| SEMI® Global Update - February 2013 | |
 |
| IN THIS ISSUE | |
|
Upsurge in Region Activity
China Semiconductor Packaging Market Outlook 2012/2013
LED Technology and Market Challenges Addressed in Taiwan
3D TSVs Come of Age
Member Insight: Developments in Advanced Packaging Lithography
Taiwan: Aggressive Investments in Equipment for 2013-2014
Award Winners: - SEMI Award - SEMI Sales & Marketing Award
SEMI Announces New N.A. Board Member, Leadership Positions for 2013-2014
SEMI and U.S. PVMC Sign MOU -- PV Standards and Roadmap Focus
New Edition: International Technology Roadmap for PV
High-Skilled Immigration Reform: Renewed Debate
Two New Classes Offered at SEMI HQ
Event Calendar
NORTH AMERICA
March 20 SEMI Northeast Forum
March 31-April 4 North America Standards Spring Meetings
May 13-16 ASMC 2013
Courses
- Fund of Prod Mktg
- Acct Support Boot Camp
- Fundamentals of Yield
- Thin-Film PV Reliability
- Financial Boot Camp:
-Finance/Acctg Concepts
-Business Modeling
-Pricing and Costing
-Profitability Modeling
ASIA
March 19-21 SEMICON China 2013
March 19-21 FPD China 2013
March 19-21 SOLARCON China 2013
EUROPE
February 24-26 ISS Europe
March 10-12 7th PV Fab Managers Forum 2013
March 12-13 Europe PV Standards Meetings at PV Fab Managers Forum
March 19 SEMI Europe Networking Breakfast - Printed Electronics

|
|
FROM THE PRESIDENT OF SEMI AMERICAS
Upsurge in Region Activity in 2012
Just over a year ago, we decided to renew our focus on the regions in the U.S. -- by re-launching industry committees and programs in both the Northwest and Southwest (Phoenix) regions, joining active Silicon Valley, Austin and Northeast SEMI chapters. Our goal: to create a platform that enables members to connect with each other and with local resources to help solve industry problems on a local, national and international basis. (more)
We were also thankful that these efforts contributed to new highs in overall member satisfaction in the U.S., as indicated by the recent annual Customer/Member Satisfaction Survey. The survey indicates that the percentage of members in the Americas rating SEMI performance "Acceptable" and "Above Acceptable" increased from 94% in 2011 to 96% in 2012. Another outcome from the study is what SEMI activities are valued most by our members... (more)
Karen Savala www.semi.org
Advertisement
Semiconductor Today's latest digital issue is now available to view free of charge at: www.semiconductor-today.com/latestissue.htm. To subscribe click here.
China Semiconductor Packaging Market Outlook 2012/2013 By Yuri Cai, Industry Research & Statistics, SEMI China Packaging and assembly are key segments of the growing semiconductor supply chain in China with over 200 companies competing in the space.
LED Technology and Market Challenges Addressed in Taiwan With increasing awareness of global climate change and the importance of energy conservation, more and more countries have launched LED lighting projects and subsidy policies.
3D TSVs Come of Age By Francoise von Trapp, 3D InCites The European 3D TSV Summit was packed with quality presentations demonstrating recent progress by the semiconductor manufacturing community. Related Article: 3D TSV: Focus on Cost of Ownership

Developments in Advanced Packaging Lithography: Q&A with Rudolph Technologies Rudolph's marketing vice president, Ardy Johnson, answers SEMI questions about recent developments in advanced packaging lithography and explains the company's strategy in entering the market.

Taiwan: Aggressive Investments in Equipment for 2013-2014 Worldwide sales of new semiconductor manufacturing equipment reached $38.2 billion in 2012 according to the year-end SEMI Semiconductor Equipment Consensus Forecast.
Honored with 2012 SEMI Awards SEMI Award: Intel team for the High-k Solution SEMI Sales and Marketing Excellence Award: JC Kim
North America: New Board Member and Leadership Positions for 2013-2014 On January 22, SEMI announced that Rudy Kellner, VP at FEI, has joined the SEMI North American Advisory Board (NAAB).

SEMI and U.S. PVMC Sign MOU SEMI and the U.S. PV Manufacturing Consortium (PVMC) signed an MOU to enhance cooperation in the areas of standards and roadmap activities.
New Edition of the Int'l Technology Roadmap for PV at PV Fab Managers Forum New edition of the ITRPV: available at the PV Fab Managers Forum on March 10-12.
High-Skilled Immigration Reform Debate President Obama pushes for comprehensive immigration reform, as well as a Senate bipartisan framework for legislation.
Two New Classes Offered at SEMI HQ
- March 27: Fundamentals of Yield
- April 18: Thin-Film Photovoltaics Reliability
|
|
Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to:
Deborah Geiger Content Manager, SEMI
3081 Zanker Road, San Jose, California, 95134 Tel: 1.408.943.6900; Fax: 1.408.428.9600; Email: marketingservices@semi.org Website: www.semi.org
Subscribe ¦ Unsubscribe
Copyright © 2013 SEMI. All rights reserved.
|
|