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Welcome to the SEMI Quarterly Report to Members:
Documentation of SEMI accomplishments for Q3 of 2012 (July through September)

Denny McGuirk The industries that SEMI serves are undergoing profound changes in technological complexity, market demand and business model diversity. In semiconductors, demand drivers in mobile applications are accelerating the introduction of non-planer transistor architectures, 3D chip stacking, 450mm wafer manufacturing, and other areas. In PV, worldwide production capacity is being rationalized alongside improvements in cell efficiency and manufacturing productivity, while public policy and global trade issues present challenges to both manufacturers and suppliers. In LEDs and MEMs, manufacturing and product development technology are rapidly evolving to meet growing, worldwide demand.

During the third quarter (July, August, September), SEMI products, programs and services have addressed these issues in ways that directly benefit SEMI members. SEMICON West, SEMICON Taiwan and Intersolar North America featured technical programs, standards meetings, customer networking events, and market/business forums designed to help our members find new customers, respond to market trends, and lower costs. Our market data and industry statistics programs have had important updates that have kept our members up-to-date on key market trends through 2013, and we have directly engaged with policy makers around the world on behalf of member interests in the areas of global trade, intellectual property, and tax/investment policy. SEMI also remains on track to reach our financial, member retention and member recruitment goals for the year.

This Quarterly Report to Members provides a summary of the activities, milestones and accomplishments of your association for the quarter, organized around our three business units: Semiconductor, PV, and Emerging and Adjacent Markets. If you have any questions or comments about how SEMI can serve you better, please contact your Regional President or me.

Denny McGuirk
President and CEO

SEMI Highlights Semiconductors Photovoltaic Emerging Markets SEMI Events

Quarter 3 (Jul-Sep 2012) Global SEMI Accomplishments

SEMI Board of Directors Results
In July, SEMI announced the results of its annual Board of Directors elections. Jifan Gao, chairman and CEO of Trina Solar, Nobu Koshiba, president of JSR Corp., Sue Lin, vice chairman of Hermes-Epitek, and Natsunosuke Yago, president of Ebara Corp., were named as new directors to the board. The re-election of existing board members was also announced. Douglas A. Neugold, chairman, CEO and president of ATMI, Inc., will continue to serve as SEMI chairman and André-Jacques Auberton-Hervé, president, CEO and chairman of the Board of Soitec Group, will continue in the position of vice-chairman of the board. Yong Han Lee, chairman of Wonik, was elected to the position of second vice chair.

SEMI Foundation/High Tech U
  • The 2nd High Tech U in Korea was held on August 8-10 with 32 junior high school students attending. The students selected the mock interviews, Samsung fab tour and "human calculator" as their favorite activities. Sponsoring companies included: Applied Materials, Eugene Tech, PSK, SEMES, Samsung Electronics, KANC (Korea Advanced Nano Fab Center), Seoul National University, Advantest Korea, Amkor Technology Korea, ASML Korea, KC Tech, Lam Research Korea.
  • A SEMI HTU Reunion was held for Arizona alumni on Tuesday, July 17, 2012 at Scottsdale Community College.
  • On July 17-20, the SEMI Foundation delivered its 135th SEMI High Tech U program to students in the Capital Region BOCES of New York state. The program was sponsored by: Applied Materials, Capital Region BOCES, Center for Economic Growth, CNSE, GlobalFoundries, Hudson Valley Community College/TEC-SMART, NEA-TEC, National Grid, NY State Union of Teachers, Rensselaer Polytechnic Institute (RPI), Schenectady County Community College and Tokyo Electron.
  • On July 26-27, Corning Incorporated and NYSUT sponsored the 2nd SEMI High Tech U-Teacher Edition in this region. Hosted at Corning, 38 educators, representing 19 school districts, attended the two-day HTU Teacher Edition.
  • On July 31-August 1, Mohawk Valley EDGE hosted the 1st SEMI High Tech U-Teacher Edition in its region. HTU Teacher Edition was held at the OHM BOCES District Office. Other sponsors included: Oneida County Workforce Investment Board, Community Foundation of Herkimer & Oneida Counties, and NYSUT.

SEMI Highlights Semiconductors Photovoltaic Emerging Markets SEMI Events

Jonathan Davis The Semiconductor Report (for Quarter 3)
By Jonathan Davis, president, SEMI Semiconductor Business Unit

The industry transition to manufacturing semiconductors on 450mm silicon wafers is clearly gaining momentum. With pilot line programs accelerating in New York and Europe and leading chip manufacturers increasingly committed to 450mm, discussions now center on the complicated questions of "when" and "how." For a cost-effective wafer transition, communication throughout the supply chain is essential. SEMI events and activities this quarter demonstrate one of SEMI's objectives: getting the right people talking to each other. Implementation of 450mm wafer production hinges on the ability of key subsystem and component suppliers to support leading tool makers with critical enabling products and technologies critical for 450 pilot lines and high-volume production.

At the SEMICON West 450 Supply Chain Forum in July, a "standing room only" crowd heard Applied Materials, Lam Research, KLA-Tencor and Tokyo Electron Limited discuss the key implications and opportunities for equipment, subsystem and materials suppliers, with Intel and the Global 450 Consortium (G450C) also articulating roadmaps and program objectives. In a significant recent development that adds greater likelihood to a synchronized 450mm introduction and further attest to ways in which the transition will alter traditional industry supply chain dynamics, Intel Corp, TSMC, and Samsung announced that they will participate in ASML's "Customer Co-Investment" program in order to accelerate development of EUV and 450 systems. ASML in turn has announced intention to acquire critical light source company Cymer.

At the SEMICON Taiwan 450mm Supply Chain Forum in September, leading foundries and equipment manufacturers TSMC, TEL, Lam Research, Applied Materials and KLA-Tencor convened to discuss the latest trends in 450nm technology as well as the opportunities and challenges involved. The experts at the forum agreed that many technical obstacles remain on the path to achieve mass production for 450mm wafers by 2018. The supply chain needs to step up its game and collaborate on innovation to make this vision a reality. At the time of this writing, another well-attended 450 program just concluded at SEMICON Europa.

Key stakeholders continue to work on standards and specifications necessary to support 450 R&D. By end of the quarter, the SEMI International Standards effort boasts 15 published Standards and auxiliary documents with 14 more in the pipeline.

In addition, SEMI announced the introduction of 450 Central (, a web-based information service to help the semiconductor industry efficiently transition to 450mm-ready solutions and stay informed of important news and perspectives on 450mm wafer processing. The portal compiles new product announcements, industry news, technology information, SEMI Standards updates, presentations, and other relevant information on 450mm wafer processing.

450 is just one of the many industry concerns addressed by SEMI in the past quarter. Other third quarter Semiconductor Business Unit accomplishments are summarized below. I hope that you'll review them, and let me know if you have suggestions or questions (

Quarter 3 (Jul-Sep 2012) Semiconductor Accomplishments

SEMICON West 2012
SEMICON West 2012 was held July 10-12 in San Francisco, Calif. Total attendance stood at 29,263 (visitors plus exhibitors). In addition, over 690 exhibitors (including co-exhibitors) participated. Attendees from 21 countries attended the event; international attendees accounted for 14% of total visitors. The technical agenda addressed key microelectronics manufacturing issues and technologies, including 450mm, 3D-IC, test, new device architectures, EUV, high-brightness LEDs, MEMS, power devices, and flexible electronics.

SEMI Launches "450 Central" for Wafer Transition Information
In August, SEMI announced the introduction of 450 Central (, a web-based information service to help the semiconductor industry efficiently transition to 450mm-ready solutions and keep the industry informed of important news and perspectives on 450mm wafer processing. The information service will compile new product announcements, industry news, technology information, SEMI Standards updates, presentations, and other relevant information on 450mm wafer processing in one comprehensive website that is easily searchable.

2nd SiP Global Summit in Taiwan
On September 6-7 in Taipei at the 2nd SiP Global Summit, which is held in conjunction with SEMICON Taiwan, the 3D-IC Technology Forum brought together all the leading players in the 3D-IC supply chain -- including ASE, SPIL, Xilinx, LSI, Aptina, UMC, EVG, Cadence, Teradyne and MicroTec -- to discuss the maturity of the overall infrastructure and the challenges that remain in the way of mass production. Over 370 industry experts attended the event.

SEMICON Taiwan was held September 5-7 in Taipei with 28,357 verified visitors. With 1,250 booths and 561 exhibitors, the event attracted more than 3,300 conference attendees. The conference sessions featured 85 speakers covering topics of market trends, IC design, 450mm, advanced packaging, green manufacturing, secondary market, MEMS and high-brightness LEDs.

Taiwan President Ma Ying-Jeou: "Collaborate with Taiwanese Firms"
Taiwan president Ma Ying-Jeou presented to over 500 semiconductor industry leaders and diplomatic representatives from around the world at the SEMI Leadership Gala Dinner organized by SEMI Taiwan on September 5. Ma encouraged multinational corporations "to collaborate with local Taiwanese firms, bolstering R&D operations in Taiwan, stepping up technical and training cooperation."

450mm Supply Chain Forum in Taiwan
To assist the industry with smooth transition to 450mm wafer process, SEMI Taiwan co-organized a 450mm Supply Chain Forum with TSMC on September 7. Speakers from TSMC, G450C, TEL, Lam Research, Applied Materials and KLA-Tencor convened to discuss the latest trends in 450mm technology. They agreed that many technical obstacles remain on the path to achieve mass production for 450mm wafers by 2018.

SEMI Korea Members Day 2012
SEMI Korea Members Day was held on September 19. The event was designed to provide market information and networking opportunities for SEMI member firms. The event has been held in September since 2007 as an annual event. Over 160 people attended from 102 companies, the largest attendee number in its history. The presentation included Global Economy, Semiconductor and Display Markets, OEM parts sourcing strategy and IP management. About 100 attended the SEMI Korea Member Day Reception.

SEMI Networking Day Italy
On September 20 in Milano, Italy, leading European MEMS stakeholders gathered in Milan to discuss the growing MEMS opportunities and markets. The event featured presentations by STMicroelectronics, Yole Développement, SPTS, Microcontrol Electronic, and CEA-LETI, as well as "Speed Networking" sessions that allowed SEMI members and Italian companies to introduce themselves and promote their technologies or services in front of the audience and network with other attendees.

SEMI China Assembly & Testing Committee Established
The SEMI China Assembly & Testing Committee was established on September 21 in Shanghai with Denny McGuirk, president and CEO of SEMI, and Allen Lu, VP of SEMI and president of SEMI China, attending the inaugural meeting. The committee seeks to promote technical exchange on Assembly & Testing and manufacturing technologies and to encourage advanced semiconductor manufacturing technologies. Committee members include executives from A/T big players such as Jiang Su Chang Dian, NT-Fujitsu, ASE, AMD, Amkor, IBM, Intel, TEL, Mentor Graphics, MTK and more. The first committee working meeting will be held in November.

SEMI China Logistics Committee
In September, the SEMI China Logistics Committee had a special meeting to discuss and coordinate the logistic issues of the Samsung Xi'an fab. Government officials from Xi'an, logistic companies from Xi'an as well as bank representatives attended the meeting. The meeting attracted many materials suppliers (such as Air Products, AMAT, BASF, Taiyo Nippon Sanso) and equipment suppliers (such as AMAT, ASML, Axcelis, Cymer, Hitachi High-Technologies, Hitachi Kokusa, KLA-Tencor, Lam/Novellus, Nikon, and TEL). The logistic committee members also visited Wuxi Hynix Semiconductor, touring the fab and communicating with Hynix on fab operation and implementation as well as related logistic support.

Americas Regional Events
  • SEMI Northeast Forum: "Materials Matter-- Opportunities in IC Manufacturing" was held September 19 in Albany, NY. Speakers from G450C, Dow Chemical, SEMATECH and CNSE discussed challenges and opportunities for advanced materials. Approximately 45 attended, including representatives from the IC industry and their equipment and materials suppliers. CNSE hosted the event.
  • 15th Annual Silicon Valley Forecast Luncheon: Over 185 industry professionals attended the Silicon Valley Lunch Forum on August 30 in Santa Clara, CA. The event featured Bob Johnson, Research VP at Gartner; Bill McClean, president of IC Insights; Mike Corbett, managing partner, Linx Consulting; and moderator J. Tracy Weed, senior director at Synopsys.
  • SEMI Austin Golf Classic: Held September 27 in Austin, TX, the SEMI Austin Golf Classic offered 63 participants an opportunity to enjoy an afternoon of golf and networking.
  • SEMI Austin Technology Tuesday: Harry Engwer, executive director of Semiconductor Support Services, presented to 20 attendees on the topic "Extending the Life of 200mm Equipment and the Future for 300mm" on August 7. The event was hosted by Samsung Austin Semiconductor in Austin, TX.
EHS Updates
  • SEMI Global Care Luncheon at SEMICON West: At the SEMI Global Care Executive Luncheon, Intel vice president Tim Hendry discussed Intel's approach to managing EHS risks and corporate supply chain implications.
  • SEMICON West Meeting on 450mm EHS: SEMI hosted a meeting discuss EHS-related business impacts of 450mm wafer manufacturing. The outcome was a list of possible EHS impacts, which will used as the basis for information sharing.
  • SEMICON West Regulatory Seminar: SEMI hosted a technical seminar to discuss regulatory impacts to members involved in high-tech manufacturing. Topics included the U.S. Conflict Minerals Legislation, U.S. EPA Green House Gas Regulation, the State of California Nano-Materials Regulations, and the Globally Harmonized System (GHS) of chemical hazard classification.
  • Corporate Codes of Conduct for Sustainability: SEMI hosted a technical seminar at SEMICON West focusing on corporate codes of conduct for environmental sustainability and social responsibility. Members discussed their corporate challenges in implementing their codes and the role of collective codes including Global Care, the Electronics Industry Citizen Coalition (EICC), and ResponsibleCare.
  • SEMICON Taiwan EHS Seminar: SEMI hosted a technical seminar at SEMICON Taiwan focusing on EHS issues. Topics included energy-conservation in manufacturing, occupational safety, and natural resources management in manufacturing.
  • Green Manufacturing Forum at SEMICON Taiwan: The SEMI Japan Seismic Protection Task Force organized a Green Manufacturing Forum at SEMICON Taiwan.
  • Published S29-0712: Guide for F-GHG (Fluorinated Greenhouse Gas) Emission Characterization and Reduction
  • Published SEMI S2-0712: Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment. [Delayed Revisions 1-10 effective July 2012]. Latest S2 version is S2-0712a.
International Standards Update for Semiconductors

3DS-IC: Published first SEMI 3D-IC standard SEMI 3D1-0912: Terminology for Through Silicon via Geometrical Metrology. Also created SNARFs (Standards Proposals) for New Standards for:
  • Specification for Glass Wafers for Use in Bonded Wafer Stacks [#5482]
  • Terminology for Measured Geometrical Parameters of Through-Glass Vias (TGVs) in 3DS-IC Structures[#5447]
  • Guide for Incoming/Outgoing Quality Control and Testing Flow for 3DS-IC Products
  • (Revision): Guide for Alignment Mark for 3DS-IC Process
  • (Revision): Guide for CMP and Micro-bump Processes for Frontside TSV Integration
In Japan, a 3D-IC Study Group was formed in the Packaging Committee. In addition, an Annual Planning Session was held on Aug. 31 with more than 30 SEMI Standards members. this year, invited speakers presented on "Social Network Analysis of the World Semiconductor R&D System: Case of High-k/Metal Gate Technologies" and "Introduction of Science Knowledge Integration Laboratory."

Information & Control (I&C): New SNARF: New Standard: Specification for SECS-II Protocol for Equipment Energy Saving Mode [#5453].

Gases: New SNARF: Doc. 5446: New Standard: Test Method For Determination Of Moisture Dry-Down Characteristics Of Surface-Mounted And Conventional Gas Delivery Systems By Continuous Wave Cavity Ring-Down Spectroscopy (CW-CRDS).

Silicon Wafer: Published:
  • New version of SEMI M1-0812-- Specification for Polished Single Crystal Silicon Wafers, which includes a major revision by adding a Guide for the Specification of 300 and 450 mm Diameter Silicon Wafers for the 32, 22, and 16 nm Technology Generations
  • New version of SEMI M49-0912 -- Guide for Specifying Geometry Measurement Systems for Silicon Wafers for the 130nm to 22nm Technology Generations, which includes a major revision by adding a new table addressing Metrology Specific Equipment Characteristics for Edge Profile Measurement
Liquid Chemicals: Published:
  • Doc. 5299A: Specification and Guide for Hexamethyldisilazane (HMDS)
  • Doc. 5193, Guide for 25% Tetramethylammonium Hydroxide
  • Doc. 5354, Guide for Trans 1, 2 Dichloroethylene
  • Doc. 5355, Specification and Guide for 1,1,1-Trichloroethane, Furnace Grade
  • New SNARFs include: Doc. 5479, Revision to SEMI F31-0698, Guide for Bulk Chemical Distribution Systems; and Doc. 4544D, Revision to SEMI F40-0699E, Practice for Preparing Liquid Chemical Distribution Components for Chemical Testing
PIC: Published:
  • Doc. 5413: Revision of SEMI E19-0309, Standard Mechanical Interface (SMIF)
  • Doc. 5414: Revision of SEMI E19.4-0998E, 200mm Standard Mechanical Interface (SMIF)

  • New SNARFs:
  • Doc. 5464, Revision to SEMI E154-0612: Mechanical Interface Specification for 450mm Load Port
  • Doc. 5465, Revision to SEMI E111-1106, Mechanical Specification for a 150 mm Reticle SMIF Pod (RSP150) Used to Transport and Store a 6 Inch Reticle
  • Doc. 5466, Revision to SEMI E112-1106, Mechanical Specification for a 150 mm Multiple Reticle SMIF Pod (MRSP150) Used to Transport and Store Multiple 6 Inch Reticles
  • Doc. 5463, Revision to SEMI E112-1106, Mechanical Specification for a 150 mm Multiple Reticle SMIF Pod (MRSP150) Used to Transport and Store Multiple 6 Inch Reticles
I&C Published:
  • New SNAFF and TFOF: Predictive Carrier Logistics (PCL) Task Force and new SNARF Doc. 5486: New Standard: Specification for Predictive Carrier Logistics Information from Equipment to be used for Predictive Carrier Logistics Management were approved by the committee.
Metrics: Published:
  • Doc. 5169: Revision of SEMI E78-0309, Guide to Assess and Control Electrostatic Discharge (ESD) and Electrostatic Attraction (ESA) for Equipment
  • Doc. 5238, Revisions of SEMI E129-0709, Guide to Assess and Control Electrostatic Charge in a Semiconductor Manufacturing Facility
  • Pending the author's publication approval: Doc. 3847D, Revision to SEMI E33-94, Specification for Semiconductor Manufacturing Facility Electromagnetic Compatibility with title change to: Guide for Semiconductor Manufacturing Equipment Electromagnetic Compatibility (EMC)
  • New SNARF:
  • 5472, Revision to E43-1108, Recommended Practice for Electrostatic Measurements on Objects and Surfaces
SEMI Standards Honors Six Industry Leaders
SEMI honored six industry leaders for their outstanding accomplishments in developing standards for the microelectronics and related industries. The SEMI Standards awards were announced at a reception held during SEMICON West 2012.
  • 2012 Karel Urbanek Award: The most prestigious award in the SEMI Standards Program, was awarded to Dr. Tzeng-Yow "Victor" Lin of Industrial Technology Research Institute (ITRI), Taiwan.
  • Merit Award: The Merit Award was presented to David Busing of KLA-Tencor for his leadership and technical expertise as a member of the Metrics Committee.
  • Leadership Award: Chris Moore of Semilab was awarded the Leadership Award for his outstanding leadership in guiding the SEMI Standards Program.
  • Honor Award The Honor Award recognized Larry Hartsough of UA Associates for his long standing dedication to the advancement of SEMI Standards.
  • Corporate Device Member Award: Presented to Tom Quinn of Intel for outstanding contributions to the development of SEMI Standards, in particular the development of carrier standards for 450mm wafers.
  • Technical Editor Appreciation Award: Alan Crockett of KLA-Tencor was acknowledged for his exceptional writing and editing skills, especially the work on the 450mm standards under the PIC Committee.
SEMI Industry Research and Statistics
  • Webinar: On August 15, Dan Tracy and Clark Tseng of the SEMI Industry and Statistics Group presented an Industry Overview and Fab Investment Update for SEMI Southeast Asia Members.
  • Webinar At the September 18 webinar, the focus was on semiconductor equipment spending trends in relation to fabs and the semiconductor materials market. Lara Chamness and Christian Dieseldorff of the SEMI Industry Research and Statistics group presented.
  • Book-to-Bill: June 2012: US$ 1.42 billion in orders; book-to-bill of 0.93 (final); July 2012: $1.23 billion in orders; book-to-bill of 0.86 (final); August: $1.12 billion in orders; book-to-bill of 0.84 (revised); September 2012: $954.9 million in orders; book-to-bill of 0.81 (prelim).
  • Mid-Year Consensus Forecast: In July, SEMI projected semiconductor equipment sales to reach US$ 42.4 billion in 2012 and $46.7 billion in 2013, according to the mid-year edition of the SEMI Capital Equipment Forecast.
  • Worldwide Semiconductor Equipment Billing: Worldwide semiconductor manufacturing equipment billings reached $10.34 billion in the second quarter of 2012. The billings figure is 4% percent lower than Q1 2012 and 13% lower than the same quarter a year ago. The data is gathered jointly with the SEAJ from over 100 global equipment companies that provide data on a monthly basis.
  • Worldwide Silicon: SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2012-2014. The results show polished and epitaxial silicon shipments totaling 8,901 million square inches (msi) in 2012, 9,400 msi in 2013, and 9,965 msi in 2014. Total wafer shipments are expected to remain below the all-time high set in 2010 this year but reach record levels in 2013 and 2014.
*Book-to-Bill: a ratio of 3-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers; note that the June 2012 Book-to-Bill final numbers were reported in July, etc.

SEMI Highlights Semiconductors Photovoltaic Emerging Markets SEMI Events

Bettina Weiss The Photovoltaics Report (for Quarter 3)
By Bettina Weiss, VP, SEMI PV Business Unit

As we all know, woes continue to plague the global PV industry -- overcapacity, subsidy changes in key markets, shaken investor confidence, to name a few. We at SEMI have accepted the challenges, and in the third quarter, our activities in support of our PV members have kicked into high gear. The globalization of the International Technology Roadmap for PV (ITRPV) is well under way, with increasing traction now in the U.S. and China, alongside Europe. The Roadmap is among the most meaningful collaborative platforms for member engagement, and we encourage you to participate and contribute to its growing significance. SEMI member participation in the U.S. DOE-funded PVMC CIGS Roadmap effort is bearing fruit as the January 1, 2013 deadline for a first roadmap draft looms. And companies are increasingly calling for a global trade agreement for solar in response to increasingly heated trade actions in China, India, Europe and the U.S.

In addition, the PV industry is entering its third phase of maturation -- globalization -- which translates into further growing pains as companies try to scale and take advantage of emerging market opportunities while retaining sufficient margins to survive. These challenges are formidable.

Our two big events this quarter -- Intersolar North America in San Francisco and SOLARCON India in Bangalore -- were two platforms to once more proclaim "doom and gloom," but more importantly to see the introduction of novel technologies and business strategies, and yes, hear some success stories. Intersolar North America, for the first time featured free technical content in our PV Production and Technology Hall, with resounding success. From Standards and Technology Roadmap presentations to cutting-edge technology information, from keynotes to Happy Hour, attendees and visitors had a great opportunity to network, learn, share and renew hope that we will come out of this slump smarter and stronger. Surrounding events, such as the PVMC public forum, contributed to the breadth of knowledge and the strength of the solar community in San Francisco that week.

India never ceases to amaze me -- the creativity that local companies display in their product development approach, the upbeat hum in our exposition hall, despite extremely challenging market conditions, and the curiosity to learn about other regions left me deeply impressed. I know that manufacturing will take hold there; the momentum will prevail.

We at SEMI look forward to bringing 2012 to a positive close, and to ring in 2013 with a host of new initiatives and activities to support our members. It's always darkest before dawn: just look at the semiconductor industry and its ups and downs over the decades and where it is today. Let's keep our eye on the goal of a future fueled by renewable energy.

Quarter 3 (Jul-Sep 2012) Photovoltaic Accomplishments

SEMI Releases Worldwide Photovoltaic Equipment Market Statistics Report
SEMI released the worldwide PV manufacturing equipment billings and bookings report for the second quarter of 2012. Worldwide billings increased slightly in the second quarter, up 2% quarter-on-quarter. However, the reported billings of $706 million were only 35% of the billings reported in the same quarter a year ago. Excluding the one-time large order reported in the previous quarter, worldwide bookings extended its six-quarter declining trend, falling 20 percent for the quarter to $235 million, reaching its lowest level since Q1 2010. At 0.33, the book-to-bill ratio stayed below parity for the fifth consecutive quarter.

Intersolar North America 2012
In total, 757 exhibitors and 17,823 trade visitors participated in 2012. The conference featured 30 sessions with 220 speakers and more than 1,500 conference attendees. The SEMI PV Group once again held session on solar PV materials, public policy and EHS.

PV Production and Technology Programs at Intersolar North America
In 2012, Intersolar offered exhibitors a dedicated PV Production and Technology exhibition space (located in Moscone North). In addition, the presentations delivered on the exhibit floor at the PV Production and Technology Hall Stage focused on critical issues and current challenges for both today's PV manufacturing plants and tomorrow's technology advancements. Topics included PV Manufacturing in the U.S., International Standards, PV EHS and Sustainability in Manufacturing, Scaling Thin-Film PV Technology, Global PV R&D, New Materials, Advanced PV Ultra-High-Efficiency Technologies, and PV Technology Roadmap.

3rd Annual SEMI North America Fab Managers Forum
The SEMI North American PV Fab Managers Forum on July 9 at Intersolar North America explored opportunities and challenges in thin-film manufacturing. Over 100 attendees heard perspectives from CIGS and CdTe manufacturers, as well as equipment and materials suppliers on cost drivers, supply chain bottlenecks and other critical factors that impact manufacturing efficiency and module cost. Speakers from key companies presented including: AEI Consulting, Alta Devices, Applied Materials, Distributed Sun, Flextronics, Impress Labs, KLA-Tencor, KPMG, Lazard Capital, NREL, Schiller, Solarbuzz, and SolarWorld Industries.

SOLARCON India 2012
SOLARCON India 2012, the fourth edition of India's largest solar-focused technology and business event, was held on September 3-5 in Bangalore for the first time. The event, organized by SEMI India, and certified by the U.S. Commercial Service, included an exhibition, a conference and a parallel technical workforce development session. SOLARCON India 2012 provided a high-profile platform for industry, government, NGOs and other eco-system partners to come together to discuss plans to help the growth of the local solar industry. The event had over 100 exhibitors and 6,000 unique visitors, and was inaugurated by Dr. Farooq Abdullah, Union Minister of New and Renewable Energy, Government of India.

Taiwan PV Delegation Tour to India
The SEMI Taiwan PV delegation tour, co-organized by SEMI and IEK, attended SOLARCON India in September for exhibiting, business matching and local company visits.

SEMI and SEIA Formalize Partnership to Grow Solar Industry
SEMI, the global industry association serving the nano- and microelectronics manufacturing supply chains, and the Solar Energy Industries Association (SEIA), the national trade association for the U.S. solar industry, today announced a partnership to help grow solar energy markets across the country. The expansion of solar furthers the missions of both organizations and directly assists their common members, manufacturers of solar energy products. Under the new partnership, SEIA and SEMI will collaborate on communications, events, policy and market research activities that promote solar energy.

PV Taiwan One-on-One Business Matching
In order to generate business for Taiwanese PV cell and module makers, SEMI and TAITRA invited about 25 overseas buyers to PV Taiwan to attend one-on-one arranged business matching meetings. In addition, SEMI Taiwan also invited trade offices from USA, Poland, Mexico as well as Taiwan local government to share PV policies in each end market.

PV Webinars: "PV in Japan" and "Reliability Across the Value Chain"
On September 5, SEMI hosted a webinar "PV in Japan: From Technology Leaders to Market Drivers; PV Transition Phase." Presenters included Finlay Colville, VP at NPD Solarbuzz and Melody Song, senior analyst at SEMI Industry Research and Statistics. On July 10, at the Reliability across the Value Chain: Materials Matter," the theme was on improving financial returns of PV systems. Presenters included speakers from AEI Consulting, Atlas Material Testing, Dupont, FabTech, Hemlock Semiconductor, Sandia National Labs, SolarTech, and MEMC.

SEMI China PV Advisory Committee Meeting / PV Project Development Forum
The SEMI China PV Advisory Committee Q3 Meeting was held in Xin Jiang on August 2. A Desert Application Oriented PV Project Development Forum was held nearby at the same time. The government plans to setup a 2.0GW PV power plant in next four years in Xin Jiang. A series of topics as well as case studies were addressed at the forum, such as bankability of PV project, CPV technology and cSi PV technology.

SEMI China PV Standards Committee Q3
The SEMI China PV Standards Committee Q3 meeting was held on August 10-11 in Chengdu. Over 70 delegates attended the meeting, including attendees from China Electronics Standardization Institute, Suntech, GCL-power, SEMI headquarters and more. Four PV standard proposals were approved in the meeting including thin-film photovoltaic module optical attenuation test methods; three working groups were set up to draft these four PV standards. James Amano, senior director of SEMI Standards, updated the group on the latest standards development in other regions including North America, Europe, Japan and Taiwan.

SEMI China International Market Series
SEMI China organized a series of events for China members to explore the international market and help them find more business opportunities on the global platform. Events included China Night during Intersolar Munich, China Night during SEMICON West, China-U.S. pan-semiconductor forum (held with CASPA, CAISS, SICA and NACSA in Santa Clara), and a China delegation to PV Taiwan. China pan-semiconductor players gathered at these events, building connections and providing an opportunity for domestic China players to gain access to international markets, meet potentials buyers and suppliers, optimizing their business scope.

EHS Updates for PV

  • Intersolar North America Seminar: Presented on the PV Production Hall Stage at Intersolar North America, this SEMI seminar addressed EHS hazards and solutions in PV manufacturing. A roundtable panel followed, which addressed how SEMI can assist the industry in better managing EHS risks.
  • SEMICON West Regulatory Seminar: SEMI hosted a technical seminar at SEMICON West to discuss regulatory impacts to members involved in PV manufacturing. Topics included the U.S. Conflict Minerals Legislation, U.S. EPA Green House Gas Regulation, the State of California Nano-Materials Regulations, and the Globally Harmonized System (GHS) of chemical hazard classification.
SEMI International Standards Update for Photovoltaics

Published new PV standards:
  • SEMI PV35-0912: PV Automation: Dec. 4084A: New Standard: Specification for Horizontal Communication between Equipment for Photovoltaic Fabrication System
  • SEMI PV 38-0912: Test Method for Mechanical Vibration of C-Si Cells in Shipping Environment
  • SEMI PV36-0912: Specifications for Hydrogen Peroxide, Used in Photovoltaic Applications
  • SEMI PV37-0912: Guide for Fluorine (F2), Used in Photovoltaic Applications
  • SEMI PV38-0912: Test Method for Mechanical Vibration of C-Si PV Cells in Shipping Environment
  • New PV SNARFs:
  • PV Silicon Raw Materials: Doc. 5438 for New Standard: Test Method for the Measurement of Oxygen Concentration in PV Silicon Materials by Inert Gas Fusion Infrared Detection Method
  • PV Silicon Raw Materials: Doc. 5394 for New Standard: Test Method for QSS Microwave PCD Measurements of Carrier Decay and Lifetime
  • PV Silicon Raw Materials: Silicon Thin-Film PV Module Task Force: Doc. #5477 for New Standard: Test Method for Determining B, P, Fe, Al, Ca Contents in Silicon Powder for PV Applications by Inductively-Coupled-Plasma Optical Emission Spectrometry
  • Silicon Thin-Film PV Module: Doc. #5478 for New Standard: Test method for Thin-film Silicon PV Modules Light Soaking
  • Anti-Reflective Coated Glass: Doc. #5475 for New Standard: Specification for Anti-Reflective Coated Glass, Used in Crystalline Silicon Photovoltaic Modules
  • New PV Task Forces Formed:
  • PV Silicon Raw Materials Task Force
  • Anti-Reflective Coated Glass Task Force

  • SEMI Highlights Semiconductors Photovoltaic Emerging Markets SEMI Events

    Tom Morrow The Emerging Markets Report (for Quarter 3)
    By Tom Morrow, EVP, Emerging Markets Business Unit and CMO, SEMI

    Highlights of the third quarter were successful emerging market programs at SEMICON West and SEMICON Taiwan. Both events met their financial objectives in exhibit sales and featured strong, comprehensive conference programs that achieved "sell out" or near "sell out" capacity.

    We continue to make Standards progress in serving the LED industry. Wafer geometry standards went to ballot and received no rejections. Final standards acceptance will be determined after a review by the International Standards Committee in November. SEMI also continues to advocate for supportive government policies that advance solid state lighting.

    We are also pleased to report that SEMI membership by companies involved primarily in emerging and adjacent markets has increased by 25% since February of this year, confirming the value of initiatives and placing the Business Unit on track to achieving our membership goals for the years.

    Other third quarter Emerging Market Business Unit accomplishments are summarized below. I hope that you'll review them, and let me know if you have suggestions or questions (

    Quarter 3 (Jul-Sep 2012) Emerging Markets Accomplishments

    SEMI Meets with DOE on Solid State Lighting Policy
    A delegation of SEMI members and other stakeholders in LED manufacturing met with the U.S. Department of Energy (DOE) Assistant Secretary of Energy David Danielson and his senior staff in August to advocate for increased support for R&D and manufacturing in solid state lighting (SSL). The group based their arguments on the significantly higher return-on-investment (ROI) from government funding demonstrated by LED-based solid state lighting over renewable energy sources and other energy investments. Also emphasized was the strong bipartisan and bicameral support from both the U.S. House and Senate for solid state lighting, a fact under-appreciated in this era of austerity and reduced funding expectations.

    SEMI Opto/LED Fab Forecast Predicts Slow Down
    Following a 37% spending increase for LED fab equipment from 2010 to 2011 (from $1,891 to $2,594 million), LED fab investments are expected to slow to $2,007 million in 2012 and $1,986 million in 2013.

    MEMS Developments and Trends Converge in Taiwan
    SEMICON Taiwan 2012, held September 5-7, featured Taiwan MEMS suppliers and global MEMS elites -- including Asia Pacific Microsystems, Freescale, InvenSense, and STMicroelectronics -- who discussed innovation in MEMS design, manufacture, packaging, testing and equipment. The MEMS Pavilion, organized by SEMI and ITRI and co-organized by the Nanotechnology and Micro System Association, featured Asia Pacific Microsystems, Ardic Instruments and Keyence, among others, and displayed advanced MEMS technology and solutions. To strengthen industry-academic collaboration, SEMI organized a University MEMS Research area showcasing the latest from academic institutions. In addition, over 420 people attended the MEMS Forum was co-hosted by Min-Shyong Lin, of Asia Pacific Microsystems, Chih-Kung Lee of the Institute for Information Industry, and Robert Tsai of TSMC MEMS Program. It featured speakers from InvenSense, Freescale Semiconductor and Tong Hsing Electronic Industries.

    LED Programs at SEMICON Taiwan 2012
    SEMICON Taiwan featured numerous LED programs. The LED Taiwan exhibition area included companies such as AIXTRON, Toson, United Crystal Technologies, Evans Analytical Group and other leading suppliers. The University LED Research area aimed to facilitate the cooperation between universities and the LED industry. At the LED Forum themed "Future Steps in Solid State Lighting," attendance topped 340 professionals, who listened to speakers from TSMC Solid State Lighting, Genesis Photonics, Huga Optotech, and Nichia Taiwan. In addition, over 100 attended the SSL Automation Technology Workshop which featured speakers from Veeco Taiwan, C Sun Mfg, and Wire Technology. At the Innovative Technology Center, eight LED sessions attracted 2,224 attendees and covered topics such as: lithography, materials, sapphire, and OLED.

    SEMICON West 2012: LED, MEMS, and Printed Electronics Events
    At SEMICON West 2012, the "Extreme Electronics" platform featured: In HB-LED,over 540 attendees listened to presentations by Cree, Everlight, Seoul Semiconductor, Soraa, Canaccord Genuity, Lunera Lighting, and other leaders. In cooperation with the MEMS Industry Group, the July 10 MEMS event, "Taking MEMS to the Next Level: Transitioning to a Profitable High-Volume Business" session featured leading experts; over 200 attended. More than 100 MEMS professionals attended the July 12 "MEMS and Sensors Packaging" session which featured speakers from Yole, STMicroelectronics, Intel and more. In Plastic Electronics, about 200 attended the July 12 "Bringing Disruptive Flexible and Organic Materials into Volume Electronics Manufacturing" session. Presentations included speakers from: Applied Materials, DisplaySearch, imec, Panasonic and more. Over 60 attended the July 11 "Metal Oxide TFT Devices and Technology" workshop hosted by FlexTech Alliance.

    EHS Update for Emerging Markets
    • SEMICON West Regulatory Seminar: SEMI hosted a technical seminar at SEMICON West to discuss regulatory impacts to members involved in LED manufacturing. Topics included the U.S. Conflict Minerals Legislation, U.S. EPA Green House Gas Regulation, the State of California Nano-Materials Regulations, and the Globally Harmonized System (GHS) of chemical hazard classification.
    • SEMICON Taiwan LED Seminar: SEMI hosted a technical seminar at SEMICON Taiwan focusing on EHS issues. Several presentations addressed EHS hazards and solutions for LED manufacturing, including those relevant to equipment and materials suppliers in the industry.
    High-Brightness LED Standards: New SNARFs
    • New Standard (SNARF): Mechanical Interface Specification for 150 mm HB-LED Load Port [#5468]
    • New Standard (SNARF): Specification for High Brightness LED Manufacturing Equipment Communication Interface (HB-LED ECI) [#5469]
    Flat Panel Display Standards: New Standards
    • Metrology: Published SEMI D68-0512: Test Methods for Optical Properties of Electronic Paper Displays
    • Ballot Review Approval: 4764B New Standard: Test Method of FPD-based Stereoscopic Display with Active Glasses

    SEMI Highlights Semiconductors Photovoltaic Emerging Markets SEMI Events

    Upcoming SEMI Events

    • Nov 4-7: Int'l Technology Partners Conference (ITPC) 2012 (Maui, HI)
    • Nov 8: SEMI Pacific Northwest Dinner Forum (Portland, OR)
    • Nov 8: Korea Information & Control Technical Committee Meeting (Seoul, Korea)
    • Nov 14: Japan PV Materials Committee Meeting (Tokyo, Japan)
    • Dec 4: Japan Liquid Chemicals Committee Meeting (Chiba, Japan)
    • Dec 5: Japan Gases & Facilities Committee Meeting Chiba, Japan)
    • Dec 5-7: PV Japan 2012 (Chiba, Japan)
    • Dec 5-7: SEMICON Japan (Chiba, Japan)
    • Dec 6: Japan Packaging Committee Meeting (Chiba, Japan)
    • Dec 7: Japan Information & Control Committee Meeting (Chiba, Japan)
    • Dec 7: Japan EHS Committee Meeting (Chiba, Japan)
    • Dec 11: Japan Micropatterning Committee Meeting (Tokyo, Japan)
    • Dec 21: Taiwan PV Standards Comittee Meeting (Hsinchu, Taiwan)
    • Jan 13-16: Industry Strategy Symposium (ISS) U.S. (Half Moon Bay, CA)
    • Jan 22-23: European 3D TSV Summit (Grenoble, France)
    • Jan 30-Feb 1: SEMICON Korea 2013 (Seoul, Korea)
    • Jan 30-Feb 1: LED Korea 2013 (Seoul, Korea)
    • Feb 24-26: ISS Europe 2013 (Milan, Italy)
    • Mar 10-12: 7th PV Fab Managers Forum 2013 (Berlin, Germany)
    • Mar 19-21: SEMICON China 2013 (Shanghai, China)
    • Mar 19-21: FPD China 2013 (Shanghai, China)
    • Mar 19-21: SOLARCON China 2013 (Shanghai, China)
    • May 7-9: SEMICON Siingapore 2013 (Marina Bay Sands, Singapore)
    • May 14-16: ASMC 2013 (Saratoga Springs, NY)
    • Jun 5-6: SEMICON Russia 2013 (Moscow, Russia)
    • Jun 19-21: Intersolar Europe 2013 PV Prod & Tech (Munich, Germany)
    For links and a full list of events, click here.

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