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Welcome to the SEMI Quarterly Report to Members

Stan Myers Dear SEMI Members,

This will be my last contribution to the Quarterly Report to Members as president and CEO of SEMI. As you probably know, earlier this year I announced my retirement after leading the organization for the past 15 years. Next month, Denny McGuirk will succeed me as president and CEO. I will continue to serve SEMI into the next year (who knows, maybe even longer) and assist Denny with the transition.

After many years as president of IPC, the Association Connecting Electronics Industries, Denny brings strong experience in running a global association, including outstanding achievements in international standards, events, and high-tech industry advocacy. We are very fortunate to have his leadership.

Fortunately for Denny, and our members, the CEO transition will be made significantly easier through the strong foundation work that occurs through SEMI regions worldwide. The strength of any organization is based in large part on the proximity and local responsiveness to its customers. I want to thank all the SEMI regional advisory boards, special interest groups, and the many volunteer committees that help make SEMI effective for all their contributions and support to the industry. I would also like to thank SEMI regional presidents and their staffs for reaching new highs in member satisfaction and member service this year, according to our annual Member Satisfaction Survey. I am happy to report that SEMI is strong and well positioned for the future.

Thank you very much for your support to the industry, to SEMI, and to me over the years. I am very confident that our success in driving the electronics revolution will continue for many years to come.

Regards,
Stan Myers
President and CEO
SEMI


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Quarter 3 (July-September 2011) Global SEMI Accomplishments

Dennis P. McGuirk Named President and CEO of SEMI
Dennis "Denny" P. McGuirk joins SEMI as the new president and CEO in early November. McGuirk served for 12 years as the president and CEO of IPC, a global trade association which serves 3,000 member companies involved in printed board design and manufacture, electronics assembly and test. Prior to IPC, McGuirk held executive positions in the National Fluid Power Association and the National Rifle Association of America. He served for 24 years in the U.S. Air Force. McGuirk graduated from the U.S. Air Force Academy with a Bachelor's degree in Western European Affairs. He also has a Master's degree in Public Administration from the University of Colorado.

Doug Neugold Named SEMI Chairman; Miller and Tong Elected to SEMI Board
Douglas A. Neugold, chairman, CEO and president, ATMI, Inc., was appointed to the position of chairman of the SEMI International Board of Directors. Neugold succeeds Rick Wallace, president and CEO of KLA-Tencor Corporation, who served as SEMI chairman for the past year. David B. Miller, president, DuPont Electronics & Communications, and Ho-Ming Tong, chief R&D officer and general manager, ASE Group, were newly elected to the association board. In addition, the SEMI executive committee appointed André-Jacques Auberton-Hervé, president, CEO and chairman of the Board at Soitec, to the position of vice-chairman of the Board.

SEMI Member Satisfaction Survey Guides Continuous Improvement
Results from the annual SEMI Customer Satisfaction Survey show member satisfaction remaining above 90%, comparable to last year when overall satisfaction with SEMI rose 22% (as measured by the percentage of members rating SEMI performance Acceptable and Above Acceptable). Overall satisfaction with SEMI among members rose to 93% in the latest survey, improving in nearly all regions. This is the seventh year that SEMI has analyzed member and customer satisfaction with an annual survey. Feedback was collected from a total of 1,169 people including 785 members, resulting in a 6.3% response rate and a 2.2% margin of error with 95% confidence. The survey was conducted in English, Japanese, Korean, and both simplified and traditional Chinese.

SEMI Foundation/High Tech U Update
The SEMI Foundation delivered its 120th SEMI High Tech U (HTU) program. The New York State program was sponsored by: Applied Materials, GlobalFoundries, Hudson Valley Community College/TECSMART, NY State Union of Teachers (NYSUT), Rensselaer Polytechnic, and Tokyo Electron (partial list). Also in New York, the first HTU program hosted by Corning Incorporated was held in Corning, with a record enrollment of 34 participants-- 500 years of teaching experience in one room. The first HTU Korea took place in Seoul, sponsored by Advantest Korea, Amkor Technology Korea, Applied Materials, ASML Korea, Edwards Korea, Ehwa Diamond Industrial, Hynix Semiconductor, Jusung Engineering, KC Tech, and Wonik IPS. The academic host was Korea University.




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Jonathan Davis The Semiconductor Report (for Quarter 3)
By Jonathan Davis, president, Semiconductor Business Unit

In the past three months, tens of thousands of industry participants acquired valuable connections and critical insights at key SEMICON events in Europe, Taiwan and the U.S. Among the most followed subjects were developments in 3D-IC, 450mm and materials solutions for the advanced devices.

After years of road-mapping, discussion and planning, coordinated R&D efforts to enable the manufacturing of semiconductors on larger 450mm silicon wafers has recently become more clearly articulated.

A "standing-room-only" SEMICON West 450 Wafer Transition Forum featured lively and sometimes disparate executive viewpoints from Lam Research, KLA-Tencor, GLOBALFOUNDRIES, Intel, imec and market research firm Gartner. Panelists from throughout the supply chain grappled with the numerous issues, including concerns that the industry needs a clear and coordinated process for planning that takes an innovative look at new funding models. Uncertainty with EUV rollout was referenced several times and reinforced the need for more transparency in planning and funding.

Following SEMICON West, the industry took notice of the significant announcements emanating from New York about state and industry funding for the newly formed Global 450 Consortium (G450C). The consortium includes five IC manufacturers, (GLOBALFOUNDRIES, IBM, Intel, Samsung and TSMC), working within the R&D framework of the State University of New York (SUNY) Albany College of Nanoscale Science and Engineering (CNSE).

Details of the consortium will be further revealed at the upcoming SEMI International Trade Partners Conference in early November. Executives at ITPC will enjoy a Global 450 Consortium Executive Update, to be presented by long-time ITRS Roadmap and 450 advocate Dr. Paolo Gargini. The timely and focused project status report will provide greater clarity for suppliers and is followed by a panel of industry experts to further shed light on the significant and evolving 450 transition. At the time of this writing, another well-attended 450 program is one of the major events occurring at SEMICON Europa.

In addition, many critical elements need coordination for affordable high-volume 450 manufacturing to occur. Fortunately, key stakeholders have continued to work on standards and specifications necessary to support 450 R&D. By end of the quarter, the SEMI International Standards effort boasts seven published Standards with active development underway in 10 Task Forces on other 13 standards documents.

The 450 landscape is evolving rapidly and consequently touches many SEMI activities. Yet, this is just one of the many industry concerns addressed by SEMI in past quarter. The Semiconductor Business Unit Quarter 3 accomplishments are summarized below. I hope that you'll review them, and let me know if you have suggestions or questions (jdavis@semi.org).





Quarter 3 (July-Sept 2011) Semiconductor Accomplishments

SEMICON Taiwan 2011
SEMICON Taiwan 2011 was held September 7-9 with total verified attendance at 29,963 (a 23% increase over 2010) with 594 companies exhibiting (1,200 booths). Program attendance stood at 2,950 this year (up 69% from 2010). The exhibition featured a CEO Forum which included Walden Rhines from Mentor Graphics, Luc Van den hove from IMEC, Eric Yu from Applied Materials, and S.Y. Chiang from TSMC. The exhibition also boasted several country pavilions, plus technology pavilions for LED, MEMS, Green Management, and Secondary Equipment.

SiP Global Summit at SEMICON Taiwan
System-in-a-Package (SiP) technology is now critical for many applications. This year, SEMICON Taiwan (September 7-9) launched the "SiP Global Summit 2011" with three forums: 3D-IC Technology, 3D-IC Test and Embedded Substrates. Over 25 CTOs and industry leaders from around the world shared their experiences and perspectives. The Summit was supported by ASE, IMEC, ITRI, KYEC, SPIL and other global leading companies. It was the largest dedicated international forum for industry experts in the semiconductor packaging and testing field.

SEMI Korea Members Day 2011
SEMI Members' Day was held successfully at COEX, Seoul on September 22. The event was specially designed to provide market information and networking opportunities for SEMI Member firms. With more 200 attendees, it featured three sessions of semiconductor, PV and OLED focused industry analysis and market forecasts, presented by iSuppli, Solar and Energy and UBI Sanup Research respectively. SEMI members displayed a high level of interest in the 3D-IC technology session by Besang Inc.

SEMICON West 2011
SEMICON West 2011 was held July 12-14 in San Francisco, Calif. Total attendance stood at 30,985 (19,170 visitors plus exhibitors), a 5% increase over 2010. In addition, 704 exhibitors participated, an increase of 19% over 2010. International attendees accounted for 14% of all visitors. The SEMICON West 2011 technical agenda addressed key microelectronics manufacturing issues and technologies, including 3D-IC, 450mm, test, new device architectures, EUV, high-brightness LEDs, MEMS, power devices, and flexible electronics.

Secondary Equipment & Applications Group
At SEMICON West 2011, the Secondary Equipment, Services & Technology Group (SESTG) changed its name to the Secondary Equipment & Applications (SEA) to simplify the name and to reflect that a wide portfolio of services support the innovations taking place. Today, SEA chapters are underway in China, Japan and North America -- and plans are underway for Europe, Korea and Southeast Asia chapters. Members of the SEA special interest group cover the spectrum with participants from IDMs, foundries, OEMs, refurbishers, finance, brokers and other service providers.

Standards Events Organized with the Korea Semiconductor Industry Association
On July 6-7, SEMI and the Korea Semiconductor Industry Association held the annual two-day Semiconductor Safety Tutorial. About 50 people attended. On September 22, a Standards Seminar was held. The seminar offered two sessions: EHS and Equipment Software; about 80 people attended each session.

450mm Standards Development
A ballot was approved in July 2011 that would add specifications for 450 mm diameter polished silicon wafers to SEMI M1, Specification for Polished Single crystal Silicon Wafers. This addition will be incorporated in SEMI M1-0611 by October 2011. In other 450mm wafer-related activity, the International Process Module Physical Interface Task Force was chartered to address standardization of physical interface and other interoperability related specification for the 450mm (vacuum) process modules and transfer module of the cluster tool. The task force was approved at the last North America Physical Interfaces & Carriers (PI & C) Technical Committee meeting held at SEMICON West 2011. A new Auxiliary Document for 450mm SEMI Standards Overview was also developed in the global PI & C Committee, approved at SEMICON West, and will be published soon.

Other International Standards
International Standards had a busy third quarter and results include:
  • Safety: A New Safety Guideline, Safety Guideline for Robots and Load Ports Intended for Use in Semiconductor Manufacturing Equipment (Doc. 3560M), passed technical committee and procedural reviews, and will be published in October 2011.
  • 3D-IC: At SEMICON West 2011, SEMI approved the formation of a Taiwan 3DS-IC Standards Committee. In addition, the SEMI North America 3DS-IC Committee approved two new activities under its Inspection & Metrology Task Force: "Guide for Terminology for Measured Geometrical Parameters of Through-Silicon Vias (TSVs) in 3DS-IC Structures" and "Guide for Measuring Voids in Bonded Wafer Stacks."
  • Packaging: A new standard, Specification for 300mm Wafer Coin-Stack Type Shipping Container used for Test and Packaging Processes (SEMI G90-0811), was developed and published by the Assembly & Packaging Task Force under the Japan Packaging Committe).
  • Standards Training: A seminar on "SEMI Software Standards GEM300" was held on September 1 at SEMI in Japan drawing 60 attendees.
SEMI Recognizes Dr. Morris Chang for EHS Leadership
Dr. Morris Chang, chairman and CEO of TSMC, is the recipient of the SEMI Akira Inoue Award for outstanding achievement in environment, health and safety (EHS) in the semiconductor industry. Over 500 industry leaders from around the world gathered to honor him as he accepted the award at the SEMICON Taiwan 2011 CEO Forum in Taipei on September 7.

SEMI Comments on Challenging Export Control Proposal
SEMI has submitted detailed comments and recommendations on a comprehensive export reform initiative to the Commerce Department. SEMI also presented at a government-industry Regulations and Procedures Technical Advisory Committee meeting. We will continue discussions with key officials on this and other export control priorities.

SEMI Promoting Intellectual Property Rights
SEMI presented industry intellectual property (IP) priorities to the World Semiconductor Council IP Task Force on September 27. SEMI provided an overview of the IP challenges faced by our member companies and our activities to promote greater IP protection and enforcement. We look forward to an ongoing dialogue with this group.

EHS Update
The SEMI RoHS Working Group met with members of the European government in Brussels in order to alter proposed waste electronic and electrical equipment (WEEE) regulations. SEMI co-authored a letter signed by multiple industry associations in Europe to members of the European government in order to alter proposed enforcement of EU REACH regulations by some member states. SEMI co-hosted a webinar on risk management of TMAH (Tetramethylammonium Hydroxide) used in semiconductor manufacturing.

SEMI Industry Research and Statistics
  • Book-to-Bill*: June 2011: US$ 1.54 billion in orders; book-to-bill ratio of 0.94 (final); July 2011: $1.30 billion in orders; book-to-bill ratio of 0.85 (final); August 2011: $1.18 billion in orders; book-to-bill ratio of 0.80 (prelim).
  • Semiconductor Equipment Sales: In September, the SEMI World Fab Forecast indicated that capital expenditure will increase to US$ 41.1 billion in 2011, the highest on record. Although 2012 spending will decline, the total for 2012 may still be the second highest on record.
  • Mid-year Consensus Forecast: In July, SEMI projected 2011 semiconductor equipment sales to reach US$ 44.3 billion according to the mid-year edition of the SEMI Capital Equipment Forecast.
  • Worldwide Semiconductor Equipment Billings: Worldwide semiconductor manufacturing equipment billings reached $11.92 billion in the second quarter of 2011. The billings figure is 1% percent lower than Q1 2011 and 31% higher than the same quarter a year ago. The data is gathered jointly with the SEAJ from over 100 global equipment companies that provide data on a monthly basis.
  • Worldwide Silicon: According to the SEMI Silicon Manufacturers Group (SMG), total silicon wafer area shipments were 2,392 million square inches during Q2, a 4.6% increase from the 2,287 million sq. in. shipped during the previous quarter. New quarterly total area shipments are 1.1% greater than Q2 2010 shipments.
*Book-to-Bill: a ratio of 3-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers; note that the June 2011 Book-to-Bill final numbers were reported in July, etc.


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Bettina Weiss The Photovoltaics Report (for Quarter 3)
By Bettina Weiss, executive director, PV Group

Our third quarter was marked by several major events and developments. July's highlight was naturally Intersolar North America--which was co-located for the fourth year with SEMICON West in San Francisco. With over 19,000 visitors from 80 countries, this year's exposition and conference has become the "place to be" for the entire solar supply chain. Our second annual North American PV Fab Managers Forum focused on thin film technologies, CdTe and CIGS in particular, where Dan Armbrust, CEO of SEMATECH, announced the new PV Manufacturing Consortium (PVMC) in Albany, NY, which is funded as part of the PVMI/SunShot Initiative. One PVMC objective is the creation of a CIGS technology roadmap, and SEMI, we are happy to note, was selected as the Standards Development Organization of choice for any resulting standardization activity in thin film.

In China, a new PV Standards Working Group, the precursor to a formal technical committee, was formed with representatives from just about all top-tier Chinese manufacturers. China's step towards integration into the SEMI International Standards Program is a very important milestone for our industry-driven standardization efforts, which will benefit in turn from the infusion of technical expertise and additional volunteer experts. Also in July, the number of SEMI Standards for the PV industry increased to 19 including new standards for silicon feedstock with contributions from major suppliers during the development phase.

I reported last quarter about the internationalization of the International Technology Roadmap for PV (ITRPV). As we speak, the CTM (Crystalline Cell Technology and Manufacturing) Group is preparing the next Roadmap edition, and non-European manufacturers who are now part of this effort have committed to delivering input. Several new European manufacturers (cell and module) are also included, moving towards vertical integration of silicon suppliers and wafer. The next edition will be presented at the 6th EU PV Fab Managers Forum in March 2012 in Berlin.

Lastly, I wanted to alert you to a new PV product: On September 21, we released the first Worldwide PV Equipment Market Statistics Report, which reports worldwide PV equipment billings and bookings data on a quarterly basis. It is the only PV equipment book-to-bill report based on direct inputs from PV equipment suppliers. The PV data collection program is also open to new participants. Contact Melody Song at msong@semi.org for more information.

Time is flying by, and we are getting ready for another 3 major events this year - PV Taiwan, SOLARCON India and PVJapan. Check back next quarter for more information - or better yet, come exhibit or attend!



Quarter 3 (July-Sept 2011) Photovoltaic Accomplishments

SEMI Releases Worldwide Photovoltaic Equipment Market Statistics Report
The Worldwide Photovoltaic Equipment Market Statistics Report is now available by subscription. Worldwide PV manufacturing equipment billings reached $2.03 billion for Q2 2011. Billings increased 17% quarter-over-quarter, after declining 19% in Q1 2011. Worldwide bookings are down 18% from the previous quarter to $1.79 billion. For the first time in the past six quarters, the book-to-bill ratio dipped below parity to 0.88.

SEMI International Standards Update for PV
  • Silicon Feedstock: SEMI announced a new standard to specify silicon feedstock for PV manufacturing. SEMI PV17-0611 covers virgin silicon feedstock materials produced by chemical vapor deposition (CVD) processes, metallurgical refining processes, or other processes. This is the 19th standard facilitated by SEMI for the PV industry.
  • PV Connector Ribbons: Published in August, after two years of effort, two new Standards establish a Guide for Specifying a Photovoltaic Connector Ribbon (SEMI PV18-0811and SEMI and a Guide for Testing Photovoltaic Connector Ribbon Characteristics (SEMI PV19-0811).
  • North America PV Materials Committee: The SEMI North America PV Materials Standards Committee (charter) was formed on July 14 during the meetings at Intersolar North America. Japan formed a PV Materials Standards Committee in December 2010, and a European Committee is expected to form later this year. China is also involved in PV standards activities. The committees will address the growing activity level in standards development for the PV materials market. Nineteen SEMI PV Standards have been published, with another ten pending procedural review.
  • China PV Standards: More and more China PV companies are joining the SEMI International Standards Program and will play an important role in creating PV standards. Perhaps most importantly, Chinese companies are now initiating new standard activities at SEMI. Suntech recently submitted a SNARF (standards proposal) for a new standard activity to develop a specification for anti-reflective coating glass, which is used in crystalline silicon PV modules. This is the first SEMI Standards development proposal ever issued from a Chinese company.
Intersolar North America 2011
Over 19,100 registered visitors representing about 80 countries attended Intersolar 2011 which was held on July 12-14 in San Francisco. The event had 834 solar exhibitors. At the Intersolar conference, 220 speakers presented to more than 1,600 attendees who participated in the 30 sessions. The SEMI PV Group once again held a solar PV public policy session as part of Intersolar North America. SEMI PV Group and the International Solar Energy Society (ISES) joined forces at SEMICON West/Intersolar 2011 to explore how the PV industry can collectively address cost savings, efficiency gains and increased EHS-related benefits. With the goal of continued growth and maturity in worldwide PV markets, industry experts from CNSE, Hemlock, ISES, NREL, Oerlikon Solar, SEMI PV Group, SVTC, and Trina Solar presented.

2nd North America Fab Managers Forum
The North American PV Fab Managers Forum on July 11 at SEMICON West explored opportunities and challenges in thin-film manufacturing. Over 125 attendees heard perspectives from CIGS and CdTe manufacturers, as well as equipment and materials suppliers on cost drivers, supply chain bottlenecks and other critical factors that impact manufacturing efficiency and module cost.

SEMI Submits Letter to U.S. House Appropriations Committee on Energy Spending
SEMI submitted a letter to the U.S. House of Representatives Committee on Appropriations with concerns over the Energy and Water Appropriations Act of 2012 (H.R. 2354). With deep cuts proposed to both the Energy Department's Office of Science and the Energy Efficiency and Renewable Energy (EERE), this bill is $1 billion below the FY2011 enacted legislation and $5.9 billion below President Obama's FY2012 request. SEMI is urging Congress to support funding for solar PV programs.




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Tom Morrow The Emerging Markets Report (for Quarter 3)
By Tom Morrow, EVP, Emerging Markets Business Unit and CMO, SEMI

Projections for the dramatic growth in the general solid state lighting market depend on major cost reductions-- perhaps as much as 20X improvement in $/klm at the packaged LED level. That's only going to be possible by moving to larger size wafers and scaling to automated high-volume production with tightly controlled processes for high yields. Experience in the semiconductor and other industries shows that industry-wide manufacturing standards are essential for high quality, volume LED production.

I am happy to report that significant progress has been made in SEMI LED standards that will enable these cost reduction goals and provide a platform to support a global manufacturing base focused on reduced cost, high quality and engineering innovation. At SEMICON West, further input and refinement of a 6" sapphire wafer standard and key factory automation interface (hardware and software) standards were conducted. At SEMICON Taiwan, this standards work was enhanced through meetings with key manufacturers in this key region. Further international outreach efforts on our LED standards are continuing for the remainder of the year.

SEMI members and others in the LED industry are also benefiting from the Opto/LED Fab Watch and Forecast that is providing valuable, fab-by-fab information on capacity investments currently being impacted by the slowdown in LCD back-lighting demand.

In addition to LEDs, at SEMICON West and Taiwan, comprehensive programs were held on MEMS-- targeted at manufacturing issues necessary to further scale the industry to benefit members and the industry.



Quarter 3 (July-Sept 2011) Emerging Markets Accomplishments

SEMI Releases China LED Fab Industry Report
SEMI released a new report, the China LED Fab Industry Report, which provides a comprehensive summary on the rapidly-growing China LED industry, including the latest data on capital and equipment spending, fab capacity, and sales rankings of Chinese LED manufacturers. The report also includes an update on the subsidy incentives for China fab projects, updates on new LED fab projects, an overview of Chinese sapphire wafer suppliers, and company profiles of the leading Chinese manufacturers.

SEMI Announces Formation of India SSL Special Interest Group
SEMI India announced the formation of a Special Interest Group on high-brightness light-emitting diodes (HB-LEDs) and solid state lighting (SSL). The new SEMI SSL Special Interest Group in India will focus on materials, equipment and manufacturing issues to further promote the industry-- through cost reduction, quality improvement, supply chain development, and industry promotion.

SEMICON Taiwan LED and MEMS Events
At SEMICON Taiwan, there were several emerging markets platforms:
  • HB-LED: The LED Technology Forum featured speakers from Aixtron, Epistar, Lextar Electronics, Lite-On Tech, Wellypower and Yole Developpement.
  • MEMS: Co-organized by SEMI and ITRI, the MEMS Forum at SEMICON Taiwan featured numerous MEMS industry experts, including presenters from EVG, Domintech, Freescale, Micralyne, Multitest Elecktronicische, STMicroelectronics, SUSS MicroTech and TSMC.
SEMICON West 2011 LED, MEMS, and Printed Electronics Events
At SEMICON West 2011, the "Extreme Electronics" platform featured:
  • HB-LED: Over 200 attendees listened to presentations including George Craford of Philips Lumileds and Bill Quinn of Veeco and others.
  • MEMS: In cooperation with the MEMS Industry Group, the MEMS session hosted over 200 attendees. The event featured speakers from Bosch, CEA-Leti, Fraunhofer, Globalfoundries, imec, National Instruments, Teledyne DALSA Semiconductor, and more.
  • Printed Electronics: Over 200 attended this session which was presented in cooperation with Flextech Alliance. Presentations included speakers from: NanoMarkets, NovaCentrix, Nth Degree Technologies, Solarmer Energy, Thin Film Electronics, Western Michigan University, and Xenon.
SEMI China FPD Industry Summer Gathering
The SEMI China FPD Industry Summer Gathering was held in Shengyang, Liaoning Province on July 3-4, concurrently with SEMI Shenyang Member Day. It has accelerated the communications between the SEMI members and local government through a variety of activities including a round-table forum, fab tour, golf tournament and VIP dinner.

International Standards Update for High-Brightness LEDs
Three HB-LED Standards Task Forces met at SEMICON West 2011:
  • Wafer Task Force: The group formalized its development of a Specification for 150mm Diameter Sapphire Wafers for HB-LED Applications with the submission of a SNARF (#5265) that was reviewed and approved by the HB-LED technical committee. The group discussed 19 properties for the 150mm sapphire wafer specification. A ballot proposal is expected early 2012.
  • Equipment Automation Task Force: The Hardware Working Group identified open cassette, shipping cassette, and load port as the first set of automation components to standardize with preliminary assumptions made on wafer thickness/warp, end effector and lift clearances.
  • Software Working Group: The group has reviewed and identified relevant SEMI Communications Standards and identified several functional requirements for software interface in HB-LED. To continue gathering industry input, a survey will be deployed in Fall 2011 on HB-LED automation requirements.
International Standards Update for FPD and MEMS
Major activities included MEMS and flat-panel display (FPD):
  • MEMS: SEMI MS9-0611, Specification for High Density Permanent Connections between Microfluidic Devices published
  • FPD: A new standard, Measurement Method for Depolarization Effect of FPD Color Filter (SEMI D63-0811), was developed and published by the Japan FPD Materials & Components Committee. In addition, the Korea FPD Metrology Committee developed and published a new standard, Test Method for Measuring the Spatial Contrast Ratio of Flat Panel Displays (SEMI D64-0811).



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Upcoming SEMI Events

2011
  • Oct 10-13: Europe Fall 2011 Standards Meetings (Dresden, Germany)
  • Oct 11-13: SEMICON Europa 2011 (Dresden, Germany)
  • Oct 11-13: Printed Electronics 2011 (Dresden, Germany)
  • Oct 12: Korea FPD Metrology TC meeting (Seoul, Korea)
  • Oct 14: Japan Liquid Chemicals Committee Meeting (Tokyo, Japan)
  • Oct 24-26: SEMI Tutorial: LED Technology Education Program (Seoul, Korea)
  • Oct 24-27: NA Standards Fall 2011 Meetings (San Jose/Santa Clara, Calif)
  • Oct 28: FPD Materials & Components/Metrology Joint Meeting (Tokyo, Japan)
  • Nov 1: Japan Traceability Committee Meeting (Tokyo, Japan)
  • Nov 2: SEMI Austin Annual Industry Outlook Forum (Austin, Texas)
  • Nov 6-9: International Trade Partners Conference (Big Island, Hawaii)
  • Nov 9-11: SOLARCON India 2011 (Hyderabad, India)
  • Nov 25: Japan Packaging Committee Meeting (Tokyo, Japan)
  • Dec 5-7: PV Japan 2011 (Tokyo, Japan)
  • Dec 7-9: SEMICON Japan 2011 (Tokyo, Japan)
  • Dec 15: Japan Micropatterning Committee Meeting (Tokyo, Japan)
2012
  • Jan 15-18: ISS (U.S.) 2012; with SMC (Half Moon Bay, California)
  • Feb 7-9: SEMICON Korea/LED Korea 2012 (Seoul, Korea)
  • Feb 26-28: ISS Europe 2012 (Munich, Germany)
For links and a full list of events, click here.

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