SEMI® Global Update ♦ June 2012
IN THIS ISSUE



Don't Miss the Future

Breaking the Barrier Again: Record Fab Equipment Spending in 2012 and 2013

A Changing Packaging Materials Market

Back-End Perspectives on 450mm Wafers; Packaging Technologies

Semiconductors: Putting the Future to the Test through Collaboration

Japan: New FiT Gives a Boost to Solar Market

Emerging Solutions for Wearable Sensors and Integrated Power

Logistically Speaking: The Role of PV Standards

SEMI Hosts Annual Washington Forum; Meets with Policymakers

Packaging Sessions at SEMICON West Expand to Reflect Latest Innovations

Guide to LED/OLED Programs at SEMICON West 2012

Singapore: Students Get Up Close and Personal with Industry Executives

PV Manufacturing Equipment Segment: Rebound a Challenge


Event Calendar

NORTH AMERICA

June 6
SEMI Northeast Forum

June 13-14
U.S. DOE Solid State Lighting Mfg R&D Wrkshp

June 19
Webinar: PV Prod at Intersolar NA Preview

June 25
Webinar: European Microelectronics Fab Outlook 2012

July 9
PV Fab Managers Forum

July 9-12
Standards Meetings

July 10-12
SEMICON West 2012

July 10-12
PV Prod at Intersolar NA

Courses
--MicroChip Design & Fab
--3D Packaging Revolution
--CMOS Proc Integration


ASIA

June 25
Webinar: European Microelectronics Fab Outlook 2012

September 3-5
SOLARCON India

September 5-7
SEMICON Taiwan


EUROPE

June 13-15
PV Prod at Intersolar Europe

June 13-14
PV Standards Meetings

June 25
Webinar: European Microelectronics Fab Outlook 2012

FROM THE PRESIDENT OF SEMI AMERICAS

Don't Miss the Future

Karen SavalaThe critical path for the future runs right through San Francisco in July. Once again, SEMICON West sets the stage as the place where important decisions are made and agreements reached in our industry. This year, there have never been more difficult choices and more complex uncertainties.

To meet the current and next-generation challenges, leaders in sub-22nm process development, 3D-IC packaging, 450mm tools, and other areas of technical investment will meet, learn, collaborate and decide among suppliers, technologies and research options at SEMICON West. The ITRS meetings, SEMI standards activities, 100+ product announcements, and the many company-specific product roadmap discussions will shape the agenda for our industry for many years to come. (more)

Karen Savala
www.semi.org


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Breaking the Barrier Again: Record Fab Equipment Spending in 2012 and 2013
Strong Improvement also in Fab Construction
By Christian Gregor Dieseldorff, SEMI Industry Research & Statistics
Breaking the barrier into positive growth for 2012, the new edition of the World Fab Forecast shows improved growth in fab equipment spending this year and in 2013.


A Changing Packaging Materials Market
Market Implements New Materials, Processes
By Dan Tracy, SEMI Industry Research & Statistics
Materials are critical to enhance the performance and improve the reliability of semiconductor packaging. With new packaging form factors available for increasing device integration, coupled with green initiatives, material sets are rapidly changing in this sector.


Back-End Perspectives on 450mm Wafers and Emerging Panel Scale Packaging Technologies
By Yann Guillou, SEMI Europe
While many in the industry take a front-end view of 450mm, it will create new challenges for assembly and packaging.




Semiconductors: Putting the Future to the Test through Collaboration
By Dr. Erik H. Volkerink, VP and CTO, Advantest Americas, Inc.
For more than four decades, the industry has rapidly improved chip performance. New technologies enabled innovation in existing markets but also sparked new markets. ATE helps test new processes, improve chip yield, and reduce manufacturing costs--leveraging today's technologies to develop innovative solutions that literally put the future "to the test."


Japan: New FiT Gives a Boost to Solar Market
All nuclear plants in Japan have been shut down for routine maintenance but the restart of most of the plants is uncertain-- due to widespread objection in the wake of the Fukushima Daiichi nuclear plant accident.


SEMICON West Preview: Emerging Solutions for Wearable Sensors and Integrated Power
By Paula Doe, SEMI Emerging Markets
Forecasts for wireless sensors depend on finding better ways to put sensors on non-traditional materials and power them with non-traditional sources that cost less and last longer.


SEMICON West 2012

More Articles:

From PV Magazine: Logistically Speaking-- The Role of PV Standards

SEMI Hosts Annual Washington Forum: Brings American Board to Washington, D.C. to Meet with Policymakers

Packaging Sessions at SEMICON West Expand to Reflect Latest Innovations in Mobile, 3D-IC, Cost Reduction, MEMS, LEDs and More

Guide to LED/OLED Programs at SEMICON West 2012

Singapore: Students Get Up Close and Personal with Industry Executives

The State of the PV Manufacturing Equipment Segment: Rebound Remains a Challenge


ISNA PV Production Hall CS International Hilco Industrial


Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to:

Deborah Geiger
Content Manager, SEMI
3081 Zanker Road, San Jose, California, 95134
Tel: 1.408.943.6900; Fax: 1.408.428.9600; Email: marketingservices@semi.org
Website: www.semi.org

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