|SEMI® Global Update - June 2013|
|IN THIS ISSUE|| |
FROM THE PRESIDENT OF SEMI AMERICAS
U.S. Semiconductor Market Poised for Long-Term Growth
Six years ago, the outlook for U.S. semiconductor manufacturing was dim and dimmer. At the time, Intel was building their Dalian fab, AMD was ramping up their Dresden facilities, TI was transitioning to a fab-lite model, and the U.S.-based fabless giants were growing their business through foundries based in Asia. It was common for people to see semiconductors like other manufactured goods, inevitably moving to Asia, just another example of merciless globalization.
Today, the outlook for U.S. semiconductor manufacturing couldn't be more promising. (more)
The New GF135 PTI MFC for Increased Wafer Yield
Brooks Instrument's pressure transient insensitive MFC
provides real-time, integrated rate-of-decay flow measurement. It verifies accuracy, checks valve leak-by and monitors sensor drift without stopping production. The result is improved uptime. Read more
Fab Equipment Spending Expected to Improve with 2% in 2013
By Chris Dieseldorff, SEMI Industry Research & Statistics
Fab equipment spending will grow two percent year-over-year (US$ 32.5 billion) for 2013 and 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.
President Obama Visits Applied Materials
President Obama visited Applied Materials facilities in Austin, Texas on May 9 as part of his focus on manufacturing jobs, high-tech skills and technology that will drive long-term economic growth.
450mm -- It's Bigger than You Think
by Jonathan Davis, SEMI
Much has been said of the 450mm transition. But the description of this inflection is something of a misnomer. Though everyone desires a smooth, coordinated and orderly conversion, it may be a little less placid than the term "transition" implies.
Sonix pulse2TM. You can see clearly now.
Reveal features other pulser/receivers can't resolve. With 84 dB gain and a 4x higher SNR, you get the clearest possible imaging of every wafer bond and packaged device layer. Sonix pulse2, from the ultrasonics leader.
SEMICON Taiwan 2013 Examines Embedded Substrate Technology
With the demands from powerful portable consumer products, realization of lower power consumption and improved functionality/bandwidth in a smaller package becomes an issue for the industry.
EU Goal: Reach 20% World-Share in Chip Manufacturing by 2020
By Heinz Kundert, SEMI Europe
European Commission VP Neelie Kroes is determined to radically improve Europe's semiconductor manufacturig landscape: 10 billion Euros is on the table and the industry has promised to invest another 100 billion Euros.
SEMI Standards: Enabling the 450mm Transition
By James Amano, SEMI International Standards
The first 450mm standards proposal was in 2007, and now fifteen 450mm-related SEMI Standards are available.
Related: 450 Central features viewpoints, presentations, Standards, and more
$50 registration through June 7-- save $100; register NOW.
New Standards on 3Ds-IC: Thin Wafer Handling and Inspection & Metrology
At the N. America Standards Spring 2013 meetings, the NA 3DS-IC Committee approved two new guides on inspection & metrology and another on thin wafer handling.
Test Vision 2020 to Address Emerging Test Strategies, Technologies, and Application Challenges
IEEE's Test Vision 2020 Workshop returns to SEMICON West this year with a stellar lineup of speakers.
High-Skilled Immigration Reform-- Best Opportunity since 2007
On May 21, the Senate Judiciary Committee passed S. 744, the "Border Security, Economic Opportunity, and Immigration Modernization Act," sending it to the Senate floor for consideration. First major action taken by the U.S. Congress since the failed immigration reform attempt in 2007.
Call for Nominations
European SEMI Award -- Due: June 14
SEMI Award for North America -- Due: August 30
Call for Papers
SEMICON Europa -- Deadline extended to June 27
Plastic Electronics Exhibition and Conference -- Deadline extended to June 27
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