SEMI® Global Update ♦ August 2011 IN THIS ISSUE Strong 2011 Equipment Market Forecast Complicated by Buying "Pause" Executive Summit: Industry Leaders See a Promising but Challenging Future Doug Neugold Named SEMI Chairman 3D-IC Opens New Era of IC Packaging and Testing Transistor Evolution Drives Wide-Ranging Research Stanley Myers Receives IMEC Lifetime Achievement Award Vertical 3D NAND Possible by 2013-2014 Asia's Share of PV Cell Production to Reach 85% in 2011 Congressional Update: Dead-locked Debt Fight Overshadows Priorities SEMI CALENDAR ASIA September 7-9 SEMICON Taiwan September 15-17 China International Silicon Conference & Photovoltaic Industrial Development Forum EUROPE October 10-13 Europe Fall 2011 Standards Meetings October 11-13 SEMICON Europa October 11-13 PE2011 - Conference and Exhibition NORTH AMERICA August 25 Silicon Valley Lunch Forum September 28 SEMI Northeast Forum - Succeeding in Solar Classes October 12-14 Fundamentals of Product Marketing October 19-21 Principles of Selling to the Semiconductor Industry Call for Papers ASMC 2012 Deadline: October 24 Strong 2011 Equipment Market Forecast Complicated by Buying "Pause" By Dan Tracy, SEMI Industry Research & Statistics During SEMICON West, the mid-year edition of the SEMI Capital Equipment Forecast was released that estimates 2011 semiconductor equipment sales to reach $44.33 billion, a 12.1 percent increase over 2011. Executive Summit: Industry Leaders See a Promising but Challenging Future While aligning the economics of new production technologies is not fully worked out, the insatiable appetite for semiconductors by a growing middle-class promises a bright future for the semiconductor supply chain, according to a panel of equipment and materials industry executives. Doug Neugold Named SEMI Chairman On July 11, SEMI announced the results of its annual elections, including the appointment of Douglas A. Neugold, chairman, CEO and president, ATMI, Inc., to the position of chairman of the industry association's International BOD. Advertisement 3D-IC Opens New Era of IC Packaging and Testing ITRI recently forecasted that the production value of 3D-ICs for mobile phone applications will hit US$ 3.65 billion by 2015. With the growing popularity of mobile devices, manufacturers put more focus on heterogeneous integration through SiP to enhance user experience. Transistor Evolution Drives Wide-Ranging Research By Balaji Chandrasekaran, Applied Materials, Inc. For the 22nm node and beyond, devices will incorporate 3D transistor architectures and an even wider range of new materials to sustain Moore's Law, posing challenges that are driving wide-ranging research on new process capabilities for transistor fabrication. Stanley Myers Receives IMEC Lifetime Achievement Award At SEMICON West on July 11, SEMI president and CEO Stanley T. Myers received the imec Lifetime Achievement Award to honor his work as the long-time executive director and visionary of SEMI. Advertisement Subscribe to the IEEE Microelectronics Alert The IEEE Microelectronics Alert delivers updates on the latest news and applications in microelectronics technologies from the IEEE Spectrum Online Semiconductor Channel. Subscribe today! Vertical 3D NAND Possible by 2013-2014 By David Lammers, SemiMD The advent of 3D NAND memories may be only two or three years away. By 2013 the major memory companies developing 3D NAND may be ready with pilot lines, moving to volume production a year or so later. Asia's Share of PV Cell Production to Reach 85% in 2011 While nearly 80% of PV modules were produced in Asia in 2010, IMS Research estimates that Asia's share of PV cell production will reach nearly 85% by the end of 2011. Congressional Update: Debt Fight Overshadows Priorities Our industry's spending priorities face tough challenges in getting funding in the current sour budget environment. SEMI is working hard in Washington to urge lawmakers to support vital programs. Gain insights from the CEO Forum Learn about Advanced Packaging and Advanced Testing Visit Pavilions: Cross Strait, Green Management, MEMS, Secondary Market LED Taiwan Exhibition, plus the 3-day SiP Global Summit Thank you for reading this newsletter. We hope that you find SEMI Global Update informative and relevant. Let us know if we can improve the content and quality of SEMI Global Update. Please send your ideas, comments and suggestions to: Deborah Geiger Content Manager, SEMI 3081 Zanker Road, San Jose, California, 95134 Tel: 1.408.943.6900; Fax: 1.408.428.9600; Email: marketingservices@semi.org Website: www.semi.org Subscribe ¦ Unsubscribe Copyright © Semiconductor Equipment and Materials International (SEMI), all rights reserved