Call for Papers
SEMICON West 2015
Due: March 20, 2015
FROM SEMI SOUTHEAST ASIA
SEMICON Southeast Asia: Strong Support
I am happy to say that the inaugural SEMICON Southeast Asia show, scheduled for April 22-24 in Penang, Malaysia, is receiving overwhelming and encouraging response. We enjoy strong support for the show from almost all government agencies in Malaysia.
This year's show amplifies the rich ecosystem that we have in the Southeast Asia and certainly reflects the enthusiasm and confidence in the outlook of the industry in 2015.
Kai Fai Ng
Bonding Wire Transition Marches On
By Dr. Dan Tracy, Industry Research & Statistics, SEMI
A particularly dramatic change in materials has been observed over the past seven years as companies sought to reduce the impact of gold metal costs in semiconductor packaging.
Predicting the 3D Integration Market is Tricky Business
By Francoise von Trapp, 3D InCites
During this year's European 3D TSV Summit it became obvious that predicting exactly when the 3D integration market is going to take hold is a tricky business because there are many elements to consider.
China Market Continues to Defy Global Trends with Projected Double-Digit Growth
The continued pace of growth in China presents opportunities and challenges across the supply chain as China adds capacity and invests in building a supplier base.
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SEMI Advocacy Update-EU Funding Call on Micro-/nano-electronic Technologies and Brokerage Event
By Rania Georgoutsakou, Public Policy, SEMI Europe
Upcoming event targets academia and industry. It will foster the creation of consortia for the upcoming ICT-25-2015 call in 3 areas.
Korea IC Manufacturing Fueled by Memory and Mobility
With the backdrop of Korea as a pacesetter in the industry in memory and DRAM, SEMICON Korea 2015 opens this week with an optimistic outlook for 2015 and longer term growth.
Glass Carrier Wafers and Through Glass Via Developments in SEMI 3DS-IC Standards
With eleven SEMI Standards published to date, several global 3D-IC standardization efforts are underway from bonded wafer stack metrology to glass carrier wafers.
State of the Union Address Highlights Multiple Opportunities for Bipartisan Cooperation on SEMI Public Policy Priorities
By Jamie Girard, Public Policy, SEMI Americas
Goals that are shared by SEMI members including expansion of free trade, corporate tax reform, support for basic science research and development and others are supported by multiple policy goals.
Changes and Challenges Abound in Multi-patterning Lithography
By Jeff Dorsch, Semiconductor Manufacturing and Design
Multi-patterning lithography is a fact of life for many chipmakers. Experts in the fields of electronic design automation and lithography address the issues associated with the technology.
Two Companies Honored with SEMI Award
The SEMI Award honors Terry Brewer of Brewer Science for revolutionizing optical lithography with anti-reflective coatings; and Jason Chang and Tien Wu of ASE for relentlessly pursuing the commercialization of copper wire bonds when gold was the industry standard.
New Edition of the ITRPV to be Released
The addition of new co-chairs (Motech and Neo Solar Power) from Taiwan increases representation of global PV manufacturing supply chain stakeholders in the ITRPV Working Group. The report is scheduled to be released in Q2.
Presentations Available at SEMI "Members Only"
Selected SEMI Strategic Materials Conference (SMC) and International Technology Partners Conference (ITPC) presentations are available on SEMI "Members Only." Learn more.