SEMI® Global Update ♦ June 2012 IN THIS ISSUE Don't Miss the Future Breaking the Barrier Again: Record Fab Equipment Spending in 2012 and 2013 A Changing Packaging Materials Market Back-End Perspectives on 450mm Wafers; Packaging Technologies Semiconductors: Putting the Future to the Test through Collaboration Japan: New FiT Gives a Boost to Solar Market Emerging Solutions for Wearable Sensors and Integrated Power Logistically Speaking: The Role of PV Standards SEMI Hosts Annual Washington Forum; Meets with Policymakers Packaging Sessions at SEMICON West Expand to Reflect Latest Innovations Guide to LED/OLED Programs at SEMICON West 2012 Singapore: Students Get Up Close and Personal with Industry Executives PV Manufacturing Equipment Segment: Rebound a Challenge Event Calendar NORTH AMERICA June 6 SEMI Northeast Forum June 13-14 U.S. DOE Solid State Lighting Mfg R&D Wrkshp June 19 Webinar: PV Prod at Intersolar NA Preview June 25 Webinar: European Microelectronics Fab Outlook 2012 July 9 PV Fab Managers Forum July 9-12 Standards Meetings July 10-12 SEMICON West 2012 July 10-12 PV Prod at Intersolar NA Courses --MicroChip Design & Fab --3D Packaging Revolution --CMOS Proc Integration ASIA June 25 Webinar: European Microelectronics Fab Outlook 2012 September 3-5 SOLARCON India September 5-7 SEMICON Taiwan EUROPE June 13-15 PV Prod at Intersolar Europe June 13-14 PV Standards Meetings June 25 Webinar: European Microelectronics Fab Outlook 2012 FROM THE PRESIDENT OF SEMI AMERICAS Don't Miss the Future The critical path for the future runs right through San Francisco in July. Once again, SEMICON West sets the stage as the place where important decisions are made and agreements reached in our industry. This year, there have never been more difficult choices and more complex uncertainties. To meet the current and next-generation challenges, leaders in sub-22nm process development, 3D-IC packaging, 450mm tools, and other areas of technical investment will meet, learn, collaborate and decide among suppliers, technologies and research options at SEMICON West. The ITRS meetings, SEMI standards activities, 100+ product announcements, and the many company-specific product roadmap discussions will shape the agenda for our industry for many years to come. (more) Karen Savala www.semi.org Advertisement 3rd CS International Conference "Bringing together leading Compound Semiconductor industry insiders" 4-5th March 2013, Frankfurt, Germany Visit www.cs-international.net for further information. Breaking the Barrier Again: Record Fab Equipment Spending in 2012 and 2013 Strong Improvement also in Fab Construction By Christian Gregor Dieseldorff, SEMI Industry Research & Statistics Breaking the barrier into positive growth for 2012, the new edition of the World Fab Forecast shows improved growth in fab equipment spending this year and in 2013. A Changing Packaging Materials Market Market Implements New Materials, Processes By Dan Tracy, SEMI Industry Research & Statistics Materials are critical to enhance the performance and improve the reliability of semiconductor packaging. With new packaging form factors available for increasing device integration, coupled with green initiatives, material sets are rapidly changing in this sector. Back-End Perspectives on 450mm Wafers and Emerging Panel Scale Packaging Technologies By Yann Guillou, SEMI Europe While many in the industry take a front-end view of 450mm, it will create new challenges for assembly and packaging. Semiconductors: Putting the Future to the Test through Collaboration By Dr. Erik H. Volkerink, VP and CTO, Advantest Americas, Inc. For more than four decades, the industry has rapidly improved chip performance. New technologies enabled innovation in existing markets but also sparked new markets. ATE helps test new processes, improve chip yield, and reduce manufacturing costs--leveraging today's technologies to develop innovative solutions that literally put the future "to the test." Japan: New FiT Gives a Boost to Solar Market All nuclear plants in Japan have been shut down for routine maintenance but the restart of most of the plants is uncertain-- due to widespread objection in the wake of the Fukushima Daiichi nuclear plant accident. SEMICON West Preview: Emerging Solutions for Wearable Sensors and Integrated Power By Paula Doe, SEMI Emerging Markets Forecasts for wireless sensors depend on finding better ways to put sensors on non-traditional materials and power them with non-traditional sources that cost less and last longer. More Articles: From PV Magazine: Logistically Speaking-- The Role of PV Standards SEMI Hosts Annual Washington Forum: Brings American Board to Washington, D.C. to Meet with Policymakers Packaging Sessions at SEMICON West Expand to Reflect Latest Innovations in Mobile, 3D-IC, Cost Reduction, MEMS, LEDs and More Guide to LED/OLED Programs at SEMICON West 2012 Singapore: Students Get Up Close and Personal with Industry Executives The State of the PV Manufacturing Equipment Segment: Rebound Remains a Challenge Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to: Deborah Geiger Content Manager, SEMI 3081 Zanker Road, San Jose, California, 95134 Tel: 1.408.943.6900; Fax: 1.408.428.9600; Email: marketingservices@semi.org Website: www.semi.org Subscribe ¦ Unsubscribe Copyright © Semiconductor Equipment and Materials International (SEMI), all rights reserved