SEMI® Global Update - February 2015
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SEMI Global Update
IN THIS ISSUE
ISS Europe 2015 to Address Opportunities and Hot Issues for 2015
Bonding Wire Transition Marches On
Predicting the 3D Integration Market is Tricky Business
China Market Continues to Defy Global Trends with Projected Double-Digit Growth
SEMI Advocacy Update-EU Funding Call on Micro-/nano-electronic Tech and Brokerage Event
Korea IC Manufacturing Fueled by Memory and Mobility
Glass Carrier Wafers and Through Glass Via Developments in SEMI 3DS-IC Standards
State of the Union Address Highlights Multiple Opp for Bipartisan Coop on SEMI Public Policy Priorities
Changes and Challenges Abound in Multi-patterning Lithography
Two Companies Honored with SEMI Award
New Edition of the ITRPV to be Released
Presentations Available at SEMI "Members Only"
Event Calendar

EUROPE
February 22-24
ISS Europe 2015
March 11-12
CS International Conf
ASIA
February 4-6
SEMICON Korea 2015
LED Korea 2015
March 17-19
SEMICON China 2015
FPD China 2015
March 25-28
LED Taiwan 2015
April 22-24
SEMICON Southeast Asia
NORTH AMERICA
February 23-26
2015 FLEX Conference
March 12
Northeast Forum
March 20
Silicon Valley Forum
March 26
SEMI Prof Dev Seminar
March 30-April 2
NA Standards Spring Mtgs
Apr 17
Arizona Forum
Call for Papers

SEMICON West 2015
Due: March 20, 2015



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Intersolar Europe





FROM THE SEMI EUROPE PRESIDENT

ISS Europe 2015 to Address Opportunities and Hot Issues for 2015

Heinz Kundert, SEMI Europe PresidentThe challenges in 2015 will be the extremely high investment into mainstream going from 14nm device architecture to 10nm and below, and traditional equipment makers will profit from the slower than expected introduction of EUV which still struggles with throughput. Traditional lithography is expected to dominate and multi-patterning will require additional deposition and etch tools for multipass. The 450mm wafer size transition slowed down in 2014 and we will not see high-volume production lines before 2020.

Navigate through these and many more issues throughout the year starting with the Industry Strategy Symposium (ISS) Europe 2015 on February 22-24 in Amsterdam. Participate in this and other events this year and be the first to learn vital information to shape your strategy and to build your business.

(Read More)

Heinz Kundert
www.semi.org/europe


ISS Europe 2015

Bonding Wire Transition Marches On

By Dr. Dan Tracy, Industry Research & Statistics, SEMI

A particularly dramatic change in materials has been observed over the past seven years as companies sought to reduce the impact of gold metal costs in semiconductor packaging.


Predicting the 3D Integration Market is Tricky Business

By Francoise von Trapp, 3D InCites
During this year's European 3D TSV Summit it became obvious that predicting exactly when the 3D integration market is going to take hold is a tricky business because there are many elements to consider.


China Market Continues to Defy Global Trends with Projected Double-Digit Growth

The continued pace of growth in China presents opportunities and challenges across the supply chain as China adds capacity and invests in building a supplier base.


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SEMI Advocacy Update-EU Funding Call on Micro-/nano-electronic Technologies and Brokerage Event
By Rania Georgoutsakou, Public Policy, SEMI Europe
Upcoming event targets academia and industry. It will foster the creation of consortia for the upcoming ICT-25-2015 call in 3 areas.


Korea IC Manufacturing Fueled by Memory and Mobility

With the backdrop of Korea as a pacesetter in the industry in memory and DRAM, SEMICON Korea 2015 opens this week with an optimistic outlook for 2015 and longer term growth.


Glass Carrier Wafers and Through Glass Via Developments in SEMI 3DS-IC Standards

With eleven SEMI Standards published to date, several global 3D-IC standardization efforts are underway from bonded wafer stack metrology to glass carrier wafers.


SEMICON Russia

State of the Union Address Highlights Multiple Opportunities for Bipartisan Cooperation on SEMI Public Policy Priorities

By Jamie Girard, Public Policy, SEMI Americas
Goals that are shared by SEMI members including expansion of free trade, corporate tax reform, support for basic science research and development and others are supported by multiple policy goals.


Changes and Challenges Abound in Multi-patterning Lithography

By Jeff Dorsch, Semiconductor Manufacturing and Design
Multi-patterning lithography is a fact of life for many chipmakers. Experts in the fields of electronic design automation and lithography address the issues associated with the technology.


Two Companies Honored with SEMI Award

The SEMI Award honors Terry Brewer of Brewer Science for revolutionizing optical lithography with anti-reflective coatings; and Jason Chang and Tien Wu of ASE for relentlessly pursuing the commercialization of copper wire bonds when gold was the industry standard.


ASMC

New Edition of the ITRPV to be Released

The addition of new co-chairs (Motech and Neo Solar Power) from Taiwan increases representation of global PV manufacturing supply chain stakeholders in the ITRPV Working Group. The report is scheduled to be released in Q2.


Presentations Available at SEMI "Members Only"

Selected SEMI Strategic Materials Conference (SMC) and International Technology Partners Conference (ITPC) presentations are available on SEMI "Members Only." Learn more.


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Beat Mueller
Content Manager, SEMI Europe
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Tel: 32.2.609.5334; Fax: 32.2.416.6448; Email: semieurope@semi.org
Website: www.semi.org/europe