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Volume 11, Issue 2
From the Director's Desk
James Amano, Senior Director
While the concept of smart manufacturing is receiving increased attention in recent times, the SEMI Standards Program has for many years been developing the fundamental standards that enable today’s highly adaptive, self-diagnosing, and interoperable fabs. Read More

The Building Information Modeling (BIM) for Semiconductor Capital Equipment Task Force, part of the North America (NA) Facilities Technical Committee Chapter, was formed to gather input from equipment suppliers to create a common format for BIM software. Read More

For the past year, SEMI, working jointly with the MEMS & Sensors Industry Group (MSIG), has facilitated a joint task force that has been exploring industry challenges that span both semiconductor and MEMS/sensors manufacturing. Read More

The SEMI China HB-LED Standards TC Chapter meeting was held in Xuzhou, Jiangsu on April 21st, 2016. Read More

The SEMI China PV Standards TC Chapter Spring meeting was held in Shanghai, on March 15th, 2016, in conjunction with SEMICON China 2016. Read More

Three EHS ballots were issued in cycle 5-2016 for technical review at the SEMICON West Standards meetings in San Francisco, CA on July 12-14, 2016. Read More

The SEMI Europe Standards Awards will be presented during SEMICON Europa (October 25-27, 2016) in Grenoble, France). Award winners will be recognized for their contribution to the industry and the SEMI International Standards program. Read More

SEMI Standards is pleased to announce new staff members. Read More


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