 and growing into 2014.
From SEMI International Standards
ElectroMagnetic Compatibility: E33 Standard
Electronic equipment generates undesirable electrical noise which injects undesirable signals -- causing errors in operation and damage.
New Task Force to Develop Ultrapure Water Standard
Semiconductor manufacturing is susceptible to particulate and organic contamination. Ultrapure water needs rigorous cleanliness testing using SEMI standards.
Vietnam Semiconductor Strategy Summit Brings Together Key Decision Makers
In September, more than 120 attendees from the U.S., Europe, Korea, Japan, and Singapore attended the first-ever semiconductor industry event held in Vietnam. Near-term opportunities for SEMI members exist, especially in services and secondary equipment.
SEMICON Europa: Dresden/Grenoble Rotation
Next year's SEMICON Europa will be held in Grenoble and alternate with Dresden in future years to better address pan-European semiconductor issues.
Total Cost of Ownership Guide for PV Manufacturing Closes Communication Barrier
SEMI and VDMA have announced the release of the Total Cost of Ownership in PV Manufacturing Guide.
Call for Papers
ASMC 2014 -- Abstract Due: October 31
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