|SEMI® Global Update - July 2013|
|IN THIS ISSUE|| |
FROM THE PRESIDENT OF SEMI AMERICAS
R&D Engineers: What's at West for Me?
Big changes are coming to the semiconductor industry -- 450mm, 3D-IC, EUV Lithography, FinFETS, and FDSOI -- to name a few. Trying to keep up with the latest on the key trends and technologies on all these issues can be a major time investment but the alternative is falling behind... not really an option. That's why R&D engineers now flock to SEMICON West to learn the latest -- directly from the leading experts and leaders in the industry. In just three days (this year July 9-11), SEMICON West provides the answers that R&D engineers need to grow and excel at their jobs.
Not surprisingly, the demographics of SEMICON West attendees are changing. The number of R&D engineers attending the event increases every year. Engineers are now the second leading title of all attendees at SEMICON West. Once an engineer attends, that engineer is very likely to return, again and again.
Mobile Communication to Drive Taiwan Semiconductor Investment
By Clark Tseng, Industry Research & Statistics, SEMI Taiwan
Taiwan sets a good example of riding the tide of mobile demand surge. TSMC has announced their plan of tripling 28nm production this year by increasing capital expenditure to over $9.5B to fulfill mobile chip demand.
Consortium Mania Sweeps 450mm Landscape
By Mark LaPedus, SemiMD
The industry hopes to avoid past mistakes. So unlike the 300mm transition, the industry is taking a new approach toward 450mm -- the consortium route with broad industry support from both chipmakers and tool vendors.
Getting Ready for 10/100/20 - Europe's Manufacturing Initiative is Underway
By Heinz Kundert, SEMI Europe
Europe's recently launched industrial strategy to reinforce micro- and nanoelectronics manufacturing is more than just a vision-- it's an opportunity.
Options for Adding Memory and Logic to Printed or Flexible Electronics
By Paula Doe, SEMI
Developers have made major progress in the technology to manufacture printed or flexible circuits, sensors, batteries and displays, but it's hard to build applications with market pull without logic or memory as well.
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Test Architecture for Next-Generation NAND Flash
By Ken Hanh Lai, Advantest America, Inc.
To deliver the needed performance economically, NAND manufacturers need a test solution with architecture capable of increasing yield and throughput. Paper examines NAND Flash test requirements at the package level and more.
Insiders' Guide to "More than Moore" Technologies at SEMICON West 2013
By Paula Doe, SEMI
What are the issues in semiconductor technology markets outside of mainstream ICs? Silicon photonics, solutions to the maturing MEMS market, disruptive technologies for LEDs, and more...
"Best of West" Finalists Announced
Solid State Technology and SEMI announced the finalists for the 2013 "Best of West" awards, recognizing important product and technology developments in the microelectronics supply chain.
SEMI Member Day for New North Central Region
On June 12, SEMI members gathered in Chicago for a first SEMI Member Day, with updates about the equipment and materials market, about public policy, and more.
Export Control: Two New Web-Based Tools
For companies whose products may fall under the "dual-use" category, two new web-based decision tools are available.
More News: SEMI Hosts IP Protection Workshop for Members
"International Technology Roadmap for PV" Update at Intersolar NA
By Bettina Weiss, SEMI
SEMI unveiled the new edition of the ITRPV at the PV Fab Managers Forum in Berlin. The ITRPV program arrives at Intersolar North America 2013 on July 10.
Call for Nominations
SEMI Award for North America -- Due: August 30
Call for Papers
SEMICON Korea 2014 -- Due: October 31
LED Korea 2014 -- Due: October 31
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